# US 9,518,320 B2 · Copper alloy sputtering target

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- Number: US 9,518,320 B2
- Document ID: US9518320B2
- Status: Granted
- Kind: B2
- Application number: 14/470,074
- Filed: 2014-08-27
- Published: 2015-03-05
- Granted: 2016-12-13
- Earliest claimed: 2013-08-30
- Assignees: Mitsubishi Materials Corporation
- Applicants: Mitsubishi Materials Corporation
- Inventors: Satoru Mori; Toshio Sakamoto; Kiyoyuki Ookubo
- Web page: https://patentgrep.com/patent/US9518320B2

## CPC

- C23C 14/3414: {Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy}
- C22C 9/00: Alloys based on copper
- H01J 37/3426: {Material}
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)
- C22C: ALLOYS (treatment of alloys C21D, C22F)
- H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H)

## Abstract

A copper alloy sputtering target is made of a copper alloy having a composition containing Ca in a range of 0.3 mass % to 1.7 mass % with a remainder of Cu and inevitable impurities, a Ca-segregated phase (10) in which Ca is segregated is dispersed in a matrix phase, and the Ca-segregated phase contains a Cu-dispersed phase (11) made of Cu.

## Claims

### Claim 1

A copper alloy sputtering target made of a copper alloy having a composition comprising Ca in a range of 0.3 mass % to 1.7 mass % with a remainder of Cu and inevitable impurities,
wherein Ca-segregated phases in which Ca is segregated are dispersed in a matrix phase,
the Ca-segregated phase contains Cu-dispersed phases made of Cu,
an average grain diameter of the Ca-segregated phases is less than 10 μm, and
an average grain diameter of the Cu-dispersed phases is set to 6 μm or less.