# US 9,520,223 B2 · Inductor and method for manufacturing the same

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- Number: US 9,520,223 B2
- Document ID: US9520223B2
- Status: Granted
- Kind: B2
- Application number: 14/223,567
- Filed: 2014-03-24
- Published: 2014-09-25
- Granted: 2016-12-13
- Earliest claimed: 2013-03-25
- Assignees: Samsung Electro-Mechanics Co., Ltd.
- Applicants: Samsung Electro-Mechanics Co., Ltd.
- Inventors: Young Seuck Yoo; Kang Heon Hur; Jin Hyuck Yang; Sung Kwon Wi; Jong Yun Lee; Young Do Kweon
- Web page: https://patentgrep.com/patent/US9520223B2

## CPC

- H01F 27/2804: {Printed windings}
- H01F 27/022: {Encapsulation}
- H01F 27/255: made from particles (H01F27/26 takes precedence)
- H01F 41/046: {structurally combined with ferromagnetic material}
- H01F 27/2809: {on stacked layers}
- H01F 27/292: {Surface mounted devices}
- Y10T 29/4902: Electromagnet, transformer or inductor
- H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

The present invention relates to an inductor. An inductor in accordance with an embodiment of the present invention includes: an insulating layer having a hole; a conductive pattern disposed on both surfaces of the insulating layer and having a structure in which portions disposed on the both surfaces are electrically connected to each other through the hole; and a magnetic layer disposed on the insulating layer to cover the conductive pattern, wherein the conductive pattern has a plating pattern formed by performing a plating process.

## Claims

### Claim 1

An inductor comprising:
an insulating layer having a hole;
a conductive pattern disposed on both surfaces of the insulating layer and having a structure in which portions disposed on the both surfaces are electrically connected to each other through the hole; and
a magnetic layer disposed on the insulating layer to cover the conductive pattern, wherein the conductive pattern comprises a first conductive pattern having a conducting portion formed in the hole and disposed on one surface of the insulating layer; and a second conductive pattern disposed on the other surface of the insulating layer and electrically connected to the first conductive pattern through the hole, and wherein a seed layer is only disposed between one surface of the insulating layer and an upper side of the first conductive pattern, wherein the second conductive pattern is a metal plate having an opening pattern, and wherein the metal plate is in direct contact with the surface of the insulating layer without any seed layer.

### Claim 2 (depends on 1)

The inductor according to claim 1,
wherein the first conductive pattern is a plating pattern.

### Claim 3 (depends on 1)

The inductor according to claim 1, wherein the conductive pattern has a metal pattern formed by etching a metal plate.

### Claim 4 (depends on 1)

The inductor according to claim 1,
wherein the second conductive pattern is a metal pattern formed by etching a metal plate.

### Claim 5 (depends on 1)

The inductor according to claim 1, wherein the insulating layer has a thickness of less than 40 μm.

### Claim 6 (depends on 1)

The inductor according to claim 1, wherein the conductive pattern comprises a first conductive pattern having a conducting portion formed in the hole and disposed on one surface of the insulating layer, wherein the thickness of the first conductive pattern is more than 2.5 times the thickness of the insulating layer.

### Claim 7 (depends on 1)

The inductor according to claim 1, wherein the conductive patterns disposed on both sides of the insulating layer based on the insulating layer have the same thickness.

### Claim 8 (depends on 1)

The inductor according to claim 1, wherein the magnetic layer is made of a metal-resin composite comprising an iron (Fe)-containing metal and a thermosetting resin.

### Claim 9 (depends on 1)

The inductor according to claim 1, wherein the conductive pattern has a multilayer coil structure disposed on both sides of the insulating layer with the insulating layer interposed therebetween.