# US 9,517,962 B2 · Plate-shaped object processing method

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- Number: US 9,517,962 B2
- Document ID: US9517962B2
- Status: Granted
- Kind: B2
- Application number: 14/660,146
- Filed: 2015-03-17
- Published: 2015-09-17
- Granted: 2016-12-13
- Earliest claimed: 2014-03-17
- Assignees: Disco Corporation
- Applicants: Disco Corporation
- Inventors: Noboru Takeda; Hiroshi Morikazu; Xiaoming Qiu; Fumiteru Tashino; Ken Togashi
- Web page: https://patentgrep.com/patent/US9517962B2

## CPC

- C03B 33/0222: {Scoring using a focussed radiation beam, e.g. laser}
- B23K 20/10: making use of vibrations, e.g. ultrasonic welding
- B23K 26/0006: {taking account of the properties of the material involved (B23K26/32, B23K26/40 take precedence)}
- B23K 26/03: Observing, e.g. monitoring, the workpiece
- B23K 26/0624: {using ultrashort pulses, i.e. pulses of 1 ns or less}
- B23K 26/0853: {Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane}
- B23K 26/364: for making a groove or trench, e.g. for scribing a break initiation groove
- B23K 26/384: of specially shaped holes
- B23K 26/53: for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
- C03B 33/033: Apparatus for opening score lines in glass sheets
- B23K 2101/40: Semiconductor devices
- B23K 2103/52: {Ceramics}
- B65G 2249/04: Arrangements of vacuum systems or suction cups
- C03B 33/04: Cutting or splitting in curves, especially for making spectacle lenses
- C03B: MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B65G: TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS (packaging B65B; handling thin or filamentary materials, e.g. paper sheets or thread, B65H; cranes B66C; portable mobile or lifting or hauling appliances, e.g. hoists, B66D; devices for lifting or lowering goods for loading or unloading purposes, e.g. fork-lift trucks, B66F9/00; emptying bottles, jars, casks, barrels or similar containers, not otherwise provided for, B67C9/00; delivering or transferring liquids B67D; filling or discharging vessels for liquefied, solidified or compressed gases F17C; pipe-line systems for fluids F17D)

## Abstract

A plate-shaped object processing method forms a through hole of a desired shape in a plate-shaped object. The method includes a through hole contour forming step of performing laser processing within the plate-shaped object along a contour of the through hole to be formed, by positioning, within the plate-shaped object, a focal point of a pulsed laser beam of a wavelength capable of passing through the plate-shaped object. The beam is applied along the contour of the through hole to be formed by a pulsed laser beam irradiation unit including a condenser applying the laser beams. A through hole is formed by breaking the laser-processed contour of the through hole and forming the through hole by positioning an ultrasonic transducer of an ultrasonic wave applying unit in correspondence with the contour of the through hole to be formed, and applying an ultrasonic wave.

## Claims

### Claim 1

A plate-shaped object processing method forming a through hole of a desired shape in a plate-shaped object, the plate-shaped object processing method comprising:
a through hole contour forming step of performing laser processing within the plate-shaped object along a contour of the through hole to be formed, by positioning, within the plate-shaped object, a focal point of a pulsed laser beam of a wavelength capable of passing through the plate-shaped object and applying the pulsed laser beam along the contour of the through hole to be formed by pulsed laser beam irradiation means including a condenser applying the laser beam; and
a through hole forming step of breaking the laser-processed contour of the through hole to be formed and forming the through hole in the plate-shaped object by positioning an ultrasonic transducer of ultrasonic wave applying means in correspondence with the contour of the through hole to be formed in the plate-shaped object resulting from the through hole contour forming step and applying an ultrasonic wave.

### Claim 2 (depends on 1)

The plate-shaped object processing method according to claim 1,
wherein a value obtained by dividing a numerical aperture (NA) of a condensing lens of the condenser by an index of refraction (N) of the plate-shaped object is set in a range of 0.05 to 0.2, and
the through hole contour forming step forms, along the contour of the through hole to be formed, shield tunnels in which pores and amorphous substances shielding the pores are grown between the focal point and a side on which the pulsed laser beam is made incident in the plate-shaped object, by positioning the focal point of the pulsed laser beam within the plate-shaped object and applying the pulsed laser beam along the contour of the through hole to be formed.

### Claim 3 (depends on 2)

The plate-shaped object processing method according to claim 2,
wherein the plate-shaped object is a quartz glass substrate, and the numerical aperture (NA) of the condensing lens of the condenser is set in a range of 0.1 to 0.025.

### Claim 4 (depends on 2)

The plate-shaped object processing method according to claim 2,
wherein the plate-shaped object is a sapphire substrate, and the numerical aperture (NA) of the condensing lens of the condenser is set in a range of 0.1 to 0.035.