# US 9,519,319 B2 · Self-supporting thermal tube structure for electronic assemblies > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,519,319 B2 - Document ID: US9519319B2 - Status: Granted - Kind: B2 - Application number: 14/244,716 - Filed: 2014-04-03 - Published: 2015-09-17 - Granted: 2016-12-13 - Earliest claimed: 2014-03-14 - Assignees: SanDisk Technologies LLC - Applicants: SanDisk Enterprise IP LLC - Inventors: David Dean; Robert W. Ellis - Web page: https://patentgrep.com/patent/US9519319B2 ## CPC - G06F 1/20: Cooling means - G01R 1/0408: {Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets (G01R1/067 takes precedence; mass production testing systems G01R31/59; testing of connections G01R31/66; for testing printed circuit boards G01R31/2808)} - G01R 31/2601: {Apparatus or methods therefor (G01R31/2607, G01R31/2642 take precedence)} - G01R 31/2891: {related to sensing or controlling of force, position, temperature (G01R31/2874 takes precedence; sensing of force G01L; sensing of position G01B, G01D; sensing of temperature G01K; controlling in general G05)} - H05K 1/147: {at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit (H05K1/148 takes precedence)} - H05K 7/20727: {within server blades for removing heat from heat source} - H10W 40/43: by flowing gases, e.g. forced air cooling - H10W 70/688: {Flexible insulating substrates} - G01R 31/2834: {Automated test systems [ATE]; using microprocessors or computers (G01R31/317 takes precedence; ATE for detection of defective computer hardware G06F11/2736)} - G01R 31/2887: {involving moving the probe head or the IC under test; docking stations (moving single probes G01R1/06705; moving individual probes in multiple probes G01R1/07392)} - H05K 1/0201: {Thermal arrangements, e.g. for cooling, heating or preventing overheating} - H05K 2201/042: Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other - H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs} - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Various embodiments described herein include systems, methods and/or devices for dissipating heat generated by electronic components in an electronic system (e.g., a memory system that includes closely spaced memory modules). In one aspect, an electronic assembly includes a first circuit board, a second circuit board flexibly coupled to the first circuit board, a connecting module coupled to the second circuit board, and a fastener. The fastener is configured to couple the first circuit board to the connecting module such that the first circuit board and the second circuit board are substantially parallel and are separated by a space, wherein the space forms at least part of a channel that is configured to direct airflow through the space between the first circuit board, second circuit board, and connecting module. ## Claims ### Claim 1 An electronic assembly for dissipating heat, comprising: a first circuit board including a first fastener; a second circuit board flexibly coupled to the first circuit board; and a connecting module including a rigid board that has a first edge flexibly coupled to the second circuit board and a second edge opposite the first edge, the second edge of the rigid board further including a second fastener that is distinct from the first fastener of the first circuit board, the second fastener configured to be received within the first fastener for coupling the rigid board directly to the first circuit board at a substantially right angle; wherein the first and second fasteners are configured to couple the first circuit board to the connecting module such that the first circuit board and the second circuit board are substantially parallel and are separated by a space, wherein the space forms at least part of a channel that is configured to direct airflow through the space between the first circuit board, second circuit board, and connecting module. ### Claim 2 (depends on 1) The electronic assembly of claim 1, wherein the first circuit board is flexibly coupled to the second circuit board with a flexible interconnect. ### Claim 3 (depends on 2) The electronic assembly of claim 2, wherein the flexible interconnect electrically couples the first circuit board to the second circuit board. ### Claim 4 (depends on 3) The electronic assembly of claim 3, wherein a first side of the channel comprises the connecting module, and a second side of the channel comprises the flexible interconnect. ### Claim 5 (depends on 1) The electronic assembly of claim 1, wherein the first circuit board is flexibly coupled to the second circuit board with one or more flexible interconnects and one or more additional circuit boards. ### Claim 6 (depends on 1) The electronic assembly of claim 1, wherein the second circuit board is flexibly coupled to the connecting module. ### Claim 7 (depends on 6) The electronic assembly of claim 6, wherein the second circuit board is flexibly coupled to the connecting module with a flexible interconnect. ### Claim 8 (depends on 1) The electronic assembly of claim 1, wherein at least one of the first circuit board and the second circuit board includes one or more three-dimensional (3D) memory devices. ### Claim 9 (depends on 7) The electronic