# US 9,519,007 B2 · Handling system for testing electronic components > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,519,007 B2 - Document ID: US9519007B2 - Status: Granted - Kind: B2 - Application number: 13/753,706 - Filed: 2013-01-30 - Published: 2013-08-15 - Granted: 2016-12-13 - Earliest claimed: 2012-02-10 - Assignees: Asm Technology Singapore Pte Ltd - Applicants: Chi Wah Cheng; Wang Lung Tse; Chi Kit Cheung; Cho Tao Cheung - Inventors: Chi Wah Cheng; Wang Lung Tse; Chi Kit Cheung; Cho Tao Cheung - Web page: https://patentgrep.com/patent/US9519007B2 ## CPC - G01R 31/01: Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station (testing of cables continuously passing the testing apparatus G01R31/59; testing dielectric strength or breakdown voltage G01R31/12) - G01R 1/02: General constructional details - G01R 31/2891: {related to sensing or controlling of force, position, temperature (G01R31/2874 takes precedence; sensing of force G01L; sensing of position G01B, G01D; sensing of temperature G01K; controlling in general G05)} - G01R 31/2893: {Handling, conveying or loading, e.g. belts, boats, vacuum fingers (G01R31/2867 takes precedence; handling semiconductor devices or wafers during manufacture or treatment H10P72/00)} - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) ## Abstract A handling system for testing electronic components comprises a rotary turret and pick heads mounted on the rotary turret, each pick head being configured to hold a respective electronic component provided by a supply source. A carrier system which is positionable adjacent to the rotary turret is configured to carry a plurality of electronic components. The carrier system is receivable by a testing station that is operative to simultaneously test a plurality of the electronic components which have been arranged on the carrier system. The pick heads or other transfer mechanism may transfer the electronic components onto the carrier system prior to testing the same at the testing station and remove electronic components from the carrier system after testing the same at the testing station. ## Claims ### Claim 1 A handling system for testing electronic components, comprising: a rotary turret; pick heads mounted on the rotary turret, each pick head being configured to hold a respective electronic component provided by a supply source; a carrier system which is positionable adjacent to the rotary turret and which is configured to carry electronic components, wherein the carrier system comprises a first buffer carrier for carrying a first array of a first plurality of electronic components and a second buffer carrier for carrying a second array of a second plurality of electronic components; and a testing station which is configured for receiving the carrier system; and is configured to simultaneously test the first array of the first plurality of electronic components which have been arranged on the first buffer carrier of the carrier system while the second buffer carrier stands by at the testing station, the second buffer carrier proceeding for testing of the second array of the second plurality of electronic components at the testing station after the testing station completes testing of the first array of the first plurality of electronic components on the first buffer carrier; wherein the pick heads are operative to transfer the electronic components onto the first buffer carrier and the second buffer carrier prior to testing the same at the testing station and to remove electronic components from the first buffer carrier and the second buffer carrier after testing the same at the testing station; wherein the first array of the first plurality of electronic components are held by a first plurality of pick heads and the second array of the second plurality of electronic components are held by a second plurality of pick heads; wherein each of the first buffer carrier and the second buffer carrier is movable from a position of the rotary turret to a position of the testing station; and wherein each of the first buffer carrier and the second buffer carrier is movable at the same time from the position of the rotary turret to the position of the testing station. ### Claim 2 (depends on 1) The handling system as claimed in claim 1, further comprising a conveying mechanism for conveying the carrier system between positions of the rotary turret and the testing station. ### Claim 3 (depends on 2) The handling system as claimed in claim 2, wherein the conveying mechanism comprises one or more linear arms operative to hold and convey the carrier system between the rotary turret and the testing station linearly. ### Claim 4 (depends on 2) The handling system as claimed in claim 2, wherein the conveying mechanism comprises a rotary arm which is configured to hold and convey the carrier system between the rotary turret and the testing station. ### Claim 5 (depends on 4) The handling system as claimed in claim 4, wherein the rotary arm is configured to simultaneously hold and convey a plurality of buffer carriers comprised in the carrier system, such that the plurality of buffer carriers are equally spaced around the rotary arm. ### Claim 6 (depends on 1) The handling system as claimed in claim 1, further comprising an offloading station located adjacent to the rotary turret to which the pick heads transfer the electronic components which have been removed from the carrier system. ### Claim 7 (depends on 1) The handling system as claimed in claim 1, wherein the first plurality of electronic components arranged on the first buffer carrier are tested at the testing station while electronic components are transferred by the pick heads to the second buffer carrier adjacent to the rotary turret. ### Claim 8 (depends on 1) The handling system as claimed in claim 1, further comprising an inspection station operative to visually inspect the electronic components while they are being held by the pick heads. ### Claim 9 (depends on 1) The handling system as claimed in claim 1, further comprising a temperature control zone through which the carrier system is conveyed, the temperature control zone being operative to bring the electronic components to a desired temperature prior to testing the electronic components at the testing station. ### Claim 10 (depends on 9) The handling system as claimed in claim 9, wherein the temperature control zone further comprises a heating zone and a separate cooling zone adjacent to the heating