# US 9,520,305 B2 · Power semiconductor arrangement and method of producing a power semiconductor arrangement

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- Number: US 9,520,305 B2
- Document ID: US9520305B2
- Status: Granted
- Kind: B2
- Application number: 14/503,303
- Filed: 2014-09-30
- Published: 2015-04-02
- Granted: 2016-12-13
- Earliest claimed: 2013-09-30
- Assignees: Semikron Elektronik GmbH & Co. KG
- Applicants: Semikron Elektronik GmbH & Co., KG
- Inventors: Hartmut Kulas
- Web page: https://patentgrep.com/patent/US9520305B2

## CPC

- H10W 70/027: {Mechanical treatments, e.g. deforming, punching or cutting}
- H05K 7/20927: {Liquid coolant without phase change}
- H10W 40/037: {Assembling together parts thereof}
- H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections
- H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates}
- H10W 40/47: by flowing liquids, e.g. forced water cooling
- H10W 76/153: having interconnections in passages through the insulating or insulated base
- H10W 72/07331: {Connecting techniques}
- H10W 72/07336: {Soldering or alloying}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A power semiconductor device comprising a power semiconductor module and a heat sink; and a method for its manufacture. The module has a cooling plate, with an opening delimited by a lateral first surface thereof extending circumferentially around the opening. The cooling plate is arranged in the opening and has a lateral first surface which extends circumferentially around the cooling plate. The two first surfaces are at a respective angle of less than 90° with respect to a main surface of the cooling plate facing the power semiconductor components. The two first surfaces are pressed together, extending circumferentially along the first surface of the cooling plate and extending circumferentially along the first surface of the heat sink. The inventive power semiconductor device has good heat conduction from the power semiconductor components to the heat sink through which a liquid can flow, and which is reliably leaktight over the long term.

## Claims

### Claim 1

A power semiconductor device comprising:
a power semiconductor module having
electrically conductive conductor tracks with at least one power semiconductor component arranged thereon;
a cooling plate, said cooling plate having a main surface facing said at least one power semiconductor component and a lateral first surface which extends circumferentially around said cooling plate and is at an angle (α) of less than about 90° with respect to said main surface of said cooling plate; and
an electrically non-conductive insulation layer arranged between said conductor tracks and said cooling plate; and
a heat sink through which a liquid can flow, said heat sink having an opening therein and a lateral first surface which delimits said opening and extends circumferentially around said opening;
wherein said first surface of said heat sink is at an angle (β) of less than about 90° with respect to said main surface of said cooling plate;
wherein said cooling plate is arranged in said opening;
wherein said lateral first surface of said cooling plate and said lateral first surface of said heat sink are arranged in a manner pressed against one another and extend circumferentially along said lateral first surface of said cooling plate and extend circumferentially along said lateral first surface of said heat sink;
wherein said heat sink has a lateral second surface which extends circumferentially around said opening;
wherein said opening is further delimited by said lateral second surface of said heat sink;
wherein said lateral second surface of said heat sink forms an inner surface of a first groove which extends circumferentially around said opening, and extends radially inwardly towards said cooling plate;
wherein said cooling plate has an edge region with a protuberance, said edge region extending circumferentially around said cooling plate, and extending outwardly towards said lateral second surface, and said protuberance being disposed in said first groove.

### Claim 2

A power semiconductor device comprising:
a power semiconductor module having
electrically conductive conductor tracks with at least one power semiconductor component arranged thereon;
a cooling plate, said cooling plate having a main surface facing said at least one power semiconductor component and a lateral first surface which extends circumferentially around said cooling plate and is at an angle (α) of less than about 90° with respect to said main surface of said cooling plate; and
an electrically non-conductive insulation layer arranged between said conductor tracks and said cooling plate; and
a heat sink through which a liquid can flow, said heat sink having an opening therein and a lateral first surface which delimits said opening and extends circumferentially around said opening;
wherein said first surface of said heat sink is at an angle (β) of less than about 90° with respect to said main surface of said cooling plate;
wherein said angle (β) is approximately equal to said angle (α);
wherein said cooling plate is arranged in said opening;
wherein said lateral first surface of said cooling plate and said lateral first surface of said heat sink are arranged in a manner pressed against one another and extend circumferentially along said lateral first surface of said cooling plate and extend circumferentially along said lateral first surface of said heat sink;
wherein said heat sink has a lateral second surface which extends circumferentially around said opening;
wherein said opening is further delimited by said lateral second surface of said heat sink ;
wherein said lateral second surface of said heat sink forms an inner surface of a first groove which extends circumferentially around said opening, and extends radially inwardly towards said cooling plate;
wherein said cooling plate has an edge region with a protuberance, said edge region extending circumferentially around said cooling plate, and extending outwardly towards said lateral second surface, and said protuberance being disposed in said first groove.