assembly of claim 7, wherein the flexible interconnect electrically couples the second circuit board to the connecting module. ### Claim 10 (depends on 1) The electronic assembly of claim 1, wherein the first circuit board includes two opposite surfaces, and a plurality of electronic components are disposed on both of the two opposite surfaces of the first circuit board. ### Claim 11 (depends on 1) The electronic assembly of claim 1, wherein the electronic assembly is mounted on a base board, and the first and second circuit boards are substantially parallel to the base board. ### Claim 12 (depends on 1) The electronic assembly of claim 1, wherein the first fastener is selected from a group consisting of holes, notches and slots. ### Claim 13 (depends on 1) The electronic assembly of claim 1, wherein the first and the second fasteners each comprise one or more solder pads. ### Claim 14 (depends on 1) The electronic assembly of claim 1, wherein the first circuit board includes a hole in a substrate of the first circuit board, and the connecting module includes a protrusion configured to mate with the hole in the first circuit board. ### Claim 15 (depends on 1) The electronic assembly of claim 1, wherein the connecting module includes a hole in a substrate of the connecting module, and the first circuit board includes a protrusion configured to mate with the hole in the connecting module. ### Claim 16 (depends on 1) The electronic assembly of claim 1, wherein the first circuit board includes a notch in a substrate of the first circuit board, and the connecting module includes a protrusion configured to mate with the notch in the first circuit board. ### Claim 17 (depends on 1) The electronic assembly of claim 1, wherein the connecting module includes a notch in a substrate of the connecting module, and the first circuit board includes a protrusion configured to mate with the notch in the connecting module. ### Claim 18 (depends on 1) The electronic assembly of claim 1, wherein the first and second fasteners are configured to mechanically and electrically couple the first circuit board to the second circuit board. ### Claim 19 (depends on 1) The electronic assembly of claim 1, wherein the second circuit board includes one or more third fasteners configured to couple the second circuit board to a base board. ### Claim 20 (depends on 1) The electronic assembly of claim 1, wherein at least one of the first circuit board, second circuit board, and connecting module comprises one or more solid state drives (SSDs) or energy hold capacitor circuitry. ### Claim 21 A method of manufacturing an electronic assembly for dissipating heat, comprising: providing an electronic assembly, comprising: a first circuit board including a first fastener; a second circuit board flexibly coupled to the first circuit board; and a connecting module including a rigid board that has a first edge flexibly coupled to the second circuit board and a second edge opposite the first edge, the second edge of the rigid board further including a second fastener that is distinct from the first fastener of the first circuit board, the second fastener configured to be received within the first fastener for coupling the rigid board directly to the first circuit board at a substantially right angle; and coupling the first circuit board to the connecting module with the first and second fasteners, such that the first circuit board and the second circuit board are substantially parallel and are separated by a space, wherein the space forms at least part of a channel that is configured to direct airflow through the space between the first circuit board, second circuit board, and connecting module. ### Claim 22 (depends on 21) The method of claim 21, further comprising, prior to coupling the first circuit board to the connecting module: while the first circuit board and the second circuit board are not substantially parallel, coupling the second circuit board to a base circuit board; and manipulating the electronic assembly so as to cause the first circuit board to be positioned substantially parallel to the second circuit board, wherein manipulating the electronic assembly so as to cause the first circuit board to be positioned substantially parallel to the second circuit board causes at least a portion of a first flexible interconnect coupling the first circuit board and the second circuit board to be deformed. ### Claim 23 (depends on 22) The method of claim 22, wherein the connecting module is flexibly coupled to the second circuit board, the method further comprising, prior to manipulating the first circuit board: manipulating the electronic assembly so as to cause the connecting module to be positioned substantially perpendicular to the second circuit board, wherein manipulating the electronic assembly causes at least a portion of a second flexible interconnect coupling the connecting module to the second circuit board to be deformed. ### Claim 24 (depends on 21) The method of claim 21, wherein at least one of the first circuit board and the second circuit board comprises one or more three-dimensional (3D) memory devices, one or more solid state drives (SSDs), or energy hold capacitor circuitry.