# US 9,519,392 B2 · Touch screen panel fabrication method and touch screen panel > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,519,392 B2 - Document ID: US9519392B2 - Status: Granted - Kind: B2 - Application number: 14/684,902 - Filed: 2015-04-13 - Published: 2016-02-11 - Granted: 2016-12-13 - Earliest claimed: 2014-08-06 - Assignees: Samsung Display Co., Ltd. - Applicants: Samsung Display Co., Ltd. - Inventors: Joo-Han Bae; Jinhwan Kim - Web page: https://patentgrep.com/patent/US9519392B2 ## CPC - G06F 3/0443: {using a single layer of sensing electrodes} - G06F 3/0446: {using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes} - H05K 3/4644: {by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602)} - G06F 2203/04103: Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices - G06F 2203/04111: Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A method for fabricating a touch screen panel includes forming a metal layer on a substrate, and patterning the metal layer to form a metal pattern including a pad metal layer, a wiring metal layer, a connection metal layer, and a sensing metal layer including metal lines having a mesh shape. The method also includes forming a first transparent conductive layer on the substrate, forming an insulation layer on the first transparent conductive layer, patterning the insulation layer to form a wiring insulation layer, a connection insulation layer, and a sensing insulation layer, patterning the first transparent conductive layer to form a peripheral wiring, a connector, and a sensing electrode; forming a second transparent conductive layer on the substrate including the peripheral wiring, the connector, and the sensing electrode; and patterning the second transparent conductive layer to form a pad area and a bridge. ## Claims ### Claim 1 A touch screen panel fabrication method, comprising: forming a metal layer on a substrate; patterning the metal layer to form a metal pattern including a pad metal layer, a wiring metal layer, a connection metal layer, and a sensing metal layer including metal lines having a mesh shape; forming a first transparent conductive layer on the substrate; forming an insulation layer on the first transparent conductive layer; patterning the insulation layer to form a wiring insulation layer, a connection insulation layer, and a sensing insulation layer; patterning the first transparent conductive layer to form a peripheral wiring, a connector, and a sensing electrode; forming a second transparent conductive layer on the substrate including the peripheral wiring, the connector, and the sensing electrode; and patterning the second transparent conductive layer to form a pad area and a bridge. ### Claim 2 (depends on 1) The method as claimed in claim 1, wherein forming the metal pattern includes: forming a photoresist layer on the metal layer; exposing the photoresist layer through a first mask and developing the photoresist layer to form a first photoresist pattern; and etching the metal layer by using the first photoresist pattern as a mask to form the pad metal layer, the wiring metal layer, the connection metal layer, and a sensing metal layer including the metal lines having the mesh shape. ### Claim 3 (depends on 1) The method as claimed in claim 1, wherein patterning the insulation layer includes: forming a photoresist layer on the insulation layer; exposing the photoresist layer through a second mask and developing the photoresist layer to form a second photoresist pattern; and etching the insulation layer by using the photoresist pattern as a mask to form the wiring insulation layer, the connection insulation layer, and the sensing insulation layer. ### Claim 4 (depends on 1) The method as claimed in claim 1, wherein patterning the first transparent conductive layer includes etching the transparent conductive layer using the wiring insulation layer, the connection insulation layer, and the sensing insulation layer as a mask to form the peripheral wiring, the connector, and the sensing electrode. ### Claim 5 (depends on 1) The method as claimed in claim 1, wherein patterning the second transparent conductive layer includes: forming a photoresist layer on the second transparent layer; exposing the photoresist layer through a third mask and developing the photoresist layer to form a third photoresist pattern; and etching the second transparent conductive layer using the third photoresist pattern as a mask to form the pad area and the bridge. ### Claim 6 (depends on 1) The method as claimed in claim 1, wherein each of the first transparent conductive layer and the second transparent conductive layer includes at least one of indium tin oxide (ITO), indium zinc oxide (IZO), or indium gallium zinc oxide (IGZO). ### Claim 7 (depends on 1) The method as claimed in claim 1, wherein the metal layer includes at least one of Cu, Ti, Al, Ag, Au, Pt, Mo, a palladium-copper alloy (APC), or a silver-palladium alloy (AP). ### Claim 8 A touch screen panel fabrication method, comprising: forming a first transparent conductive layer on a substrate; patterning the first transparent conductive layer to form a transparent conductive pattern including a pad area, a wiring transparent conductive layer, a connection transparent conductive layer, and a sensing transparent conductive layer; forming a metal layer on the substrate; forming an insulation layer on the metal layer; patterning the insulation layer to form a wiring insulation layer, a connection insulation layer, and a sensing insulation layer; patterning the metal layer to form a peripheral wiring, a connector, and a sensing electrode; forming a second transparent conductive layer on the substrate including the pad area, the peripheral wiring, the connector, and the sensing electrode; and patterning the second transparent conductive layer to form a bridge. ### Claim 9 (depends on 8) The method as claimed in claim 8, wherein forming the transparent conductive pattern includes: forming a photoresist layer on the first transparent layer; exposing the photoresist layer to light through a first mask and developing the photoresist layer to form a first photoresist pattern; and etching the first transparent conductive layer using the first photoresist pattern