# US 9,520,232 B2 · Multilayer ceramic electronic component

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 9,520,232 B2
- Document ID: US9520232B2
- Status: Granted
- Kind: B2
- Application number: 14/674,373
- Filed: 2015-03-31
- Published: 2015-10-01
- Granted: 2016-12-13
- Earliest claimed: 2014-03-31
- Assignees: Murata Manufacturing Co., Ltd.
- Applicants: Murata Manufacturing Co., Ltd.
- Inventors: Yasuhiro Nishisaka; Kotaro Shimizu
- Web page: https://patentgrep.com/patent/US9520232B2

## CPC

- H01G 4/008: Selection of materials
- H01G 4/012: Form of non-self-supporting electrodes
- H01G 4/1227: {based on alkaline earth titanates}
- H01G 4/1245: {containing also titanates}
- H01G 4/2325: {characterised by the material of the terminals}
- H01G 4/248: the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence)
- H01G 4/30: Stacked capacitors (H01G4/33 takes precedence)
- H01G 4/12: Ceramic dielectrics {(H01G4/085 takes precedence)}
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)

## Abstract

A multilayer ceramic electronic component having outer electrodes that each include an end-face outer electrode disposed on an end face of a ceramic multilayer body and side-face outer electrodes formed by a sputtering method on side faces of the ceramic multilayer body and electrically connected to the end-face outer electrode. A sputtering electrode layer of each of the side-face outer electrodes in contact with the ceramic multilayer body is composed of a material containing 3% by mass or more of a metal having a standard oxidation-reduction potential of −2.36 to −0.74 V, and an outermost sputtering electrode layer which is an outermost layer of each of the side-face outer electrodes is composed of at least one of Sn and Bi or an alloy containing 5% by mass or more of at least one of Sn and Bi.

## Claims

### Claim 1

A multilayer ceramic electronic component comprising:
a ceramic multilayer body having stacked ceramic layers and inner electrodes disposed between adjacent ceramic layers of the stacked ceramic layers; and
first and second outer electrodes disposed on respective surfaces of the ceramic multilayer body, the first outer electrode being electrically connected to a first set of electrodes of the inner electrodes, and the second outer electrode being electrically connected to a second set of electrodes of the inner electrodes,
wherein the first and second outer electrodes each include:
an end-face outer electrode disposed on an end face of the ceramic multilayer body; and
a side-face outer electrode on side faces of the ceramic multilayer body and electrically connected to the end-face outer electrode, and wherein the side-face outer electrode includes:
(a) a first sputtered electrode layer in contact with the ceramic multilayer body, the first sputtered electrode layer including a material containing 3% by mass or more of a metal having a standard oxidation-reduction potential of −2.36 to −0.74 V, and
(b) a second sputtered electrode layer which is an outermost layer constituting the side-face outer electrode and which includes at least one of Sn and Bi or an alloy containing 5% by mass or more of at least one of Sn and Bi,
the first sputtered electrode layer including a material that is different from a material of the end-face outer electrode, and
the side-face outer electrode only overlaps an edge of the end-face outer electrode.

### Claim 2 (depends on 1)

The multilayer ceramic electronic component according to claim 1, wherein the metal contained in the first sputtered electrode layer is at least one selected from the group consisting of Mg, Al, Ti, W, and Cr.

### Claim 3 (depends on 1)

The multilayer ceramic electronic component according to claim 1, further comprising a plating metal film on a surface of each of the first and second outer electrodes.

### Claim 4 (depends on 2)

The multilayer ceramic electronic component according to claim 2, further comprising a plating metal film on a surface of each of the first and second outer electrodes.

### Claim 5 (depends on 1)

The multilayer ceramic electronic component according to claim 1, wherein the end-face outer electrode contains Ni.

### Claim 6 (depends on 5)

The multilayer ceramic electronic component according to claim 5, wherein the end-face outer electrode is a baked Ni electrode.