# US 9,519,024 B2 · Apparatus for testing package-on-package semiconductor device and method for testing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,519,024 B2 - Document ID: US9519024B2 - Status: Granted - Kind: B2 - Application number: 14/617,892 - Filed: 2015-02-09 - Published: 2015-08-13 - Granted: 2016-12-13 - Earliest claimed: 2014-02-10 - Assignees: Chroma Ate Inc. - Applicants: Chroma Ate Inc. - Inventors: Chien-Ming Chen - Web page: https://patentgrep.com/patent/US9519024B2 ## CPC - G01R 31/2893: {Handling, conveying or loading, e.g. belts, boats, vacuum fingers (G01R31/2867 takes precedence; handling semiconductor devices or wafers during manufacture or treatment H10P72/00)} - G01R 1/0433: {Sockets for IC's or transistors} - G01R 31/2867: {Handlers or transport devices, e.g. loaders, carriers, trays} - G01R 31/2887: {involving moving the probe head or the IC under test; docking stations (moving single probes G01R1/06705; moving individual probes in multiple probes G01R1/07392)} - G01R 31/2896: {Testing of IC packages; Test features related to IC packages (containers per se H10W76/10, encapsulations per se H10W74/00)} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An apparatus for testing a package-on-package semiconductor device comprises a pick and place device for loading a first chip into or unloading the first chip from a test socket and a lifting and rotating arm for moving a chip placement module which receives a second chip to a position between the pick and place device and the test socket. The pick and place device and the chip placement module are lowered, and then a test process is performed. After the test process is completed, the pick and place device and the chip placement module are lifted, and the lifting and rotating arm moves the chip placement module to one side of the pick and place device. Accordingly, a method for testing the semiconductor device could be performed automatically so as to greatly enhance test efficiency and accuracy and to significantly reduce costs. ## Claims ### Claim 1 An apparatus for testing a package-on-package semiconductor device, comprising: a pick and place device; a test socket for receiving a first chip, the test socket being located under the pick and place device; a lifting and rotating arm, located on one side of the pick and place device; a chip placement module, provided on the lifting and rotating arm, for receiving a second chip, a bottom surface of the chip placement module being provided with a plurality of contact terminals, the second chip being electrically connected to the plurality of contact terminals; and a main controller, electrically connected to the pick and place device, the test socket, the lifting and rotating arm, and the chip placement module; wherein the main controller is configured to control the pick and place device to load the first chip into or unload the same out of the test socket, control the lifting and rotating arm to move the chip placement module to a position between the pick and place device and the test socket or adjacent to the pick and place device and control the pick and place device to lower the chip placement module so that the plurality of contact terminals are brought into electrical contact with the first chip on the test socket for performing a test process. ### Claim 2 (depends on 1) The apparatus of claim 1, wherein a bottom surface of the pick and place device is provided with a suction head; and wherein the main controller is configured to control the chip placement module to move to the position between the pick and place device and the test socket so as to join the bottom surface of the pick and place device, and controls the suction head to suck the second chip. ### Claim 3 (depends on 1) The apparatus of claim 1, further comprising a position sensor, provided on the lifting and rotating arm and electrically connected to the main controller, for detecting the position of the chip placement module. ### Claim 4 (depends on 1) The apparatus of claim 1, further comprising a chip shuttle for carrying the first chip, the chip shuttle being electrically connected to the main controller, the main controller being configured to control the chip shuttle to move to the position between the pick and place device and the test socket or move away from the pick and place device. ### Claim 5 (depends on 1) The apparatus of claim 1, wherein the chip placement module comprises a cushion and a chip carrier, the cushion being provided on the chip carrier, and the second chip being received in the chip carrier. ### Claim 6 (depends on 1) The apparatus of claim 1, wherein the pick and place device further comprises an air damper, and the suction head is provided under the air damper. ### Claim 7 A method for testing a package-on-package semiconductor device, comprising the steps of: (A) loading a first chip into a test socket by a pick and place device; (B) moving a chip placement module to a position between the pick and place device and the test socket by a lifting and rotating arm, the chip placement module receiving a second chip, a bottom surface of the chip placement module being provided with a plurality of contact terminals, and the second chip electrically being connected to the plurality of contact terminals; (C) lowering the pick and place device and the chip placement module so that the plurality of contact terminals are electrically contacted to the first chip on the test socket for performing a test process; (D) lifting the pick and place device and the chip placement module, and moving the chip placement module to one side of the pick and place device by the lifting and rotating arm; and (E) unloading the first chip which is already tested out of the test socket by the pick and place device. ### Claim 8 (depends on 7) The method of claim 7, wherein the bottom surface of the pick and place device is provided with a suction head; and wherein in the step (B), the chip placement module is moved to the position between the pick and place device and test socket so as to join the bottom surface of the pick and place device, and the suction head sucks the second chip. ### Claim 9 (depends on 8) The method of claim 8, wherein in the step (B), the chip placement module is moved to the position between the pick and place device and the test socket by the lifting and rotating arm, and then the chip placement module is lifted to join the bottom surface of the pick and place device. ### Claim 10 (depends on 9) The method of claim 9, wherein in the step (D), after the pick and place device and the chip placement module are lifted, the chip placement module is lowered by the lifting and rotating arm so that the chip placement module is detached from the pick and place device and then moved to the one side of the pick and place device by the lifting and rotating arm.