# US 9,520,461 B1 · Integrated circuit with lateral flux capacitor

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- Number: US 9,520,461 B1
- Document ID: US9520461B1
- Status: Granted
- Kind: B1
- Application number: 14/839,684
- Filed: 2015-08-28
- Granted: 2016-12-13
- Earliest claimed: 2015-08-28
- Assignees: Texas Instruments Incorporated
- Applicants: Texas Instruments Incorporated
- Inventors: Zhi-Qi Li
- Web page: https://patentgrep.com/patent/US9520461B1

## CPC

- H10D 1/714: {having horizontal extensions}
- H10D 1/042: {using deposition processes to form electrode extensions}
- H10W 20/42: Vias, e.g. via plugs
- H10W 20/496: {Capacitor integral with wiring layers}
- H10W 20/427: {Power or ground buses}
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An integrated circuit has a lateral flux capacitor assembly that includes a first metal layer having a capacitive portion with first and second lateral sides and first and second capacitive fingers, a first dummy metal lines portion positioned adjacent the first lateral side of the capacitive portion and a second dummy metal lines portion positioned adjacent the second lateral side of the capacitive portion. The first set of capacitive fingers is electrically connected to the first dummy metal lines portion and the second set of capacitive fingers is electrically connected to the second dummy metal lines portion. A method of making an integrated circuit assembly with a lateral flux capacitor includes electrically connecting a first plurality of capacitive fingers in a first metal layer to a first dummy metal lines portion of the first metal layer.

## Claims

### Claim 1

An integrated circuit comprising:
a lateral flux capacitor having:
an elongate capacitive portion having a lower metal layer with a first set of spaced apart capacitive fingers and an upper metal layer with a second set of spaced apart capacitive fingers positioned directly above corresponding ones of said first set of spaced apart capacitive fingers; and
first and second elongate dummy metal line portions positioned on opposite lateral sides of said elongate capacitive portion, said first elongate dummy metal line portion being electrically connected to a first pole of a power source and said first set of capacitive fingers and said second elongate dummy metal line portion being electrically connected to a second pole of a power source and said second set of capacitive fingers.

### Claim 2 (depends on 1)

The integrated circuit of claim 1, wherein the lateral flux capacitor further comprises:
a first laterally extending hand portion located in said lower layer connecting said first set of spaced apart capacitive fingers to said first elongate dummy metal line portion; and
a second laterally extending hand portion located in said upper layer and connecting said second set of spaced apart capacitive fingers to said second elongate dummy metal line portion.

### Claim 3 (depends on 2)

The integrated circuit of claim 2, wherein said lateral flux capacitor further comprises:
a third laterally extending hand portion located in said first layer and connecting a third set of spaced apart capacitive fingers to said second elongate dummy metal lines portion; and
a fourth laterally extending hand portion located in said second layer and connecting a fourth set of spaced apart capacitive fingers to said first elongate dummy metal lines portion, said third set of spaced apart capacitive fingers being positioned above corresponding ones of said fourth set of spaced apart capacitive fingers.

### Claim 4 (depends on 3)

The integrated circuit of claim 3, said first and third set of spaced apart capacitive fingers being interdigitated.

### Claim 5 (depends on 4)

The integrated circuit of claim 4, said first and second hand portions being positioned in partially overlapping relationship and said third and fourth hand portions being positioned in partially overlapping relationship.

### Claim 6 (depends on 5)

The integrated circuit of claim 5, said first and second elongate dummy metal lines portions and said elongate capacitive portion being substantially longitudinally coextensive and have laterally aligned first end portions and laterally aligned second end portions; and wherein said first hand portion is connected to said first end of said first elongate dummy metal line portion and said third hand portion is connected to said second end of said second elongate dummy metal line portion.

### Claim 7 (depends on 6)

The integrated circuit of claim 6 wherein said second hand portion is connected to said first end of said second elongate dummy metal line portion and said fourth hand portion is connected to said second end of said first dummy metal line portion.

### Claim 8 (depends on 7)

The integrated circuit of claim 7, said second and fourth sets of capacitive fingers being interdigitated.

### Claim 9 (depends on 1)

The integrated circuit of claim 1, said first and second elongate dummy metal lines portions and said elongate capacitive portion being substantially longitudinally coextensive.

### Claim 10 (depends on 1)

The integrated circuit of claim 1, said first and second elongate dummy metal lines portions each comprising an upper portion that is part of said upper metal layer and a lower portion that is part of said lower metal layer.

### Claim 11 (depends on 10)

The integrated circuit of claim 10, said upper and lower portions of said first dummy metal line portion being electrically connect by vias.

### Claim 12 (depends on 1)

The integrated circuit of claim 1, said first and second sets of capacitive fingers being separated by corresponding portions of an insulation layer.