# US 9,520,336 B1 · Hybrid assembly with improved thermal performance > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,520,336 B1 - Document ID: US9520336B1 - Status: Granted - Kind: B1 - Application number: 14/994,618 - Filed: 2016-01-13 - Granted: 2016-12-13 - Earliest claimed: 2015-08-27 - Assignees: Teledyne Scientific & Imaging, LLC - Applicants: Teledyne Scientific & Imaging, LLC - Inventors: Majid Zandian; Donald E. Cooper; Lisa L. Fischer; Victor Gil; Gerard Sullivan - Web page: https://patentgrep.com/patent/US9520336B1 ## CPC - H10W 40/258: {Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence)} - H10W 40/10: Arrangements for heating - H10W 40/228: {the projecting parts being wire-shaped or pin-shaped} - H10W 70/02: of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04) - H10W 90/00: Package configurations - H10W 90/752: {between stacked chips} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A method of improving the thermal performance of a hybrid assembly which comprises a first die, a second die, and indium bonds which bond and electrically interconnect the first die to the second die. A heat sink plate on which the hybrid assembly is to be mounted is provided. A plurality of indium bumps are deposited on the plate where the assembly is to be mounted. The bottom side of the hybrid assembly is then pressed onto the indium bumps to affix the assembly to the plate. The heat sink plate constrains the lateral coefficient of thermal expansion (CTE) of the second die such that the CTEs of the first and second dies match more closely than they would if the hybrid assembly was not mounted directly to a heat sink plate using indium bumps. The heat sink plate preferably comprises copper tungsten (CuW) or a diamond-metal composite. ## Claims ### Claim 1 A method of improving the thermal performance of a hybrid assembly, comprising: forming a hybrid assembly, comprising: a first die having an associated coefficient of thermal expansion (CTE); a second die having an associated CTE; and indium bonds which bond and electrically interconnect a top of said first die to a top of said second die, where the first die is mounted on top of the second die, a side of said second die opposite said first die being a bottom side of said hybrid assembly; providing a heat sink plate on which said hybrid assembly is to be mounted; depositing a plurality of indium bumps on said heat sink plate where said hybrid assembly is to be mounted; and pressing the bottom side of said hybrid assembly onto the indium bumps so as to affix said hybrid assembly to said heat sink plate; said heat sink plate constraining the lateral CTE of said second die such that the CTE of said first die and the CTE of said second die match more closely than they would if the bottom side of said hybrid assembly was not affixed to said heat sink plate using indium bumps. ### Claim 2 (depends on 1) The method of claim 1, further comprising wicking epoxy into gaps between said the hybrid assembly and the heat sink plate. ### Claim 3 (depends on 1) The method of claim 1, wherein said heat sink comprises CuW. ### Claim 4 (depends on 1) The method of claim 1, wherein said heat sink comprises a diamond-metal composite. ### Claim 5 (depends on 1) The method of claim 1, wherein said first die comprises GaSb or mercury cadmium telluride and said second die comprises silicon, said heat sink constraining the CTE of said silicon such that the CTE of said first die and the CTE of said second die match more closely than they would if the bottom side of said hybrid assembly was mounted on a silicon heat sink. ### Claim 6 (depends on 5) The method of claim 5, wherein said second die comprises a readout IC (ROIC) and said first die comprises a detector comprising an array of pixels. ### Claim 7 A method of improving the thermal performance of a hybrid assembly, comprising: forming a hybrid assembly, comprising: a first die; a second die; and indium bonds which bond and electrically interconnect a top of said first die to a top of said second die, where the first die is mounted on top of the second die, a side of said second die opposite said first die being a bottom side of said hybrid assembly; providing a heat sink plate on which said hybrid assembly is to be mounted; depositing a plurality of indium bumps on said heat sink plate where said hybrid assembly is to be mounted; and pressing the bottom side of said hybrid assembly onto the indium bumps so as to affix said hybrid assembly to said heat sink; wherein said first die comprises GaSb or mercury cadmium telluride and said second die comprises silicon, said heat sink constraining the lateral coefficient of thermal expansion (CTE) of said silicon such that the CTE of said first die and the CTE of said second die match more closely than they would if the bottom side of said hybrid assembly was mounted on a silicon heat sink plate; and wherein said second die comprises a read-in IC (RIIC) and said first die comprises an array of LEDs. ### Claim 8 A method of improving the thermal performance of a hybrid assembly, comprising: forming a hybrid assembly, comprising: a first die; a second die; and indium bonds which bond and electrically interconnect a top of said first die to a top of said second die, where the first die is mounted on top of the second die, a side of said second die opposite said first die being a bottom side of said hybrid assembly; providing a heat sink plate on which said hybrid assembly is to be mounted; depositing a plurality of indium bumps on said heat sink plate where said hybrid assembly is to be mounted; and pressing the bottom side of said hybrid assembly onto the indium bumps so as to affix said hybrid assembly to said heat sink plate; wherein a back side of said heat sink plate is in direct contact with a cryogenic coolant and said hybrid assembly and coolant are within a dewar. ### Claim 9 (depends on 1) The method of claim 1, wherein said first die is flip-chip mounted on top of the second die.