# US 9,520,239 B2 · Chip electronic component and board having the same

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- Number: US 9,520,239 B2
- Document ID: US9520239B2
- Status: Granted
- Kind: B2
- Application number: 14/671,714
- Filed: 2015-03-27
- Published: 2016-04-21
- Granted: 2016-12-13
- Earliest claimed: 2014-10-15
- Assignees: Samsung Electro-Mechanics Co., Ltd.
- Applicants: Samsung Electro-Mechanics Co., Ltd.
- Inventors: Sang Soo Park; Soon Ju Lee; Young Ghyu Ahn; Heung Kil Park
- Web page: https://patentgrep.com/patent/US9520239B2

## CPC

- H01G 4/30: Stacked capacitors (H01G4/33 takes precedence)
- H01C 1/14: Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
- H01C 1/148: the terminals embracing or surrounding the resistive element (H01C1/142 takes precedence)
- H01C 7/18: comprising a plurality of layers stacked between terminals
- H01G 2/065: {for surface mounting, e.g. chip capacitors}
- H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor
- H05K 3/3442: {having edge contacts, e.g. leadless chip capacitors, chip carriers}
- H01C 7/008: {Thermistors (H01C7/02 - H01C7/06 take precedence)}
- H01C 7/10: voltage responsive, i.e. varistors
- H01G 4/12: Ceramic dielectrics {(H01G4/085 takes precedence)}
- H05K 1/141: {One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence)}
- H05K 2201/049: PCB for one component, e.g. for mounting onto mother PCB
- H05K 2201/10015: Non-printed capacitor
- H05K 2201/10378: Interposers
- H05K 2201/2045: Protection against vibrations
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)
- H01C: RESISTORS
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

There is provided a chip electronic component may include: a ceramic body; external electrodes formed on both side portions of the ceramic body; and an interposer supporting the ceramic body and electrically connected to the external electrodes, wherein the interposer includes first and second terminal electrodes formed on both side portions thereof and recesses formed inwardly in the first and second terminal electrodes.

## Claims

### Claim 1

A chip electronic component comprising:
a ceramic body;
external electrodes provided on both side portions of the ceramic body in a length direction; and
an interposer supporting the ceramic body and electrically connected to the external electrodes,
wherein the interposer includes:
first and second terminal electrodes provided on both side portions thereof in the length direction; and
recesses provided inwardly in the first and second terminal electrodes along the side portions of the interposer in the length direction.

### Claim 2 (depends on 1)

The chip electronic component of claim 1, wherein when a width of each of the external electrodes is We and a length of the ceramic body is L, We/L is 0.20 to 0.89.

### Claim 3 (depends on 1)

The chip electronic component of claim 1, wherein when a length of each of the first and second terminal electrodes is A, a length of each of the recesses is B, a width of each of the first and second terminal electrodes is C, and a width of each of the recesses is D, 0.167≦(B×D)/(A×C)≦0.710 is satisfied.

### Claim 4 (depends on 1)

The chip electronic component of claim 1, wherein the interposer further includes third and fourth terminal electrodes provided on both end portions thereof.

### Claim 5 (depends on 1)

The chip electronic component of claim 1, wherein the ceramic body includes internal electrodes and dielectric layers that are alternately stacked,
the internal electrodes disposed to be parallel to the first and second terminal electrodes.

### Claim 6 (depends on 4)

The chip electronic component of claim 4, wherein the third and fourth terminal electrodes are connected to the first and second terminal electrodes respectively.