# US 9,520,383 B2 · Light emitting device package and lighting system

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- Number: US 9,520,383 B2
- Document ID: US9520383B2
- Status: Granted
- Kind: B2
- Application number: 13/076,712
- Filed: 2011-03-31
- Published: 2011-09-01
- Granted: 2016-12-13
- Earliest claimed: 2010-04-01
- Assignees: LG Innotek Co., Ltd.
- Applicants: Kyong Jun Kim
- Inventors: Kyong Jun Kim
- Web page: https://patentgrep.com/patent/US9520383B2

## CPC

- H10W 90/00: Package configurations
- F21K 9/23: Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21Y 2105/10: comprising a two-dimensional [2D] array of point-like light-generating elements
- F21Y 2115/10: Light-emitting diodes [LED]
- H10H 20/858: Means for heat extraction or cooling
- H10W 90/753: {between laterally-adjacent chips}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

Disclosed is a light emitting device package and a lighting system. The light emitting device package includes a body, a first lead frame on the body, a plurality of light emitting diodes on the first lead frame, and a molding member on the light emitting diodes. The distance between the light emitting diodes includes a distance equal to or less than a length of a first side of a first light emitting diode of the light emitting diodes.

## Claims

### Claim 1

A light emitting device package, comprising:
a body;
a first lead frame on the body;
a second lead frame spaced apart from the first lead frame on the body;
a plurality of light emitting diodes on the first lead frame; and
a molding member on the plurality of light emitting diodes,
wherein the plurality of light emitting diodes includes a first light emitting diode and a second light emitting diode,
wherein the first and second light emitting diodes are spaced apart from each other,
wherein a first distance between the first light emitting diode and the second light emitting diode is a range of 200 μM to 300 μM and has a range of A1/4 to A1, wherein A1 is a length of a first side of the first light emitting diode,
wherein the first lead frame and the second lead frame are electrically connected to the plurality of the light emitting diodes,
wherein the molding member contacts the plurality of light emitting diodes,
wherein the plurality of light emitting diodes include one of a blue LED chip, a green LED chip, a red LED chip and a UV LED chip,
wherein the first lead frame has a thickness of range of about 0.1 mm to 0.5 mm,
wherein the body includes an upper portion thereof with a cavity having an open upper portion, and the first lead frame, the plurality of light emitting diodes, and the molding member are in the cavity,
wherein the light emitting diodes on the first lead frame are three or less, and
wherein the first distance between the first light emitting diode and the second light emitting diode decreases mutual interference by heat generated from the first and second light emitting diodes.

### Claim 2 (depends on 1)

The light emitting device package of claim 1, wherein the first side of the first light emitting diode and a second side of the second light emitting diode face each other, and
wherein the length of the first side is identical to a length of the second side.

### Claim 3 (depends on 2)

The light emitting device package of claim 2, wherein A1 has a shorter length than a length of a second side adjacent to the first side of the first light emitting diode and has a shorter length than a length of a first side adjacent to the second side of the second light emitting diode.

### Claim 4 (depends on 1)

The light emitting device package of claim 1, wherein the first side of the first light emitting diode has a length of at least 250 μm, and
wherein the first distance between the first light emitting diode and the second light emitting diode is less than the length of the first side of the first light emitting diode.

### Claim 5 (depends on 1)

The light emitting device package of claim 1, wherein the first light emitting diode has a different size as the second light emitting diode.

### Claim 6 (depends on 1)

The light emitting device package of claim 1, further comprising a third light emitting diode disposed on the second lead frame,
wherein the third light emitting diode is closer to the first light emitting diode than the second light emitting diode, and
wherein a second distance between the first light emitting diode and the third light emitting diode is greater than the first distance.

### Claim 7 (depends on 1)

The light emitting device package of claim 1, wherein the plurality of light emitting diodes includes a third light emitting diode disposed on the first lead frame,
wherein a distances among the first, second and third light emitting diodes are identical to each other, and
wherein the first light emitting diode has a smallest size of the plurality of light emitting diodes.

### Claim 8 (depends on 1)

The light emitting device package of claim 1, wherein the first side of the first light emitting diode has a length of 250 μm to 1200 μm, and
wherein the first side has a shorter length than a length of another side of the first light emitting diode.

### Claim 9 (depends on 1)

The light emitting device package of claim 1, wherein the first and second light emitting diodes is the blue LED chip and the molding member includes a phosphor,
wherein the first side of the first light emitting diode has a length of 250 μm to 1200 μm,
wherein the first side has a shorter length than a length of another side of the first light emitting diode,
wherein a surface of the cavity has a polygonal shape,
wherein each of the plurality of light emitting diodes includes a conductive support member, a light emitting structure having a plurality of semiconductor layers on the conductive support member, and an electrodes on the light emitting structure,
wherein the light emitting structure is disposed between the conductive support member and the electrode, and
wherein the first distance is a distance representing a temperature characteristic of heat emitted from the first and second light emitting diodes that is substantially identical to a thermal characteristic of heat emitted from one of the first light emitting diode and the second light emitting diode.