as a mask to form the pad area, the wiring transparent conductive layer, the connection transparent conductive layer, and the sensing transparent conductive layer. ### Claim 10 (depends on 8) The method as claimed in claim 8, wherein patterning the insulation layer includes: forming a photoresist layer on the insulation layer; exposing the photoresist layer to light through a second mask and developing the photoresist layer to form a second photoresist pattern; and etching the insulation layer using the second photoresist pattern as a mask to form the wiring insulation layer, the connection insulation layer, and the sensing insulation layer. ### Claim 11 (depends on 8) The method as claimed in claim 8, wherein patterning the metal layer includes etching the metal layer using the connection insulation layer, the connection insulation layer and the sensing insulation layer as a mask to form the wiring insulation layer, the connection insulation layer, and the sensing insulation layer. ### Claim 12 (depends on 8) The method as claimed in claim 8, wherein forming the bridge includes: forming a photoresist layer on the second transparent layer; exposing the photoresist layer to light through a third mask and developing the photoresist layer to form a third photoresist pattern; and etching the second transparent conductive layer using the third photoresist pattern as a mask to form the bridge. ### Claim 13 A touch screen panel, comprising: a sensing electrode including first sensing electrodes and second sensing electrodes separated apart from each other in a first direction and a second direction intersecting the first direction; a connector connecting the second sensing electrodes spaced from each other in the second direction; a pad area electrically connected to the sensing electrode and including a pad metal layer and a pad transparent conductive layer having at least a portion on the pad metal layer; a peripheral wiring connecting the sensing electrode and the pad area and including a wiring metal layer, a wiring transparent conductive layer having at least a portion on the wiring metal layer, and a wiring insulation layer having at least a portion on the wiring transparent conductive layer; and a bridge connecting the first sensing electrodes spaced apart from each other in the first direction, wherein the sensing electrodes include: a sensing metal layer including metal lines having a mesh shape on a same layer as each of the pad metal layer and the wiring metal layer; a sensing transparent conductive layer on the sensing metal layer and including a same material as the wiring transparent conductive layer; and a sensing insulation layer having at least a portion on the sensing transparent conductive layer and including a same material as the wiring insulation layer, and wherein the bridge contacts the sensing metal layer and overlaps each of the first sensing electrodes and the connector. ### Claim 14 (depends on 13) The panel as claimed in claim 13, wherein the bridge includes a same material as the pad transparent conductive layer. ### Claim 15 (depends on 13) The touch screen panel as claimed in claim 13, wherein the connector includes: a connection metal layer on a same layer as each of the sensing metal layer, the pad metal layer and the wiring metal layer; a connection transparent conductive layer having at least a portion on the connection metal layer and including a same material as each of the sensing transparent conductive layer and the wiring transparent conductive layer; and a connection insulation layer having at least a portion on the connection transparent conductive layer and including a same material as each of the sensing insulation layer and the wiring insulation layer. ### Claim 16 (depends on 13) The panel as claimed in claim 13, wherein: the sensing transparent conductive layer has an area greater than an area of the transparent metal layer, and the sensing insulation layer has an area greater than an area of the sensing metal layer. ### Claim 17 A touch screen panel, comprising: a sensing electrode including first sensing electrodes and second sensing electrodes separated from each other in a first direction and a second direction intersecting the first direction; a connector connecting the second sensing electrodes spaced apart from each other in the second direction; a pad area electrically connected to the sensing electrode; peripheral wiring connecting the sensing electrode and the pad area, and including a wiring transparent conductive layer on a same layer as the pad area, a wiring metal layer on the wiring transparent conductive layer, and a wiring insulation layer having at least a portion on the wiring metal layer; and a bridge connecting the first sensing electrodes spaced apart from each other in the first direction, wherein the sensing electrodes include: a sensing transparent conductive layer on a same layer as each of the pad area and the wiring transparent conductive layer, and including a same material as each of the pad area and the wiring transparent conductive layer; a sensing metal layer on the sensing transparent conductive layer and including metal lines having a mesh shape; and a sensing insulation layer having at least a portion on the sensing metal layer, and including a same material as the wiring insulation layer, and wherein the bridge contacts the sensing transparent conductive layer and overlaps each of at least a portion of the first sensing electrodes and the connector. ### Claim 18 (depends on 17) The panel as claimed in claim 17, wherein the bridge includes at least one of indium tin oxide, indium zinc oxide, or indium gallium zinc oxide. ### Claim 19 (depends on 17) The panel as claimed in claim 17, wherein the connector includes: a connection transparent conductive layer on a same layer as each of the pad area and the wiring transparent conductive layer; a connection metal layer on the connection transparent conductive layer, and including a same material as each of the sensing metal layer and the wiring metal layer; and a connection insulation layer having at least a portion on the connection metal layer, and including a same material as each of the sensing insulation layer and the wiring insulation layer.