# US 9,520,542 B2 · Light emitting device and method for producing same

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- Number: US 9,520,542 B2
- Document ID: US9520542B2
- Status: Granted
- Kind: B2
- Application number: 14/753,043
- Filed: 2015-06-29
- Published: 2015-10-22
- Granted: 2016-12-13
- Earliest claimed: 2008-06-25
- Assignees: Sharp Kabushiki Kaisha
- Applicants: Sharp Kabushiki Kaisha
- Inventors: Yasuji Tanenaka; Masashi Takemoto; Nobuaki Aoki
- Web page: https://patentgrep.com/patent/US9520542B2

## CPC

- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10H 20/84: Coatings, e.g. passivation layers or antireflective coatings
- H10H 20/8506: {Containers}
- H10H 20/8512: {Wavelength conversion materials}
- H10H 29/142: {Two-dimensional arrangements, e.g. asymmetric LED layout}
- H10H 20/854: characterised by their material, e.g. epoxy or silicone resins
- H10H 20/856: Reflecting means
- H10W 72/01515: {Forming coatings}
- H10W 72/075: {of bond wires}
- H10W 72/5522: {comprising gold [Au]}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

There is provided a light emitting device highly resistant to the environment, and having good heat resistance, light resistance and gas barrier property, and a method for producing same. With the light emitting device, a substrate 2 and interconnect patterns 5A, 5B formed on the surface thereof are covered with an acrylic resin primer 10 having better gas barrier property than a silicone resin sealing resin part 3. Light resistance is ensured by the silicone resin sealing resin portion 3 and the gas barrier property can be ensured by the acrylic resin primer 10.

## Claims

### Claim 1

A light emitting device comprising:
a substrate;
a metal portion formed on the substrate;
an insulating layer which covers at least part of the metal portion;
an LED chip mounted on the insulating layer;
and
a sealing resin portion which covers at least part of the insulating layer to seal the LED chip,
wherein the insulating layer is made from a material which is higher in gas barrier property than the sealing resin portion, and
wherein the insulating layer covers a top surface and outer side surfaces in a lateral direction of the metal portion.

### Claim 2 (depends on 1)

The light emitting device as claimed in claim 1, wherein a top surface of the metal portion covered with the insulating layer is flat.

### Claim 3 (depends on 2)

The light emitting device as claimed in claim 2, wherein a top surface of the insulating layer is flat, the top surface of the metal portion being covered with the insulating layer.

### Claim 4 (depends on 1)

The light emitting device as claim in claim 1, further comprising: an interconnect pattern which is provided on the insulating layer and which is electrically connected to the LED chip.

### Claim 5 (depends on 1)

The light emitting device as claimed in claim 1, wherein the metal portion is narrower in a lateral direction than the substrate so that there are distances in the lateral direction between side surfaces of the metal portion and side surfaces of the substrate.

### Claim 6 (depends on 1)

The light emitting device as claimed in claim 1, wherein the sealing resin portion is in close contact with a surface of at least part of the insulating layer.

### Claim 7 (depends on 1)

The light emitting device as claimed in claim 1, wherein the sealing resin portion contains a fluorophor.

### Claim 8 (depends on 1)

A back light source for general lighting use or TV use including the light emitting device as claimed in claim 1.

### Claim 9 (depends on 1)

The light emitting device as claimed in claim 1, wherein the insulating layer lies between the metal portion and the LED chip.