# US 9,520,337 B2 · Semiconductor module

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- Number: US 9,520,337 B2
- Document ID: US9520337B2
- Status: Granted
- Kind: B2
- Application number: 14/939,531
- Filed: 2015-11-12
- Published: 2016-03-03
- Granted: 2016-12-13
- Earliest claimed: 2013-10-29
- Assignees: Fuji Electric Co., Ltd.
- Applicants: Fuji Electric Co., Ltd.
- Inventors: Takafumi Yamada
- Web page: https://patentgrep.com/patent/US9520337B2

## CPC

- H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates}
- H10W 40/00: Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60)
- H10W 40/25: characterised by their materials
- H10W 40/47: by flowing liquids, e.g. forced water cooling
- H10W 40/778: {in encapsulations}
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/6875: {being on a metallic substrate, e.g. insulated metal substrates [IMS]}
- H10W 72/00: Interconnections or connectors in packages
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 74/131: {the semiconductor body being only partially enclosed}
- H10W 90/00: Package configurations
- H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs}
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A semiconductor module includes first and second semiconductor elements connected to pins, respectively; a first pin wiring substrate having first and second metal films bonded to the pin on the upper and lower surfaces; a first DCB substrate having third and fourth metal films on the upper and lower surfaces, the third metal film being bonded to the lower surface of the first semiconductor element; a second DCB substrate having fifth and sixth metal films respectively provided on the lower and upper surfaces, the fifth metal film being bonded to the upper surface of the second semiconductor element; a second pin wiring substrate having seventh and eighth metal films bonded to the pin, on the upper and lower surfaces; a connection member connected to the second and fifth metal films; a first cooler connected to the fourth metal film; and a second cooler connected to the sixth metal film.

## Claims

### Claim 1

A semiconductor module comprising:
a first semiconductor element;
a first pin electrically and thermally connected to an upper surface of the first semiconductor element;
a first pin wiring substrate including a first pin wiring insulating substrate, a first metal film disposed on a lower surface of the first pin wiring insulating substrate, and a second metal film disposed on an upper surface of the first pin wiring insulating substrate, the first metal film, the second metal film and the first pin being electrically bonded together;
a first direct copper bonding substrate including a first ceramic insulating substrate, a third metal film disposed on an upper surface of the first ceramic insulating substrate and bonded to a lower surface of the first semiconductor element, and a fourth metal film disposed on a lower surface of the first ceramic insulating substrate;
a second semiconductor element;
a second pin electrically and thermally connected to a lower surface of the second semiconductor element;
a second direct copper bonding substrate including a second ceramic insulating substrate, a fifth metal film disposed on a lower surface of the second ceramic insulating substrate and bonded to an upper surface of the second semiconductor element, and a sixth metal film disposed on an upper surface of the second ceramic insulating substrate;
a second pin wiring substrate including a second pin wiring insulating substrate, a seventh metal film disposed on an upper surface of the second pin wiring insulating substrate, and an eighth metal film disposed on a lower surface of the second pin wiring insulating substrate, the seventh metal film, the eighth metal film and the second pin being electrically bonded together;
a connection member having two ends electrically connected to the second metal film and the fifth metal film, respectively;
a first cooler thermally connected to the fourth metal film; and
a second cooler thermally connected to the sixth metal film.

### Claim 2 (depends on 1)

The semiconductor module according to claim 1, further comprising:
a first heat spreader disposed between the first semiconductor element and the third metal film to be electrically and thermally connected to the first semiconductor element and the third metal film, and
a second heat spreader disposed between the second semiconductor element and the fifth metal film to be electrically and thermally connected to the second semiconductor element and the fifth metal film.

### Claim 3 (depends on 2)

The semiconductor module according to claim 2, further comprising:
a third heat spreader disposed between the fourth metal film and the first cooler to be thermally connected to the fourth metal film and the first cooler, and
a fourth heat spreader disposed between the sixth metal film and the second cooler to be thermally connected to the sixth metal film and the second cooler.

### Claim 4 (depends on 1)

The semiconductor module according to claim 1, further comprising:
a terminal electrically connected to the first semiconductor element or the second semiconductor element, and extending between the first cooler and the second cooler to outside.

### Claim 5 (depends on 4)

The semiconductor module according to claim 4, further comprising a sealing resin sealing the semiconductor module except for a bonding surface between the first cooler and the fourth metal film of the first cooler in the semiconductor module, a bonding surface between the second cooler and the sixth metal film of the second cooler in the semiconductor module, and a region of the terminal extending to the outside.

### Claim 6 (depends on 4)

The semiconductor module according to claim 4, wherein the terminal extends to the outside of the semiconductor module in a direction parallel to one direction,
the first cooler includes a first cooling medium inlet for introducing a cooling medium and a first cooling medium outlet for discharging the cooling medium,
the second cooler includes a second cooling medium inlet for introducing a cooling medium and a second cooling medium outlet for discharging the cooling medium, and
the first cooling medium inlet, the first cooling medium outlet, the second cooling medium inlet, and the second cooling medium outlet extend in a direction perpendicular to an extending direction of the terminal to be separated from each other.

### Claim 7 (depends on 1)

A semiconductor module comprising:
a plurality of semiconductor module units each having, as a unit module, the semiconductor module according to claim 1,
wherein the plurality of semiconductor module units is arranged in a row so that a surface of each of the plurality of semiconductor module units from which the terminal does not protrude face each other.

### Claim 8 (depends on 7)

The semiconductor module according to claim 7, wherein each of the first cooler and the second cooler is integrated with the semiconductor module units to entirely cover two side surfaces of the row of the semiconductor module units.