# US 9,520,307 B2 · Method and nozzle for hermetically sealed packaged devices

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- Number: US 9,520,307 B2
- Document ID: US9520307B2
- Status: Granted
- Kind: B2
- Application number: 14/609,015
- Filed: 2015-01-29
- Published: 2016-08-04
- Granted: 2016-12-13
- Earliest claimed: 2015-01-29
- Assignees: Texas Instruments Incorporated
- Applicants: Texas Instruments Incorporated
- Inventors: Edward Carl Fisher; Jane Qian Liu
- Web page: https://patentgrep.com/patent/US9520307B2

## CPC

- H10W 74/014: {using batch processing}
- B05B 1/14: with multiple outlet openings (B05B1/02, B05B1/26 take precedence); with strainers in or outside the outlet opening
- B05B 1/1422: {with all groups or rows being identical}
- B81C 1/00317: {Packaging optical devices}
- B81C 99/0025: {Apparatus specially adapted for the manufacture or treatment of microstructural devices or systems not provided for in B81C99/001 - B81C99/002}
- G02B 26/0833: {the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD (G02B26/0825 takes precedence; micromechanical devices in general B81B)}
- H10W 72/00: Interconnections or connectors in packages
- H10W 72/073: {of die-attach connectors}
- H10W 72/075: {of bond wires}
- H10W 72/0198: {batch processes}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- B05B: SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES (spray-mixers with nozzles B01F25/72; processes for applying liquids or other fluent materials to surfaces by spraying B05D)
- B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01)
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS

## Abstract

Microelectromechanical systems (MEMS) such as digital micromirror devices (DMD) are manufactured in arrays. Covers, packages, and lids are placed around each device and a liquid such as epoxy resin is dispensed around the packaged device. The epoxy resin acts as a sealant to form a hermetic seal. A nozzle comprises multiple orifices along a sidewall of the nozzle to dispense the epoxy resin horizontally and parallel to the plane of the wafer substrate. The distal ends of the nozzle are enclosed.

## Claims

### Claim 1

A method of hermetically sealing devices, comprising:
fabricating a plurality of devices on a device substrate;
placing a packaging substrate below the device;
attaching bonding wires from each device to bond pads;
placing a cover above each device to form a plurality of packaged devices;
spraying a sealant using a nozzle comprising multiple orifices on a sidewall of the nozzle and an enclosed distal end, onto each packaged device;
curing the sprayed sealant; and
fracturing the device and packaging substrates to singulate the plurality of packaged devices;
wherein the spraying step comprises dispensing the sealant into a permeable material on the sidewall of the nozzle and performing a wiping action with the permeable material.

### Claim 2 (depends on 1)

The method of claim 1, wherein the multiple orifices of the nozzle are arranged in one or more groups and vertically aligned along the sidewall of the nozzle.

### Claim 3 (depends on 1)

The method of claim 1, wherein the nozzle sprays in a direction parallel to a plane of the device substrate.

### Claim 4 (depends on 3)

The method of claim 3, wherein the nozzle sprays onto the sidewall and the cover.

### Claim 5 (depends on 4)

The method of claim 4, wherein the nozzle sprays from the multiple orifices simultaneously.

### Claim 6 (depends on 1)

The method of claim 1, wherein the multiple orifices of the nozzle are arranged in two or more groups of dispensing orifices on two opposing sidewalls.

### Claim 7

A method of hermetically sealing MEMS devices, comprising:
fabricating a plurality of MEMS devices on a device substrate, each MEMS device comprising an array of micromirrors;
attaching bonding wires from each MEMS device to bond pads;
placing a packaging substrate below the MEMS device;
placing a cover above each MEMS device to form a plurality of packaged MEMS devices;
placing a transparent window within the cover;
spraying a sealant using a nozzle comprising multiple orifices on a sidewall of the nozzle and an enclosed distal end, onto each packaged MEMS device;
curing the sprayed sealant; and
fracturing the device and packaging substrates to singulate the plurality of packaged MEMS devices;
wherein the spraying step comprises dispensing the sealant into a permeable material on the sidewall of the nozzle and performing a wiping action with the permeable material.

### Claim 8 (depends on 7)

The method of claim 7, wherein the multiple orifices of the nozzle are arranged in one or more groups and vertically aligned along the sidewall of the nozzle.

### Claim 9 (depends on 7)

The method of claim 7, wherein the nozzle sprays in a direction parallel to a plane of the device substrate.

### Claim 10 (depends on 9)

The method of claim 9, wherein the nozzle sprays onto the sidewall and the cover.

### Claim 11 (depends on 10)

The method of claim 10, wherein the nozzle sprays from the multiple orifices simultaneously.

### Claim 12 (depends on 7)

The method of claim 7, wherein the multiple orifices of the nozzle are arranged in two or more groups of dispensing orifices on two opposing sidewalls.

### Claim 13

A nozzle for spraying a sealant onto packaged devices of a wafer for hermetic sealing, comprising:
a length greater than a height of the packaged devices;
a width less than a space between adjacent packaged devices;
a permeable material on a sidewall of the nozzle to perform a wiping action;
a group of orifices on the sidewall of the nozzle to dispense the sealant into the permeable material on the sidewall, the permeable material covering the group of orifices; and
an enclosed distal end.

### Claim 14 (depends on 13)

The nozzle of claim 13, wherein the sidewall is a first sidewall, and the group of orifices is a first group of orifices, and further comprising: a second group of orifices on the first sidewall of the nozzle.

### Claim 15 (depends on 14)

The nozzle of claim 14, further comprising a third group of orifices on a second sidewall of the nozzle, the second sidewall being opposite the first sidewall.

### Claim 16 (depends on 15)

The nozzle of claim 15, further comprising a fourth group of orifices on the second sidewall of the nozzle.

### Claim 17 (depends on 13)

The nozzle of claim 13, wherein the sidewall is a first sidewall, and the group of orifices is a first group of orifices, and further comprising:
a second group of orifices on a second sidewall of the nozzle, the second sidewall being opposite the first sidewall;
wherein the permeable material is on the first sidewall and the second sidewall, the permeable material covering the first group of orifices and the second group of offices.