# US 9,520,243 B2 · Method of manufacturing flexible thin-film typer super-capacitor device using a hot-melt adhesive film, and super-capacitor device manufactured by the method

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- Number: US 9,520,243 B2
- Document ID: US9520243B2
- Status: Granted
- Kind: B2
- Application number: 14/602,443
- Filed: 2015-01-22
- Published: 2015-08-20
- Granted: 2016-12-13
- Earliest claimed: 2014-02-17
- Assignees: Korea Institute of Energy Research
- Applicants: Korea Institute of Energy Research
- Inventors: Jung-Joon Yoo; Jong-Huy Kim; Jae-Kook Yoon; Hana Yoon; Yong-Il Kim
- Web page: https://patentgrep.com/patent/US9520243B2

## CPC

- H01G 11/68: characterised by their material
- C09J 5/06: involving heating of the applied adhesive
- C09J 123/02: not modified by chemical after-treatment
- C09J 131/04: Homopolymers or copolymers of vinyl acetate
- H01G 11/28: arranged or disposed on a current collector; Layers or phases between electrodes and current collectors, e.g. adhesives
- H01G 11/32: Carbon-based
- H01G 11/36: Nanostructures, e.g. nanofibres, nanotubes or fullerenes
- H01G 11/56: Solid electrolytes, e.g. gels; Additives therein
- H01G 11/58: Liquid electrolytes
- H01G 11/80: Gaskets; Sealings
- H01G 11/84: Processes for the manufacture of hybrid or EDL capacitors, or components thereof
- C09J 2203/326: for bonding electronic components such as wafers, chips or semiconductors
- C09J 2423/00: Presence of polyolefin
- C09J 2431/00: Presence of polyvinyl acetate
- H01G 11/52: Separators
- Y02E 60/13: Energy storage using capacitors
- Y10T 428/24752: Laterally noncoextensive components
- Y10T 428/24843: with heat sealable or heat releasable adhesive layer
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

Disclosed are a method of manufacturing a flexible thin-film type super-capacitor device and a super-capacitor device manufactured by the same. The flexible thin-film type super-capacitor device comprises a base film which has flexibility; a separator which is interposed between the base films; and an active material which is formed on the base film. Thus, flexibility is given since thickness is very thin while maintaining high electrical conductivity and high binding property. In addition, economic feasibility is high and mass production is possible. Further, it is possible to stably and efficiently contain a highly corrosive material.

## Claims

### Claim 1

A method of manufacturing a capacitor device, the method comprising:
preparing a base film that has flexibility;
forming an active material on the base film; and
coupling base films comprising active materials with a separator therebetween so that the active materials can face each other,
wherein the forming the active material comprises using graphene oxide, and
the active material is generated by making slurry of graphene oxide be heated, exposed to light and thermally treated.

### Claim 2 (depends on 1)

The method according to claim 1, wherein the base film comprises a polyphenylene sulfide (PPS) film, a polypropylene (PP) film, a polyethylene phthalate (PET) film, a polycarbonate (PC) film, a polyethylene naphthalate (PEN) film, a polyethylene terephthalate (PET) film and a film on which metal comprising aluminum is deposited, and
the base film undergoes surface treatment.

### Claim 3 (depends on 1)

The method according to claim 1, further comprising: forming a current collector on each base film between the base film and the separation membrane,
wherein the current collector is formed by plating, and the plating comprises electroless plating or electric plating, and
wherein the plating solution comprises one selected from a group consisting of nickel (Ni), platinum (Pt), silver (Ag), gold (Au), copper (Cu), aluminum (Al), palladium (Pd) and iridium (Ir).

### Claim 4 (depends on 3)

The method according to claim 3, wherein in the forming the current collector,
the base film comprises a polyphenylene sulfide (PPS) film, and a surface of the base film to be plated is made rough, sensitized, activated, put into electroless nickel plating solution and then plated.

### Claim 5 (depends on 3)

The method according to claim 3, wherein in the forming the current collector,
the base film comprises a polypropylene (PP) film, and a surface of the base film to be plated is etched, catalyst particles are attached to the surface of the base film and activated, and nickel plating is performed.

### Claim 6 (depends on 1)

The method according to claim 1, further comprising: performing vacuum-impregnation so that the electrolyte can be infiltrated into the active materials.

### Claim 7

A method of manufacturing a capacitor device, the method comprising:
preparing a base film that has flexibility;
forming a current collector on the base film;
forming an active material with graphene oxide on the current collector;
coupling base films comprising current collectors and active materials with a separator therebetween so that the active materials can face each other; and
coupling a hot-melt adhesive film for sealing up around the base film to maintain air-tightness of an electrolyte provided between the active materials,
wherein the electrolyte is highly corrosive, and
the hot-melt adhesive film comprises a plastic paraffin film and a polyolefin film.

### Claim 8 (depends on 7)

The method according to claim 7, further comprising reinforcing materials coupled to the backs of the hot-melt adhesive films and thermally adhered to each other.

### Claim 9 (depends on 8)

The method according to claim 8, wherein the hot-melt adhesive film and the reinforcing material are adhered by one or a plurality of methods selected among a method of using an adhesive, a thermal adhesion method, a thermal fusion method and a welding method.
