# US 9,520,244 B2 · Composite electronic component and board having the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,520,244 B2 - Document ID: US9520244B2 - Status: Granted - Kind: B2 - Application number: 14/334,437 - Filed: 2014-07-17 - Published: 2015-01-22 - Granted: 2016-12-13 - Earliest claimed: 2013-07-18 - Assignees: Samsung Electro-Mechanics Co., Ltd. - Applicants: Samsung Electro-Mechanics Co., Ltd. - Inventors: Min Cheol Park; Byoung Hwa Lee; Sang Soo Park; Young Ghyu Ahn - Web page: https://patentgrep.com/patent/US9520244B2 ## CPC - H01G 17/00: Structural combinations of capacitors or other devices covered by at least two different main groups of this subclass with other electric elements, not covered by this subclass, e.g. RC combinations - H01G 4/30: Stacked capacitors (H01G4/33 takes precedence) - H01G 4/40: Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations - H05K 3/3431: {Leadless components} - H01G 4/12: Ceramic dielectrics {(H01G4/085 takes precedence)} - H05K 1/0233: {Filters, inductors or a magnetic substance} - H05K 1/181: associated with surface mounted components - H05K 2201/09781: Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components - H05K 2201/10015: Non-printed capacitor - H05K 2201/1003: Non-printed inductor - H05K 2201/1031: Surface mounted metallic connector elements - H05K 2201/10515: Stacked components - H05K 2201/10962: Component not directly connected to the PCB - H05K 2201/2045: Protection against vibrations - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract A composite electronic component may include: a composite element in which a capacitor and an inductor are spaced apart from each other, the capacitor including a ceramic body, and the inductor including a magnetic body; a first external electrode disposed on a second end surface of the ceramic body, second external electrodes disposed on first and second side surfaces of the ceramic body, a first dummy electrode disposed on a first end surface of the ceramic body; and third and fourth external electrodes disposed on first and second end surfaces of the magnetic body. The composite element may include a first metal frame disposed on a first end surface of the composite element, a second metal frame disposed on a second end surface of the composite element, and third metal frames disposed on one or more of first and second side surfaces of the composite element. ## Claims ### Claim 1 A composite electronic component comprising: a composite element including a capacitor and an inductor spaced apart from each other by a vacant space forming a predetermined distance in a stacking direction, the capacitor including a ceramic body in which a plurality of dielectric layers and first and second internal electrodes facing each other with each of the dielectric layers interposed therebetween are stacked, the first internal electrodes being exposed to a second end surface of the ceramic body and the second internal electrodes having lead-out portions exposed to first and second side surfaces of the ceramic body, respectively, and the inductor including a magnetic body in which conductive patterns and a plurality of magnetic sheets are stacked; a first external electrode disposed on the second end surface of the ceramic body and electrically connected to the first internal electrodes, second external electrodes disposed on the first and second side surfaces of the ceramic body and electrically connected to the second internal electrodes, a first dummy electrode disposed on a first end surface of the ceramic body; and third and fourth external electrodes disposed on first and second end surfaces of the magnetic body, respectively, and connected to the conductive patterns, wherein the composite element includes a first metal frame disposed on a first end surface of the composite element in order to connect the first dummy electrode and the third external electrode to each other to form an input terminal, a second metal frame disposed on a second end surface of the composite element in order to connect the first external electrode and the fourth external electrode to each other to form an output terminal, and third metal frames disposed on one or more of first and second side surfaces of the composite element in order to form a ground terminal formed of the second external electrodes. ### Claim 2 (depends on 1) The composite electronic component of claim 1, wherein the inductor and the capacitor are connected to each other in series. ### Claim 3 (depends on 1) The composite electronic component of claim 1, wherein the inductor is disposed above the capacitor. ### Claim 4 (depends on 1) The composite electronic component of claim 1, wherein the first to third metal frames include contact portions contacting the composite element and bent portions bent and extended from the contact portions in order to contact electrode pads on a board, respectively. ### Claim 5 (depends on 4) The composite electronic component of claim 4, wherein the bent portions are spaced apart from a lower