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US 9,520,428 B2Granted
Image pickup apparatus
AssigneeOlympus Corporation
InventorNoriyuki Fujimori
Life of this patent
Estimating the term…
Abstract
An image pickup apparatus includes an image pickup device chip having a first primary surface on which an image pickup section, a circuit section and a guard ring are formed, the circuit section having a plurality of layers including an insulating layer that is made of a low dielectric constant material having a relative dielectric constant lower than silicon oxide, the guard ring being made of one or more materials selected from materials superior to the low dielectric constant material in humidity resistance; and a cover glass adhered to the first primary surface of the image pickup device chip.
Claims14
An image pickup apparatus comprising:
- an image pickup device chip having a first primary surface on which an image pickup section, a circuit section, electrode pads and a guard ring are formed, and a second primary surface on which junction terminals are formed, the circuit section transmitting and receiving a signal to and from the image pickup section and having a plurality of layers including an insulating layer that is made of a low dielectric constant material having a relative dielectric constant lower than silicon oxide, the electrode pads being connected with the circuit section, the guard ring enclosing the image pickup section, the circuit section and the electrode pads and being made of one or more materials selected from materials superior to the low dielectric constant material in humidity resistance, the junction terminals being connected with the electrode pads via through wirings;
- a transparent member adhered to the first primary surface of the image pickup device chip via a transparent adhesive layer and having the same dimensions as the image pickup device chip in a plan view;
- and
- a post ring disposed between an entire circumference of the guard ring and the transparent member and made of a material superior to a material of the guard ring in humidity resistance.
1 more element
An image pickup apparatus comprising:
- an image pickup device chip having a first primary surface on which an image pickup section, a circuit section, electrode pads and a guard ring are formed, and a second primary surface on which junction terminals are formed, the circuit section transmitting and receiving a signal to and from the image pickup section and having a plurality of layers including an insulating layer that is made of a low dielectric constant material having a relative dielectric constant lower than silicon oxide, the electrode pads being connected with the circuit section, the guard ring enclosing the image pickup section, the circuit section and the electrode pads and being made of a material superior to the low dielectric constant material in humidity resistance, the junction terminals being connected with the electrode pads via through wirings;
- and
- a transparent member that is adhered to the first primary surface of the image pickup device chip via a transparent adhesive layer, and covers at least a region inside an outer periphery of the guard ring.
An image pickup apparatus comprising:
- an image pickup device chip having a first primary surface on which an image pickup section, a circuit section, junction electrodes and a guard ring are formed, the circuit section transmitting and receiving a signal to and from the image pickup section and having a plurality of layers including an insulating layer that is made of a low dielectric constant material having a relative dielectric constant lower than silicon oxide, the junction electrodes being connected with the circuit section, the guard ring enclosing the image pickup section, the circuit section and the junction electrodes and being made of a material superior to the low dielectric constant material in humidity resistance;
- leads connected with the junction electrodes;
- a sealing member that seals junction portions between the junction electrodes and the leads;
- and
- a transparent member adhered to the first primary surface of the image pickup device chip via a transparent adhesive layer so as to cover a portion of the guard ring not covered by the sealing member.
2 more elements
An image pickup apparatus comprising:
- an image pickup device chip that has a rectangular shape in a plan view and has a first primary surface on which an image pickup section and a circuit section are formed, and a second primary surface on which junction terminals are formed, the circuit section transmitting and receiving a signal to and from the image pickup section and having a plurality of layers including an insulating layer that is made of a low dielectric constant material having a relative dielectric constant lower than silicon oxide, the junction terminals being connected with the circuit section via through wirings;
- a cover glass adhered to the first primary surface of the image pickup device chip and having the same dimensions as the image pickup device chip in a plan view;
- a shield case in which the image pickup device chip is housed, an inner wall of the shield case having a cross sectional shape formed by a curved line at a corner portion;
- and
- a sealing resin that fills a gap between a side surface of the image pickup device chip and the shield case, the sealing resin having thickness not greater than 100 μm except the corner portion.
2 more elements
Dependencies are inferred from the claim text.