# US 9,520,314 B2 · High temperature electrostatic chuck bonding adhesive

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- Number: US 9,520,314 B2
- Document ID: US9520314B2
- Status: Granted
- Kind: B2
- Application number: 12/640,496
- Filed: 2009-12-17
- Published: 2010-06-24
- Granted: 2016-12-13
- Earliest claimed: 2008-12-19
- Assignees: Applied Materials, Inc.
- Applicants: Jennifer Y. Sun; Senh Thach; Ren-Guan Duan
- Inventors: Jennifer Y. Sun; Senh Thach; Ren-Guan Duan
- Web page: https://patentgrep.com/patent/US9520314B2

## CPC

- H10P 72/722: {Details of electrostatic chucks}
- C09D 183/04: Polysiloxanes
- C09J 11/04: inorganic
- C09J 183/04: Polysiloxanes
- H02N 13/00: Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
- H10P 72/72: using electrostatic chucks
- C08K 3/22: of metals
- C08K 3/28: Nitrogen-containing compounds
- C08K 2003/2227: {of aluminium}
- C08K 2003/282: {Binary compounds of nitrogen with aluminium}
- Y10T 279/23: with magnetic or electrostatic means
- Y10T 279/34: Accessory or component
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- H02N: ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

Methods and apparatus for bonding an electrostatic chuck to a component of a substrate support are provided herein. In some embodiments, an adhesive for bonding components of a substrate support may include a matrix of silicon-based polymeric material having a filler dispersed therein. The silicon based polymeric material may be a polydimethylsiloxane (PDMS) structure having a molecular weight with a low molecular weight (LMW) content Σ D3-D10 of less than about 500 ppm. In some embodiments, the filler may comprise between about 50 to about 70 percent by volume of the adhesive layer. In some embodiments, the filler may comprise particles of aluminum oxide (Al2O3), aluminum nitride (AlN), yttrium oxide (Y2O3), or combinations thereof. In some embodiments, the filler may comprise particles having a diameter of about 10 nanometers to about 10 microns.

## Claims

### Claim 1

A substrate support, comprising:
a base;
an adhesive layer comprising a matrix of silicon-based polymeric material having a filler dispersed therein, wherein the matrix is formed of a silicon-based polymeric material having a molecular weight with a low molecular weight (LMW) content Σ D3-D10 of less than about 500 ppm; and
an electrostatic chuck disposed atop the base and the adhesive layer, wherein the adhesive layer bonds the base and the electrostatic chuck.

### Claim 2 (depends on 1)

The substrate support of claim 1, wherein the base comprises one of aluminum, stainless steel, ceramic, or aluminum-ceramic composite.

### Claim 3 (depends on 1)

The substrate support of claim 1, further comprising:
a baffle assembly disposed proximate the base, wherein the baffle assembly is configured to hold one of a process kit or a process shield.

### Claim 4 (depends on 1)

The substrate support of claim 1, wherein the silicon-based polymeric material comprises a polydimethylsiloxane (PDMS) structure having a repeating dimethylsiloxane unit.

### Claim 5 (depends on 1)

The substrate support of claim 1, wherein the adhesive layer is about 0.004 to about 0.015 inches thick.

### Claim 6 (depends on 1)

The substrate support of claim 1, wherein the adhesive layer has a metal content of less than about 1 percent.

### Claim 7 (depends on 1)

The substrate support of claim 1, wherein the adhesive layer is substantially non-reactive with halogen containing chemistries.

### Claim 8 (depends on 1)

The substrate support of claim 1, wherein the adhesive layer is operable at a temperature of between about 120 degrees Celsius and about 180 degrees Celsius.

### Claim 9 (depends on 1)

The substrate support of claim 1, wherein the adhesive layer has a thermal conductivity of at least about 0.5 W/mK.

### Claim 10 (depends on 1)

The substrate support of claim 1, wherein the filler comprises between about 50 to about 70 percent by volume of the adhesive layer.

### Claim 11 (depends on 10)

The substrate support of claim 10, wherein the filler comprises particles of aluminum oxide (Al2O3), aluminum nitride (AlN), yttrium oxide (Y2O3), or combinations thereof.

### Claim 12 (depends on 10)

The substrate support of claim 10, wherein the filler comprises particles having a diameter of about 10 nanometers to about 10 microns.

### Claim 13

A method of bonding a substrate support to an electrostatic chuck, comprising:
depositing an adhesive layer comprising a matrix of silicon based polymeric material having a filler dispersed therein atop a substrate support base, wherein the silicon based polymeric matrix is formed of a polymeric material having a molecular weight with a low molecular weight (LMW) content Σ D3-D10 of less than about 500 ppm; and
bonding an electrostatic chuck to the substrate support base with the adhesive layer.

### Claim 14 (depends on 13)

The method of claim 13, wherein the silicon based polymeric material comprises a polydimethylsiloxane (PDMS) structure having a repeating dimethylsiloxane unit.

### Claim 15 (depends on 13)

The method of claim 13, wherein the filler comprises between about 50 to about 70 percent by volume of the adhesive layer.

### Claim 16 (depends on 15)

The method of claim 15, wherein the filler comprises particles of aluminum oxide (Al2O3), aluminum nitride (AlN), yttrium oxide (Y2O3), or combinations thereof.

### Claim 17 (depends on 15)

The method of claim 15, wherein the filler comprises particles having a diameter of about 10 nanometers to about 10 microns.

### Claim 18 (depends on 13)

The method of claim 13, wherein bonding the electrostatic chuck to the substrate support base comprises:
applying a pressure of about 0.5 to about 14.5 psi between the electrostatic chuck and the base while heating at least one of the base or adhesive layer to a predetermined temperature.

### Claim 19 (depends on 13)

The method of claim 13, wherein the bonding process is performed in a pressure vessel at a pressure of about 50 to about 200 psi.

### Claim 20 (depends on 13)

The method of claim 13, further comprising:
heating at least one of the base or the electrostatic chuck to a temperature of about 50 to about 110 degrees Celsius prior to depositing the adhesive layer.

### Claim 21 (depends on 13)

The method of claim 13, further comprising:
applying a metal organosilane primer to an adhesive-contacting surface of either or both of the electrostatic chuck and the base.

### Claim 22 (depends on 13)

The method of claim 13, further comprising:
heating the electrostatic chuck, adhesive layer and base, after bonding, to a temperature of between about 10 to 30 degrees Celsius above a bonding temperature to at least partially remove lower molecular weight residues from the adhesive layer.

### Claim 23

A substrate support, comprising:
a base;
an adhesive layer comprising a matrix of silicon-based polymeric material having a filler dispersed therein, wherein the silicon-based polymeric material comprises a polydimethylsiloxane (PDMS) structure having a repeating dimethylsiloxane unit; and
an electrostatic chuck disposed atop the base and the adhesive layer, wherein the adhesive layer bonds the base and the electrostatic chuck.