# US 9,520,434 B2 · Image pickup module

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 9,520,434 B2
- Document ID: US9520434B2
- Status: Granted
- Kind: B2
- Application number: 14/504,644
- Filed: 2014-10-02
- Published: 2015-01-15
- Granted: 2016-12-13
- Earliest claimed: 2012-04-05
- Assignees: Olympus Corporation
- Applicants: Olympus Corporation
- Inventors: Masashi Yamada
- Web page: https://patentgrep.com/patent/US9520434B2

## CPC

- H10F 39/804: {Containers or encapsulations}
- H10F 39/806: {Optical elements or arrangements associated with the image sensors}
- H10F 39/811: {Interconnections}
- H10F 77/20: Electrodes
- A61B 1/0011: {Manufacturing of endoscope parts}
- A61B 1/05: characterised by the image sensor, e.g. camera, being in the distal end portion
- G03B 17/02: Bodies
- G03B 17/17: with reflectors arranged in beam forming the photographic image, e.g. for reducing dimensions of camera
- H04N 23/555: {for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes}
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- A61B: DIAGNOSIS; SURGERY; IDENTIFICATION (usefulness limited to only animals A61D)
- G03B: APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR (optical parts of such apparatus G02B; photosensitive materials or processes for photographic purposes G03C; apparatus for processing exposed photographic materials G03D)
- H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION

## Abstract

An image pickup module includes: an image pickup chip including a main surface on which a light-receiving portion of an image pickup device and a plurality of electrodes connected to the light-receiving portion are formed; and a wiring board including flying leads bonded to the respective plurality of electrodes.

## Claims

### Claim 1

An image pickup module comprising:
an image pickup chip including a main surface on which a light-receiving portion of an image pickup device and a plurality of electrodes connected to the light-receiving portion are formed;
a wiring board including flying leads bonded to the respective plurality of electrodes; and
a sealing portion that seals the flying leads;
wherein an electronic component is surface-mounted on the wiring board,
the sealing portion is formed by curing a liquid resin disposed between the optical component and the electronic component; and
the sealing portion is in contact with the electronic component.

### Claim 2 (depends on 1)

The image pickup module according to claim 1, wherein the flying leads are bonded to the electrodes by locally applying energy to distal end portions of the flying leads from an upper side of the distal end portions.

### Claim 3 (depends on 1)

The image pickup module according to claim 1, further comprising an optical component that changes a direction of incident light from a direction parallel to the main surface such that the incident light is incident on the light-receiving portion.

### Claim 4 (depends on 1)

The image pickup module according to claim 1, wherein an end surface of the image pickup chip and an end surface of the wiring board do not overlap each other, and
both surfaces of a distal end portion of the wiring board are sealed by the sealing portion formed by curing a liquid resin.

### Claim 5 (depends on 4)

The image pickup module according to claim 4, wherein the flying leads are bent.

### Claim 6 (depends on 3)

The image pickup module according to claim 3, wherein the image pickup chip includes, on the main surface thereof, electrodes whose distances from the end surface of the image pickup chip are different, and the wiring board includes flying leads having different lengths.

### Claim 7 (depends on 3)

The image pickup module according to claim 3, wherein the sealing portion is also in contact with the optical component.