# US 9,520,234 B2 · Multilayer ceramic capacitor, manufacturing method thereof and board for mounting the same thereon > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,520,234 B2 - Document ID: US9520234B2 - Status: Granted - Kind: B2 - Application number: 14/099,650 - Filed: 2013-12-06 - Published: 2015-03-12 - Granted: 2016-12-13 - Earliest claimed: 2013-09-12 - Assignees: Samsung Electro-Mechanics Co., Ltd. - Applicants: Samsung Electro-Mechanics Co., Ltd. - Inventors: Sim Chung Kang; Seung Hee Yoo; Jun Hyeong Kim; Eun Joo Choi; Kyu Ha Lee - Web page: https://patentgrep.com/patent/US9520234B2 ## CPC - H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor - H01G 4/2325: {characterised by the material of the terminals} - H01G 4/30: Stacked capacitors (H01G4/33 takes precedence) - H01G 4/12: Ceramic dielectrics {(H01G4/085 takes precedence)} - H05K 3/3442: {having edge contacts, e.g. leadless chip capacitors, chip carriers} - H05K 2201/10015: Non-printed capacitor - H05K 2201/10636: Leadless chip, e.g. chip capacitor or resistor - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - Y10T 29/43: Electric condenser making - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A multilayer ceramic capacitor and manufacturing method therefor, in which the capacitor includes a ceramic body including dielectric layers and internal electrodes; electrode layers connected to the internal electrodes; and a conductive resin layer formed on the electrode layers and including a first conductor, a second conductor having a fiber shape, and a base resin. ## Claims ### Claim 1 A multilayer ceramic capacitor comprising: a ceramic body including dielectric layers and internal electrodes forming capacitance; external electrode layers connected to the internal electrodes; and a conductive resin layer formed on the external electrode layers and including a first conductor, a second conductor having a fiber shape, and a base resin. ### Claim 2 (depends on 1) The multilayer ceramic capacitor of claim 1, wherein the first conductor has a spherical shape or a flake shape. ### Claim 3 (depends on 1) The multilayer ceramic capacitor of claim 1, wherein the second conductor is flexible. ### Claim 4 (depends on 1) The multilayer ceramic capacitor of claim 1, wherein L/D≧1.0, in which a diameter of the second conductor is defined as D and a length of the second conductor is defined as L. ### Claim 5 (depends on 1) The multilayer ceramic capacitor of claim 1, wherein 1 nm≦D≦100 nm, in which a diameter of the second conductor is defined as D. ### Claim 6 (depends on 1) The multilayer ceramic capacitor of claim 1, wherein the second conductor is a carbon nanotube. ### Claim 7 (depends on 1) The multilayer ceramic capacitor of claim 1, wherein the second conductor is a single-walled carbon nanotube (SWNT). ### Claim 8 (depends on 1) The multilayer ceramic capacitor of claim 1, wherein the second conductor is a multi-walled carbon nanotube (MWNT). ### Claim 9 (depends on 1) The multilayer ceramic capacitor of claim 1, wherein the base resin is a thermosetting resin. ### Claim 10 (depends on 1) The multilayer ceramic capacitor of claim 1, further comprising a plating layer formed on the conductive resin layer. ### Claim 11 A manufacturing method of a multilayer ceramic capacitor, comprising: forming a ceramic body including dielectric layers and internal electrodes; forming electrode layers to be connected to the internal electrodes; applying a conductive paste including a first conductor, a second conductor having a fiber shape, and a base resin to the electrode layers; and curing the conductive paste to form a conductive resin layer. ### Claim 12 A board for mounting a multilayer ceramic capacitor thereon comprising: a printed circuit board having first and second electrode pads disposed thereon; and a multilayer ceramic capacitor installed on the printed circuit board, wherein the multilayer ceramic capacitor includes a ceramic body including dielectric layers and internal electrodes forming capacitance; external electrode layers connected to the internal electrodes; and a conductive resin layer formed on the external electrode layers and including a first conductor, a second conductor having a fiber shape, and a base resin. ### Claim 13 A multilayer ceramic capacitor comprising: a ceramic body including dielectric layers and internal electrodes; external electrode layers disposed on outer surfaces of the ceramic body and connected to the internal electrodes forming capacitance; and a conductive resin layer disposed on the external electrode layers and including a first conductive material, a second conductive material having a fiber shape different to shape of the first conductive material, and a base resin. ### Claim 14 (depends on 13) The multilayer ceramic capacitor of claim 13, wherein the first conductive material has a particle shape. ### Claim 15 A manufacturing method of a multilayer ceramic capacitor, comprising: forming a ceramic body including a plurality of dielectric layers and internal electrodes; forming external electrode layers on the outer surfaces of the ceramic body to be connected to the internal electrodes; applying a conductive paste including a first conductive material, a second conductive material having a fiber shape different to shape of the first conductive material, and a base resin to the electrode layers; and curing the conductive paste to form a conductive resin layer. ### Claim 16 (depends on 15) The manufacturing method of a multilayer ceramic capacitor of claim 15, wherein the first conductive material has a particle shape.