# US 9,520,238 B2 · Array-type multilayer ceramic electronic component and board having the same mounted thereon

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 9,520,238 B2
- Document ID: US9520238B2
- Status: Granted
- Kind: B2
- Application number: 14/262,282
- Filed: 2014-04-25
- Published: 2015-04-30
- Granted: 2016-12-13
- Earliest claimed: 2013-10-25
- Assignees: Samsung Electro-Mechanics Co., Ltd.
- Applicants: Samsung Electro-Mechanics Co., Ltd.
- Inventors: Jae Hoon Lee; Dae Bok Oh; Jae Young Park
- Web page: https://patentgrep.com/patent/US9520238B2

## CPC

- H01G 4/30: Stacked capacitors (H01G4/33 takes precedence)
- H01G 4/012: Form of non-self-supporting electrodes
- H01G 4/12: Ceramic dielectrics {(H01G4/085 takes precedence)}
- H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor
- H01G 4/385: {Single unit multiple capacitors, e.g. dual capacitor in one coil}
- H05K 1/181: associated with surface mounted components
- H05K 2201/10015: Non-printed capacitor
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

An array-type multilayer ceramic electronic component includes a ceramic body including a plurality of first dielectric layers and a plurality of second dielectric layers, first and second internal electrodes disposed on the first dielectric layers and facing each other, third and fourth internal electrodes disposed on the second dielectric layers and facing each other, a first external electrode disposed on a first end surface of the ceramic body and connected to the first internal electrode, a second external electrode disposed on a first side surface of the ceramic body and connected to the second internal electrode, a third external electrode disposed on a second end surface of the ceramic body and connected to the third internal electrode, and a fourth external electrode disposed on a second side surface of the ceramic body and connected to the fourth internal electrode.

## Claims

### Claim 1

An array-type multilayer ceramic electronic component comprising:
a body having a hexahedral shape and including a first capacitor part and a second capacitor part coupled to the first capacitor part, wherein the first capacitor part includes a plurality of first dielectric layers, a plurality of first internal electrodes and a plurality of second internal electrodes, and the second capacitor part is disposed below the first capacitor part in a thickness direction and includes a plurality of second dielectric layers, a plurality of third internal electrodes and a plurality of fourth internal electrodes;
a first signal electrode disposed on a first end surface of the body and connected to the first internal electrodes;
a first ground electrode disposed on a first side surface of the body and connected to the second internal electrodes;
a second signal electrode disposed on a second end surface of the body and connected to the third internal electrodes; and
a second ground electrode disposed on a second side surface of the body and connected to the fourth internal electrodes.

### Claim 2 (depends on 1)

The array-type multilayer ceramic electronic component of claim 1, wherein a lowermost internal electrode of the first capacitor part is one of the second internal electrodes, and an uppermost internal electrode of the second capacitor part is one of the fourth internal electrodes.

### Claim 3 (depends on 1)

The array-type multilayer ceramic electronic component of claim 1, wherein a lowermost internal electrode of the first capacitor part is one of the second internal electrodes, an uppermost internal electrode of the second capacitor part is one of the fourth internal electrodes, and the lowermost internal electrode of the first capacitor part and the uppermost internal electrode of the second capacitor part face each other, having a dielectric layer therebetween.

### Claim 4 (depends on 1)

The array-type multilayer ceramic electronic component of claim 1, wherein the first and second capacitor parts are configured to independently operate.

### Claim 5 (depends on 1)

The array-type multilayer ceramic electronic component of claim 1, wherein the first and second capacitor parts have different capacitance.

### Claim 6 (depends on 1)

The array-type multilayer ceramic electronic component of claim 1, wherein the first and second capacitor parts have respective current directions opposite to each other.

### Claim 7 (depends on 1)

The array-type multilayer ceramic electronic component of claim 1, wherein:
the first and second internal electrodes are disposed on the plurality of first dielectric layers so as to face each other, having one of the first dielectric layers therebetween, and
the third and fourth internal electrodes are disposed on the plurality of second dielectric layers so as to face each other, having one of the second dielectric layers therebetween.

### Claim 8 (depends on 1)

The array-type multilayer ceramic electronic component of claim 1, wherein:
the first internal electrodes include a first lead portion exposed to the first end surface,
the second internal electrodes include a second lead portion exposed to the first side surface, the third internal electrodes include a third lead portion exposed to the second end surface, and the fourth internal electrodes include a fourth lead portion exposed to the second side surface.

### Claim 9

An array-type multilayer ceramic electronic component comprising:
a body having a hexahedral shape including a first capacitor part and a second capacitor part coupled to the first capacitor part, wherein the first capacitor part stabilizes first power supplied from a battery to supply the stabilized power to a power management unit, and the second capacitor part is disposed below the first capacitor part, is supplied with second power converted by the power management unit, and stabilizes the supplied second power to supply driving power;
a first signal electrode disposed on a first end surface of the body and connected to the battery to transfer the first power to the first capacitor part;
a second signal electrode disposed on a second end surface of the body and connected to the power management unit to transfer the second power to the second capacitor part;
a first ground electrode disposed on a first side surface of the body to ground the first capacitor part; and
a second ground electrode disposed on a second side surface of the body to ground the second capacitor part, wherein:
the first capacitor part includes a plurality of first dielectric layers, and a plurality of first internal electrodes, and a plurality of second internal electrodes,
the second capacitor part includes a plurality of second dielectric layers, and a plurality of third internal electrodes, and a plurality of fourth internal electrodes,
the first internal electrodes are connected to the first signal electrode,
the second internal electrodes are connected to the first ground electrode,
the third internal electrodes are connected to the second signal electrode, and
the fourth internal electrodes are connected to the second ground electrode.

### Claim 10 (depends on 9)

The array-type multilayer ceramic electronic component of claim 9, wherein:
a lowermost internal electrode of the first capacitor part is one of the second internal electrodes, and
an uppermost internal electrode of the second capacitor part is one of the fourth internal electrodes.