### Claim 10

A light emitting device package, comprising:
a body including a cavity having an open upper portion;
first and second lead frames in the cavity of the body;
a first light emitting diode on the first lead frame;
a second light emitting diode on the first lead frame, the second light emitting diode spaced apart from the first light emitting diode with a first distance;
an adhesive agent adhered between the first, second and third light emitting diodes and the first lead frame; and
a molding member covering the first and second light emitting diodes,
wherein the first lead frame and the second lead frame are electrically connected to the first and second light emitting diodes,
wherein the molding member is contacted with the plurality of light emitting diodes,
wherein the first and second light emitting diodes include one of a blue LED chip, a green LED chip, a red LED chip and a UV LED chip,
wherein the first light emitting diode has a first side having a first length and a second side having a second length shorter than the first length of the first side, and
wherein the first distance is a range of 200 μm to 300 μm and has a range of A1/4 to A1, wherein A1 is the second length of the second side of the first light emitting diode,
wherein the first lead frame has a thickness of range of about 0.1 mm to 0.5 mm,
wherein the light emitting diodes on the first lead frame are three or less,
wherein the first distance between the first light emitting diode and the second light emitting diode decreases mutual interference by heat generated from the first and second light emitting diodes, and
wherein the first distance is a distance representing a temperature characteristic of heat emitted from the first and second light emitting diodes that is substantially identical to a thermal characteristic of heat emitted from one of the first light emitting diode and the second light emitting diode.

### Claim 11 (depends on 10)

The light emitting device package of claim 10, wherein the first and second lead frames extend to a lateral surface and a lower surface of the body.

### Claim 12 (depends on 10)

The light emitting device package of claim 10, wherein the first length of the first side of the first light emitting diode is at least 250 μm.

### Claim 13 (depends on 10)

The light emitting device package of claim 10, wherein the first light emitting diode has a different size from a size of the second light emitting diode.

### Claim 14

A light emitting device package, comprising:
a body;
a first lead frame on the body;
a second lead frame spaced apart from the first lead frame on the body;
a plurality of light emitting diodes on the first lead frame;
an adhesive agent adhered between each of the plurality of light emitting diodes and the first lead frame; and
a molding member on the plurality of light emitting diodes,
wherein the plurality of light emitting diodes includes a first light emitting diode, a second light emitting diode and a third light emitting diode arranged in at least two rows,
wherein the first, second and third light emitting diodes are spaced apart from each other,
wherein the first and second light emitting diodes are disposed in a first row on the first lead frame,
wherein the third light emitting diode is disposed in a second row spaced apart from the first row on the first lead frame,
wherein a first distance between the first light emitting diode and the second light emitting diode has a range of A1/4 to A1, wherein A1 is a length of a first side of the first light emitting diode,
wherein a second distance between the first light emitting diode and the third light emitting diode is a same or different distance from the first distance,
wherein the first distance is a range of 250 μm±50 μm,
wherein the second distance is a range of 250 μm±50 μm,
wherein a third distance between the third light emitting diode and the second light emitting diode is about 250 μM±50 μm,
wherein the first lead frame and the second lead frame are electrically connected to the plurality of the light emitting diodes,
wherein the molding member contacts the plurality of light emitting diodes,
wherein the plurality of light emitting diodes include one of a blue LED chip, a green LED chip, a red LED chip and an UV LED chip, and
wherein A1 is a length of a short side of sides of the first light emitting diode,
wherein all of the light emitting diodes emit a light of the same color,
wherein the first lead frame has a thickness of range of about 0.1 mm to 0.5 mm,
wherein the body is formed of one of a silicon material, a ceramic material, and a resin material,
wherein the body includes an upper portion thereof with a cavity having an open upper portion, and the first lead frame, the plurality of light emitting diodes, and the molding member are in the cavity,
wherein the light emitting diodes on the first lead frame are three or less,
wherein the first distance between the first light emitting diode and the second light emitting diode decreases mutual interference by heat generated from the first and second light emitting diodes, and
wherein the first distance is a distance representing a temperature characteristic of heat emitted from the first and second light emitting diodes that is substantially identical to a thermal characteristic of heat emitted from one of the first light emitting diode and the second light emitting diode.

### Claim 15 (depends on 14)

The light emitting device package of claim 14, wherein a distances among the first, second and third light emitting diodes are identical to each other.

### Claim 16 (depends on 14)

The light emitting device package of claim 14, wherein the first side of the first light emitting diode has a length of at least 250 μm.

### Claim 17 (depends on 14)

The light emitting device package of claim 14, wherein the first, second and third light emitting diodes are the blue LED chip and the molding member includes a phosphor.

### Claim 18 (depends on 14)

The light emitting device package of claim 14, wherein the first light emitting diode has a different size from a size of the second light emitting diode.

### Claim 19 (depends on 14)

The light emitting device package of claim 14, wherein the first, second and third light emitting diodes have the same size, and wherein the first distance is different from the second distance.

### Claim 20 (depends on 14)

The light emitting device package of claim 14,
wherein the first side is a short side of the first light emitting diode, and
wherein the first and second light emitting diodes have a different size from each other.

### Claim 21 (depends on 14)

The light emitting device package of claim 14, wherein each of the plurality of light emitting diodes includes a conductive support member, a light emitting structure having a plurality of semiconductor layers on the conductive support member, and an electrodes on the light emitting structure, and
wherein the light emitting structure is disposed between the conductive support member and the electrode.