surface of the composite element by a predetermined interval. ### Claim 6 (depends on 1) The composite electronic component of claim 1, wherein the composite element has a marking part disposed on an upper surface of the composite element. ### Claim 7 (depends on 1) A board having a composite electronic component, comprising: a printed circuit board having three or more electrode pads disposed thereon; the composite electronic component of claim 1 mounted on the printed circuit board; and solders connecting the electrode pads and the composite electronic component to each other. ### Claim 8 (depends on 7) The board having a composite electronic component of claim 7, wherein the electrode pads include a first electrode pad connected to the input terminal through the first metal frame of the composite electronic component, a second electrode pad connected to the output terminal through the second metal frame of the composite electronic component, and a third electrode pad connected to the ground terminal through the third metal frames of the composite electronic component. ### Claim 9 A composite electronic component comprising: an input terminal receiving power converted by a power managing unit; a power stabilizing unit stabilizing the power and including a composite element in which a capacitor and an inductor are spaced apart from each other by a vacant space forming a predetermined distance in a stacking direction, the capacitor including a ceramic body in which a plurality of dielectric layers and first and second internal electrodes facing each other with each of the dielectric layers interposed therebetween are stacked, the first internal electrodes being exposed to a second end surface of the ceramic body and the second internal electrodes having lead-out portions exposed to first and second side surfaces of the ceramic body, respectively, and the inductor including a magnetic body in which conductive patterns and a plurality of magnetic sheets are stacked; an output terminal supplying the stabilized power; and a ground terminal for grounding, wherein the input terminal is connected to a first metal frame disposed on a first end surface of the composite element, the output terminal is connected to a second metal frame disposed on a second end surface of the composite element, and the ground terminal is connected to third metal frames disposed on one or more of first and second side surfaces of the composite element. ### Claim 10 (depends on 9) The composite electronic component of claim 9, wherein the input terminal is formed of a first dummy electrode disposed on a first end surface of the ceramic body and a third external electrode disposed on a first end surface of the magnetic body and connected to the conductive patterns, the output terminal is formed of a first external electrode disposed on a second end surface of the ceramic body and electrically connected to the first internal electrodes and a fourth external electrode disposed on a second end surface of the magnetic body and connected to the conductive patterns, and the ground terminal is formed of second external electrodes disposed on the first and second side surfaces of the ceramic body and electrically connected to the second internal electrodes. ### Claim 11 (depends on 9) The composite electronic component of claim 9, wherein the inductor and the capacitor are connected to each other in series. ### Claim 12 (depends on 9) The composite electronic component of claim 9, wherein the inductor is disposed above the capacitor. ### Claim 13 (depends on 9) The composite electronic component of claim 9, wherein the first to third metal frames include contact portions contacting the composite element and bent portions extended and bent from the contact portions in order to contact electrode pads on a board, respectively. ### Claim 14 (depends on 13) The composite electronic component of claim 13, wherein the bent portions are spaced apart from a lower surface of the composite element by a predetermined interval. ### Claim 15 (depends on 9) The composite electronic component of claim 9, wherein the composite element has a marking part disposed on an upper surface of the composite element. ### Claim 16 (depends on 9) A board having a composite electronic component, comprising: a printed circuit board having three or more electrode pads disposed thereon; the composite electronic component of claim 9 mounted on the printed circuit board; and solders connecting the electrode pads and the composite electronic component to each other. ### Claim 17 (depends on 16) The board having a composite electronic component of claim 16, wherein the electrode pads include a first electrode pad connected to the input terminal through the first metal frame of the composite electronic component, a second electrode pad connected to the output terminal through the second metal frame of the composite electronic component, and a third electrode pad connected to the ground terminal through the third metal frames of the composite electronic component.