# US 9,518,205 B2 · Unsaturated polyester resin composition and encapsulated motor

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- Number: US 9,518,205 B2
- Document ID: US9518205B2
- Status: Granted
- Kind: B2
- Application number: 14/358,495
- Filed: 2012-12-13
- Published: 2014-11-13
- Granted: 2016-12-13
- Earliest claimed: 2011-12-14
- Assignees: Showa Denko K.K.; Toyota Jidosha Kabushiki Kaisha
- Applicants: Showa Denko K.K.; Toyota Jidosha Kabushiki Kaisha
- Inventors: Shotaro Itami; Masashige Tanaka; Hiroyuki Majima; Ryujin Ishiuchi; Hiroaki Sugita
- Web page: https://patentgrep.com/patent/US9518205B2

## CPC

- C09K 5/14: Solid materials, e.g. powdery or granular
- H10W 74/473: {containing a filler}
- C08F 283/01: on to unsaturated polyesters {(C08F283/004 takes precedence)}
- H02K 3/30: Windings characterised by the insulating material
- H02K 5/02: Casings or enclosures characterised by the material thereof
- H02K 5/08: Insulating casings
- C09K: MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- C08F: MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- H02K: DYNAMO-ELECTRIC MACHINES (dynamo-electric relays H01H53/00; conversion of DC or AC input power into surge output power {H03K3/53})

## Abstract

The present invention is an unsaturated polyester resin composition comprising an unsaturated polyester (a), a monomer (b) having one polymerizable carbon-carbon double bond, a monomer (c) having two or more of (meth)acrylate groups, a filler (d) having high thermal conductivity, a glass fiber (e), a low profile additive (f), a curing agent (g), and a polymerization inhibitor (h), wherein the ratio by weight of the ingredient (b) to the ingredient (c) is from 50:50 to 75:25 and the unsaturated polyester resin composition comprises 400 to 1400 parts by weight of the ingredient (d) based on the total 100 parts by weight of the ingredients (a), (b), and (c). This unsaturated polyester resin composition has excellent curing properties without losing storage stability which can be used to provide a cured product having a low mold shrinkage ratio and high thermal conductivity.

## Claims

### Claim 1

An unsaturated polyester resin composition comprising:
an unsaturated polyester (a),
styrene (b),
one or more monomers (c) selected from the group consisting of ethylene glycol dimethacrylate, diethylene glycol dimethacrylate, PEG #200 dimethacrylate and trimethylolpropane trimethacrylate,
aluminum hydroxide and/or aluminum oxide (d),
a glass fiber (e),
a low profile additive (f),
a curing agent (g), and
a polymerization inhibitor (h),
wherein the ratio by weight of the ingredient (b) to the ingredient (c) is from 50:50 to 73:27 and the unsaturated polyester resin composition comprises 400 to 1350 parts by weight of the ingredient (d) based on the total 100 parts by weight of the ingredients (a), (b), and (c).

### Claim 2 (depends on 1)

The unsaturated polyester resin composition according to claim 1, wherein the ingredient (g) is at least one compound selected from the group consisting of t-butylperoxy-2-ethylhexanoate, t-hexylperoxy-2-ethylhexanoate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, benzoyl peroxide, 1,1-di-t-butylperoxycyclohexane, 1,1-di-t-hexylperoxycyclohexane, 1,1-di-t-butylperoxy-3,3,5-trimethylcyclohexane, t-butylperoxy isopropyl carbonate, t-hexylperoxy isopropyl carbonate, t-butyl peroxybenzoate, t-hexyl peroxybenzoate, 1,6-bis(t-butylperoxycarbonyloxy)hexane, dicumyl peroxide, and di-t-butyl peroxide.

### Claim 3 (depends on 1)

An encapsulated motor, produced by encapsulation molding of a motor component with the unsaturated polyester resin composition according to claim 1.

### Claim 4 (depends on 1)

A cured product, obtained by curing the unsaturated polyester resin composition according to claim 1.

### Claim 5 (depends on 1)

The unsaturated polyester resin composition according to claim 1, wherein the ratio by weight of the ingredient (b) to the ingredient (c) is from 55:45 to 65:35.