zone, the heating zone being operative to elevate a temperature of the electronic components and the cooling zone being operative to lower a temperature of the electronic components to an ambient temperature. ### Claim 11 A handling system for testing electronic components, comprising: an onloading station; a carrier system which is positionable next to the onloading station, the carrier system being configured to carry electronic components transferred from the onloading station, wherein the carrier system comprises a first buffer carrier for carrying a first array of a first plurality of electronic components and a second buffer carrier for carrying a second array of a second plurality of electronic components; a testing station which is configured for receiving the carrier system; and is configured to simultaneously test the first array of the first plurality of electronic components which have been arranged on the first buffer carrier of the carrier system while the second buffer carrier stands by at the testing station, the second buffer carrier proceeding for testing of the second array of the second plurality of electronic components at the testing station after the testing station completes testing of the first array of the first plurality of electronic components on the first buffer carrier; a rotary turret; and pick heads mounted on the rotary turret, each pick head being configured to hold a respective electronic component provided by the carrier system; wherein the pick heads are operative to remove electronic components from the first buffer carrier and the second buffer carrier after testing the same at the testing station; wherein the first array of the first plurality of electronic components are held by a first plurality of pick heads and the second array of the second plurality of electronic components are held by a second plurality of pick heads; wherein each of the first buffer carrier and the second buffer carrier is movable from a position of the rotary turret to a position of the testing station; and wherein each of the first buffer carrier and the second buffer carrier is movable at the same time from the position of the rotary turret to the position of the testing station. ### Claim 12 (depends on 11) The handling system as claimed in claim 11, further comprising a singulation system connected to the onloading station for providing singulated electronic components to the carrier system. ### Claim 13 A method for testing electronic components, comprising the steps of: providing electronic components from a supply source to pick heads mounted on a rotary turret, each pick head being configured to hold a respective electronic component; transferring a plurality of electronic components from the pick heads to a carrier system positioned adjacent to the rotary turret, wherein the carrier system comprises a first buffer carrier for carrying a first array of a first plurality of electronic components and a second buffer carrier for carrying a second array of a second plurality of electronic components; moving the first buffer carrier of the carrier system to a testing station for simultaneously testing the first array of the first plurality of electronic components which have been arranged on the first buffer carrier of the carrier system; testing the first array of the first plurality of electronic components on the first buffer carrier while the second buffer carrier stands by at the testing station, the second buffer carrier proceeding for testing of the second array of the second plurality of electronic components at the testing station after the testing station completes testing of the first array of the first plurality of electronic components on the first buffer carrier; and after testing the electronic components, removing the plurality of electronic components from the first buffer carrier and the second buffer carrier with the pick heads, wherein each of the first buffer carrier and the second buffer carrier is movable from a position of the rotary turret to a position of the testing station; wherein the first array of the first plurality of electronic components are held by a first plurality of pick heads and the second array of the second plurality of electronic components are held by a second plurality of pick heads; and wherein each of the first buffer carrier and the second buffer carrier is movable at the same time from the position of the rotary turret to the position of the testing station. ### Claim 14 (depends on 13) The method for testing electronic components as claimed in claim 13, further comprising holding and conveying the carrier system between the rotary turret and the testing station linearly using linear arms. ### Claim 15 (depends on 13) The method for testing electronic components as claimed in claim 13, further comprising holding and conveying the carrier system with a rotary arm that is configured to simultaneously hold and convey a plurality of buffer carriers comprised in the carrier system, such that the plurality of buffer carriers are equally spaced around the rotary arm. ### Claim 16 (depends on 13) The method for testing electronic components as claimed in claim 13, further comprising the step of transferring the electronic components which have been removed from the carrier system with the pick heads to an offloading station located adjacent to the rotary turret. ### Claim 17 (depends on 13) The method for testing electronic components as claimed in claim 13, wherein the first plurality of electronic components arranged on the first buffer carrier are tested at the testing station while electronic components are transferred by the pick heads to the second buffer carrier adjacent to the rotary turret. ### Claim 18 (depends on 13) The method for testing electronic components as claimed in claim 13, further comprising the step of bringing the electronic components to a desired temperature prior to testing the electronic components at the testing station by conveying the electronic components through a temperature control zone. ### Claim 19 (depends on 18) The method for testing electronic components as claimed in claim 18, wherein the temperature control zone further comprises a heating zone and a separate cooling zone adjacent to the heating zone, the heating zone being operative to elevate a temperature of the electronic components and the cooling zone being operative to lower a temperature of the electronic components to an ambient temperature.