# US 9,518,189 B2 · Binder solutions

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 9,518,189 B2
- Document ID: US9518189B2
- Status: Granted
- Kind: B2
- Application number: 14/370,975
- Filed: 2013-01-09
- Published: 2014-12-25
- Granted: 2016-12-13
- Earliest claimed: 2012-01-09
- Assignees: The Chemours Company Fc, LLC
- Applicants: The Chemours Company Fc LLC
- Inventors: Richard Alan Reynolds
- Web page: https://patentgrep.com/patent/US9518189B2

## CPC

- C09D 181/06: Polysulfones; Polyethersulfones
- C09D 5/002: {Priming paints (C09D5/08 takes precedence)}
- C09D 7/20: Diluents or solvents
- C09D 179/08: Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G 73/10: Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G 73/1046: {Polyimides containing oxygen in the form of ether bonds in the main chain}
- C08G 73/14: Polyamide-imides
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS

## Abstract

The present invention is directed to alternate solvent systems for polyethersulfone, polyamideimide, polyether imide, polyimide, and/or polyamic acid binder solutions. The present invention provides stable binder solutions equivalent or superior to current binder solvent solutions.

## Claims

### Claim 1

A binder solution comprising polyethersulfone, polyamideimide, polyether imide, polyimide, or mixtures thereof, and solvent comprising acetoacetamides.

### Claim 2 (depends on 1)

A binder solution of claim 1 further comprising one or more of: viscosity modifiers, thinning solvents, binders, pigments, fillers, dispersing aids, surface tension modifiers, and fluoropolymers.

### Claim 3 (depends on 2)

The binder solution of claim 2 wherein the thinning solvent is a diether or a glycol ether acetate.

### Claim 4 (depends on 1)

The binder solution of claim 1 wherein the solvent comprises diethyl acetoacetamide.

### Claim 5 (depends on 1)

A binder solution of claim 1, wherein the solvent comprises a mixture of diethyl acetoacetamide and at least one solvent selected from the group consisting of: delta-valerolactone, gamma-valerolactone, gamma butyrolactone, epsilon-caprolactone, dimethyl piperidone, tetramethyl guanidine, methyl acetoacetate, dodecyl acetoacetate, isobutyl acetoacetate, isopropyl acetoacetate, and ethyl acetoacetate.

### Claim 6 (depends on 1)

The binder solution of claim 1 having a resin binder solids content of at least 30%, as a percentage by weight of the total composition, and a viscosity of no greater than 20,000 mPa·s.

### Claim 7 (depends on 1)

The binder solution of claim 1 wherein the binder solution comprises polyethersulfone and solvent comprises acetoacetamide.

### Claim 8 (depends on 7)

The binder solution of claim 7 comprising polyethersulfone and diethylacetoacetamide.
