# US 9,520,237 B2 · Monolithic ceramic electronic component

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- Number: US 9,520,237 B2
- Document ID: US9520237B2
- Status: Granted
- Kind: B2
- Application number: 14/674,283
- Filed: 2015-03-31
- Published: 2015-10-01
- Granted: 2016-12-13
- Earliest claimed: 2014-03-31
- Assignees: Murata Manufacturing Co., Ltd.
- Applicants: Murata Manufacturing Co., Ltd.
- Inventors: Yasuhiro Nishisaka; Kotaro Shimizu
- Web page: https://patentgrep.com/patent/US9520237B2

## CPC

- H01G 4/248: the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence)
- H01G 4/012: Form of non-self-supporting electrodes
- H01G 4/1227: {based on alkaline earth titanates}
- H01G 4/1245: {containing also titanates}
- H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor
- H01G 4/2325: {characterised by the material of the terminals}
- H01G 4/30: Stacked capacitors (H01G4/33 takes precedence)
- H01G 4/12: Ceramic dielectrics {(H01G4/085 takes precedence)}
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)

## Abstract

Outer electrodes include end-surface outer electrodes arranged on end surfaces of a ceramic multilayer body, and side-surface outer electrodes on side surfaces of the ceramic multilayer body, the side-surface outer electrodes being electrically connected to the end-surface outer electrodes. Sputtered electrode layers of the side-surface outer electrodes in contact with the ceramic multilayer body are composed of a material containing a metal with a standard redox potential of about −2.36 V to about −0.74 V, the proportion of the metal in the material being about 3% by mass or more. Sputtered outermost electrode layers serving as the outermost layers of the side-surface outer electrodes are composed of a metal or an alloy in which the heat of solution of hydrogen is about 23.8 kJ/molH or more.

## Claims

### Claim 1

A monolithic ceramic electronic component having a structure comprising:
a ceramic multilayer body including
stacked ceramic layers, and
inner electrodes arranged between adjacent ceramic layers of the stacked ceramic layers;
a first outer electrode arranged on the ceramic multilayer body, the first outer electrode being electrically connected to a first plurality of the inner electrodes; and
a second outer electrode arranged on the ceramic multilayer body, the second outer electrode being electrically connected to a second plurality of the inner electrodes,
wherein
(a) the first and second outer electrodes each include
an end-surface outer electrode arranged on an end surface of the ceramic multilayer body, and
a side-surface outer electrode on side surfaces in contact with the end surface of the ceramic multilayer body, the side-surface outer electrode being electrically connected to the end-surface outer electrode, and
(b) the side-surface outer electrode includes a first sputtered electrode layer and a second sputtered electrode layer,
the first sputtered electrode layer contacting the ceramic multilayer body and including a material containing a first metal with a standard redox potential of about −2.36 V to about −0.74 V, a proportion of the first metal in the material being about 3% by mass or more,
the second sputtered electrode layer including a second metal or an alloy in which a heat of solution of hydrogen is about 23.8 kJ/molH or more,
the first sputtered electrode layer including a material that is different from a material of the end-surface outer electrode, and
the side-surface outer electrode only overlaps an edge of the end-surface outer electrode.

### Claim 2 (depends on 1)

The monolithic ceramic electronic component according to claim 1, wherein the second sputtered electrode is an outermost layer of the side-surface outer electrode.

### Claim 3 (depends on 1)

The monolithic ceramic electronic component according to claim 1, wherein the first metal contained in the first sputtered electrode layer is at least one selected from the group consisting of Mg, Al, Ti, W, and Cr.

### Claim 4 (depends on 3)

The monolithic ceramic electronic component according to claim 3, wherein the second metal contained in the second sputtered electrode layer is at least one selected from the group consisting of Cu, Al, and Ag, or an alloy containing at least one selected from the group consisting of Cu, Al, and Ag.

### Claim 5 (depends on 1)

The monolithic ceramic electronic component according to claim 1, wherein the second metal contained in the second sputtered electrode layer is at least one selected from the group consisting of Cu, Al, and Ag, or an alloy containing at least one selected from the group consisting of Cu, Al, and Ag.

### Claim 6 (depends on 1)

The monolithic ceramic electronic component according to claim 1, further comprising:
a plating metal film on surfaces of the first and second outer electrodes.

### Claim 7 (depends on 3)

The monolithic ceramic electronic component according to claim 3, further comprising:
a plating metal film on surfaces of the first and second outer electrodes.

### Claim 8 (depends on 4)

The monolithic ceramic electronic component according to claim 4, further comprising:
a plating metal film on surfaces of the first and second outer electrodes.

### Claim 9 (depends on 5)

The monolithic ceramic electronic component according to claim 5, further comprising:
a plating metal film on surfaces of the first and second outer electrodes.