# US 9,520,539 B2 · Optoelectronic component and method for the production thereof

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- Number: US 9,520,539 B2
- Document ID: US9520539B2
- Status: Granted
- Kind: B2
- Application number: 14/784,879
- Filed: 2014-04-04
- Published: 2016-03-03
- Granted: 2016-12-13
- Earliest claimed: 2013-04-17
- Assignees: OSRAM Opto Semiconductor GmbH
- Applicants: OSRAM Opto Semiconductors GmbH
- Inventors: Martin Brandl; Michael Zitzlsperger
- Web page: https://patentgrep.com/patent/US9520539B2

## CPC

- H10H 20/8506: {Containers}
- H10H 20/854: characterised by their material, e.g. epoxy or silicone resins
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10H 20/036: {of packages}
- H10H 20/0362: {of encapsulations}
- H10H 20/0364: {of interconnections}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

An optoelectronic component includes a plastics housing, wherein a first leadframe section is embedded into the plastics housing, a chip landing face and a soldering contact face of the first leadframe section are at least partly not covered by the plastics housing, the soldering contact face has a groove, and the groove is not covered by the material of the plastics housing.

## Claims

### Claim 1

An optoelectronic component comprising:
a plastics housing,
wherein a first leadframe section is embedded into the plastics housing,
a chip landing face and a soldering contact face of the first leadframe section are at least partly not covered by the plastics housing,
the soldering contact face has a groove,
the groove is not covered by the material of the plastics housing, and
the groove extends circumferentially around a central region of the soldering contact face at least in sections.

### Claim 2 (depends on 1)

The optoelectronic component as claimed in claim 1, wherein the groove is arranged in an edge region of the soldering contact face.

### Claim 3

The optoelectronic component as claimed in 1, wherein the groove has a depth of 10 μm to 1 mm.

### Claim 4

The optoelectronic component as claimed in 1, wherein an optoelectronic semiconductor chip is arranged on the chip landing face.

### Claim 5

The optoelectronic component as claimed in 1,
wherein the plastics housing has a cavity adjoining the chip landing face, and
a potting material is arranged in the cavity.

### Claim 6

The optoelectronic component as claimed in 5, wherein the potting material comprises silicone.

### Claim 7

The optoelectronic component as claimed in 1,
wherein a second leadframe section is embedded into the plastics housing, and
an upper face and a lower face of the second leadframe section are at least partly not covered by the plastics housing.

### Claim 8 (depends on 7)

The optoelectronic component as claimed in claim 7, wherein the lower face has a further groove.

### Claim 9

An optoelectronic component comprising:
a plastics housing,
wherein a first leadframe section is embedded into the plastics housing,
a chip landing face and a soldering contact face of the first leadframe section are at least partly not covered by the plastics housing,
the soldering contact face has a groove,
the groove is not covered by the material of the plastics housing,
the plastics housing has a cavity adjoining the chip landing face,
a potting material is arranged in the cavity,
the groove extends circumferentially around a central region of the soldering contact face at least in sections, and
the groove prevents wetting of the central region by the potting material.

### Claim 10 (depends on 9)

The optoelectronic component as claimed in claim 9, wherein the groove is arranged in an edge region of the soldering contact face.

### Claim 11

The optoelectronic component as claimed in 9, wherein the groove has a depth of 10 μm to 1 mm.

### Claim 12

The optoelectronic component as claimed in 9, wherein an optoelectronic semiconductor chip is arranged on the chip landing face.

### Claim 13

The optoelectronic component as claimed in 9,
wherein the plastics housing has a cavity adjoining the chip landing face, and
a potting material is arranged in the cavity.

### Claim 14

The optoelectronic component as claimed in 13, wherein the potting material comprises silicone.

### Claim 15

The optoelectronic component as claimed in 9,
wherein a second leadframe section is embedded into the plastics housing, and
an upper face and a lower face of the second leadframe section are at least partly not covered by the plastics housing.

### Claim 16 (depends on 15)

The optoelectronic component as claimed in claim 15, wherein the lower face has a further groove.