# US 9,520,418 B2 · Active array substrate and manufacturing method thereof

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- Number: US 9,520,418 B2
- Document ID: US9520418B2
- Status: Granted
- Kind: B2
- Application number: 14/844,792
- Filed: 2015-09-03
- Published: 2015-12-31
- Granted: 2016-12-13
- Earliest claimed: 2013-05-24
- Assignees: Au Optronics Corporation
- Applicants: AU Optronics Corporation
- Inventors: Tsung-Ying Ke; Pin-Fan Wang; Tsi-Hsuan Hsu; Wei-Te Lee
- Web page: https://patentgrep.com/patent/US9520418B2

## CPC

- H10D 86/0214: {using temporary substrates}
- G03F 7/20: Exposure; Apparatus therefor (photographic printing apparatus for making copies G03B27/00)
- G03F 7/30: Imagewise removal using liquid means
- H10D 86/0212: {comprising manufacture, treatment or coating of substrates}
- H10D 86/411: {characterised by materials, geometry or structure of the substrates}
- H10D 86/421: {having a particular composition, shape or crystalline structure of the active layer}
- H10D 86/60: wherein the TFTs are in active matrices
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)

## Abstract

An active array substrate includes a flexible substrate, an inorganic barrier layer, and at least one active component. The inorganic barrier layer covers the flexible substrate. The inorganic barrier layer has a through hole therein. The through hole of the inorganic barrier layer exposes the flexible substrate. The active component is disposed on the inorganic barrier layer.

## Claims

### Claim 1

A manufacturing method of an active array substrate comprising:
forming a flexible substrate on a carrier with a photosensitive stripping layer therebetween;
forming an inorganic barrier layer to cover the flexible substrate;
forming at least one active component on the inorganic barrier layer;
forming a through hole in the inorganic barrier layer to expose the flexible substrate;
irradiating the photosensitive stripping layer with a light source; and
stripping the photosensitive stripping layer from the carrier.

### Claim 2 (depends on 1)

The manufacturing method of claim 1, wherein the step of forming the active component further comprises:
forming a gate electrode on the inorganic barrier layer;
forming a gate dielectric layer at least covering the gate electrode;
forming a channel layer on at least a portion of the gate dielectric layer that is on the gate electrode; and
forming a source and a drain on opposite sides of the channel layer.

### Claim 3 (depends on 2)

The manufacturing method of claim 2, further comprising:
forming a through hole in the gate dielectric layer, wherein the through hole of the gate dielectric layer is connected to the through hole of the inorganic barrier layer to form a gas hole which exposes the flexible substrate.

### Claim 4 (depends on 2)

The manufacturing method of claim 2, further comprising:
forming a through hole in the gate dielectric layer;
forming an inorganic protection layer to cover the active component, wherein the inorganic protection layer has at least one through hole therein, and wherein the through hole of the inorganic protection layer is connected to the through hole of the gate dielectric layer and the through hole of inorganic barrier layer to form a gas hole;
forming an organic protection layer on the inorganic protection layer; and
forming a pixel electrode on the organic protection layer, wherein the pixel electrode is electrically connected to the active component.

### Claim 5 (depends on 1)

The manufacturing method of claim 1, further comprising:
forming an inorganic protection layer to cover the active component, wherein the inorganic protection layer has at least one through hole therein, and wherein the through hole of the inorganic protection layer is connected to the through hole of the inorganic barrier layer to form a gas hole which exposes the flexible substrate.

### Claim 6 (depends on 1)

The manufacturing method of claim 1, further comprising:
forming an inorganic filling material in the through hole of the inorganic barrier layer.