# US 9,517,544 B2 · Polishing apparatus and polishing method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,517,544 B2 - Document ID: US9517544B2 - Status: Granted - Kind: B2 - Application number: 14/577,101 - Filed: 2014-12-19 - Published: 2015-04-16 - Granted: 2016-12-13 - Earliest claimed: 2007-12-03 - Assignees: Ebara Corporation - Applicants: Ebara Corporation - Inventors: Tamami Takahashi; Masaya Seki; Hiroaki Kusa; Kenji Yamaguchi; Masayuki Nakanishi - Web page: https://patentgrep.com/patent/US9517544B2 ## CPC - B24B 21/002: {for grinding edges or bevels} - B24B 9/065: {of thin, brittle parts, e.g. semiconductors, wafers} - B24B 21/004: {using abrasive rolled strips} - B24B 21/008: {Machines comprising two or more tools or having several working posts (B24B21/006 takes precedence)} - B24B 21/20: for controlling or adjusting the tracking or the tension of the grinding belt - B24B 27/0076: {grinding machines comprising two or more grinding tools} - B24B 37/042: {operating processes therefor} - B24B 37/30: for single side lapping of plane surfaces - B24B 41/068: {Table-like supports for panels, sheets or the like} - B24B 49/00: Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (B24B33/06, B24B37/005 take precedence; if applicable to other machine tools, B23Q15/00 - B23Q17/00 take precedence) - Y10T 428/24777: Edge feature - B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position. ## Claims ### Claim 1 A polishing method comprising: rotating a substrate by a rotary holding mechanism; polishing a first region in a periphery of the substrate by pressing a polishing tape against the first region; polishing a second region in the periphery of the substrate by pressing the polishing tape against the second region; during said polishing of the second region, cleaning the first region by pressing a cleaning cloth against the first region; and after said polishing of the second region, cleaning the second region by pressing the cleaning cloth against the second region. ### Claim 2 (depends on 1) The polishing method according to claim 1, wherein the polishing tape is pressed against the first region and the second region at different angles. ### Claim 3 (depends on 1) The polishing method according to claim 1, wherein: the first region is a lower slope of the periphery of the substrate; and the second region is an edge surface of the periphery of the substrate. ### Claim 4 A polishing method comprising: rotating a substrate by a rotary holding mechanism; polishing a periphery of the substrate by pressing a polishing tape against the periphery of the substrate; and during said polishing, supplying a cooling liquid having a temperature of at most 10° C. to both the periphery of the substrate and the polishing tape simultaneously, thereby removing a frictional heat from a contact portion between the substrate and the polishing tape. ### Claim 5 (depends on 4) The polishing method according to claim 4, wherein the polishing tape comprises abrasive grains and a resin. ### Claim 6 A polishing method comprising: rotating a substrate by a rotary holding mechanism; supplying a liquid onto the rotating substrate; during said supplying of the liquid onto the rotating substrate, pressing a polishing tape by a first polishing head against a periphery of the substrate so as to polish the periphery; and during said supplying of the liquid onto the rotating substrate, keeping a second polishing head, that does not perform polishing, away from the substrate such that the liquid does not bounce back to the substrate. ### Claim 7 (depends on 6) The polishing method according to claim 6, wherein a distance between the substrate and the second polishing head is determined based on a rotational speed of the substrate. ### Claim 8 A polishing method comprising: rotating a substrate by a rotary holding mechanism; supplying a liquid onto the rotating substrate; during said supplying of the liquid onto the rotating substrate, pressing a polishing tape by a first polishing head against a periphery of the substrate so as to polish the periphery; and during said supplying of the liquid onto the rotating substrate, keeping a second polishing head, that does not perform polishing, inclined at such an angle that the liquid does not bounce back to the substrate. ### Claim 9 (depends on 8) The polishing method according to claim 8, wherein the angle of the second polishing head is determined based on a rotational speed of the substrate. ### Claim 10 (depends on 8) The polishing method according to claim 8, further comprising: moving the second polishing head toward the rotating substrate while keeping the angle thereof; and causing the second polishing head to press a polishing tape against the periphery of the substrate.