### Claim 3

A power semiconductor device comprising:
a power semiconductor module having
electrically conductive conductor tracks with at least one power semiconductor component arranged thereon;
a cooling plate, said cooling plate having a main surface facing said at least one power semiconductor component and a lateral first surface which extends circumferentially around said cooling plate and is at an angle (α) of between about 89.5° and about 85° with respect to said main surface of said cooling plate; and
an electrically non-conductive insulation layer arranged between said conductor tracks and said cooling plate; and
a heat sink through which a liquid can flow, said heat sink having an opening therein and a lateral first surface which delimits said opening and extends circumferentially around said opening;
wherein said first surface of said heat sink is at an angle (β) of less than about 90° with respect to said main surface of said cooling plate;
wherein said cooling plate is arranged in said opening;
wherein said lateral first surface of said cooling plate and said lateral first surface of said heat sink are arranged in a manner pressed against one another and extend circumferentially along said lateral first surface of said cooling plate and extend circumferentially along said lateral first surface of said heat sink;
wherein said heat sink has a lateral second surface which extends circumferentially around said opening;
wherein said opening is further delimited by said lateral second surface of said heat sink;
wherein said lateral second surface of said heat sink forms an inner surface of a first groove which extends circumferentially around said opening, and extends radially inwardly towards said cooling plate;
wherein said cooling plate has an edge region with a protuberance, said edge region extending circumferentially around said cooling plate, and extending outwardly towards said lateral second surface, and said protuberance being disposed in said first groove.

### Claim 4

A power semiconductor device comprising:
a power semiconductor module having
electrically conductive conductor tracks with at least one power semiconductor component arranged thereon;
a cooling plate, said cooling plate having a main surface facing said at least one power semiconductor component and a lateral first surface which extends circumferentially around said cooling plate and is at an angle (α) of between about 89.5° and about 85° with respect to said main surface of said cooling plate; and
an electrically non-conductive insulation layer arranged between said conductor tracks and said cooling plate; and
a heat sink through which a liquid can flow, said heat sink having an opening therein and a lateral first surface which delimits said opening and extends circumferentially around said opening;
wherein said first surface of said heat sink is at an angle (β) which is approximately equal to said angle (α);
wherein said cooling plate is arranged in said opening;
wherein said lateral first surface of said cooling plate and said lateral first surface of said heat sink are arranged in a manner pressed against one another and extend circumferentially along said lateral first surface of said cooling plate and extend circumferentially along said lateral first surface of said heat sink;
wherein said heat sink has a lateral second surface which extends circumferentially around said opening;
wherein said opening is further delimited by said lateral second surface of said heat sink;
wherein said lateral second surface of said heat sink forms an inner surface of a first groove which extends circumferentially around said opening, and extends radially inwardly towards said cooling plate;
wherein said cooling plate has an edge region with a protuberance, said edge region extending circumferentially around said cooling plate, and extending outwardly towards said lateral second surface, and said protuberance being disposed in said first groove.

### Claim 5

A method for producing a power semiconductor device, the method comprising the following steps:
a) providing a power semiconductor module having
electrically conductive conductor tracks with at least one power semiconductor component arranged thereon;
a cooling plate, said cooling plate having a main surface facing said at least one power semiconductor component and a lateral first surface which extends circumferentially around said cooling plate and is at an angle (α) of less than about 90° with respect to said main surface of said cooling plate; and
an electrically non-conductive insulation layer arranged between said conductor tracks and said cooling plate;
b) providing a heat sink through which a liquid can flow, said heat sink having an opening therein and a lateral first surface which delimits said opening and extends circumferentially around said opening, and a lateral second surface which extends circumferentially around said opening and further delimits said opening;
c) arranging said cooling plate in said opening; and
d) press-fitting said cooling plate into said opening so that said lateral first surface of said cooling plate and said lateral first surface of said heat sink are pressed against one another and extend circumferentially along said lateral first surface of said cooling plate and extend circumferentially along said lateral first surface of said heat sink;
e) forming an inner surface of a first groove which extends circumferentially around said opening with said lateral second surface of said heat sink, and also extends radially inwardly towards said cooling plate;
f) forming a protuberance in an edge region of said cooling plate, said protuberance extending circumferentially around said cooling plate, and extending radially outwardly from said cooling plate towards said inner surface; and
g) positioning said protuberance in said first groove;
wherein said first surface of said heat sink is at an angle (β) of less than about 90° with respect to said main surface of said cooling plate.

### Claim 6 (depends on 5)

The method of claim 5, wherein said step d) includes cutting a circumferentially extending second groove spaced apart from said first surface of said cooling plate into said main surface of said cooling plate.

### Claim 7 (depends on 5)

The method of claim 5, wherein said main surface of said cooling plate has a circumferentially extending second groove spaced apart from said lateral first surface of said cooling plate.

### Claim 8 (depends on 5)

The method of claim 5
wherein that the method is carried out by means of a tool having a press-fitting stamp and a deforming stamp;
wherein said step d) is carried out by means of said press-fitting stamp and
wherein said step f) is carried out by means of said deforming stamp; and
wherein said deforming stamp is arranged so as to be movable relative to said press-fitting stamp and laterally around said press-fitting stamp.

### Claim 9 (depends on 6)

The method of claim 6
wherein that the method is carried out by means of a tool having a press-fitting stamp and a deforming stamp;
wherein said step d) is carried out by means of said press-fitting stamp and
wherein said step f) is carried out by means of said deforming stamp; and
wherein said deforming stamp is arranged so as to be movable relative to said press-fitting stamp and laterally around said press-fitting stamp.

### Claim 10 (depends on 7)

The method of claim 7
wherein that the method is carried out by means of a tool having a press-fitting stamp and a deforming stamp;
wherein said step d) is carried out by means of said press-fitting stamp and
wherein said step f) is carried out by means of said deforming stamp; and
wherein said deforming stamp is arranged so as to be movable relative to said press-fitting stamp and laterally around said press-fitting stamp.