# US 9,517,520 B2 · Apparatus of mounting and removing component, method of mounting component and method of removing component > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,517,520 B2 - Document ID: US9517520B2 - Status: Granted - Kind: B2 - Application number: 13/754,351 - Filed: 2013-01-30 - Published: 2013-10-31 - Granted: 2016-12-13 - Earliest claimed: 2012-04-27 - Assignees: Fujitsu Limited - Applicants: Fujitsu Limited - Inventors: Yasuyuki Kusakabe; Tooru Harada - Web page: https://patentgrep.com/patent/US9517520B2 ## CPC - B23K 1/005: Soldering by means of radiant energy - B23K 1/0056: {soldering by means of beams, e.g. lasers, electron beams [EB]} - B23K 1/018: Unsoldering; Removal of melted solder or other residues - H10W 72/072: {of bump connectors} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An apparatus for mounting and removing a component includes: a light source configured to radiate light toward a component supported by solder; a light sensor configured to sense displacement of the component; and a member mounted on the component, the member including a hole in a portion to be irradiated with the light of the light source. ## Claims ### Claim 1 An apparatus of mounting and removing a component comprising: a light source configured to radiate light toward a component supported by solder; a light sensor configured to sense displacement of the component; and a member mounted on the component on a first surface of the member, the member including a recess having a bottom in the member on a second surface of the member opposite to the first surface and being irradiated with the light of the light source, a part of the first surface which is located at a position corresponding to the bottom of the recess, being in contact with the component, wherein an opening of the recess faces the light source such that the light enters from the opening and irradiates the bottom of the recess. ### Claim 2 (depends on 1) The apparatus according to claim 1, wherein the light sensor senses the displacement of the component when the solder is melted by light. ### Claim 3 (depends on 1) The apparatus according to claim 1, wherein a whole of the first surface of the member is in contact with an upper surface of the component on an opposite side to the solder. ### Claim 4 (depends on 1) The apparatus according to claim 1, wherein the recess has such a size as to encompass a range to be irradiated with the light of the light source. ### Claim 5 (depends on 1) The apparatus according to claim 1, wherein at least one of a position of the recess, a dimension of the recess and a cross-sectional shape of the recess, is set so that an intensity of scattered light that scatters from the recess and is incident on the light sensor, is adjusted to be less than a value. ### Claim 6 (depends on 5) The apparatus according to claim 5, wherein the value is an intensity of reflected light from the member that is incident on the light sensor. ### Claim 7 A method of mounting a component comprising: mounting a member on a component to be supported by solder on a first surface of the member, the member including a recess having a bottom in the member on a second surface of the member opposite to the first surface, a part of the first surface which is located at a position corresponding to the bottom of the recess, being in contact with the component; irradiating the recess with a light; sensing melting of the solder with a light sensor configured to sense displacement of the component; and stopping irradiation of the member with the light for which the melting of the solder is sensed, wherein an opening of the recess faces the light source such that the light enters from the opening and irradiates the bottom of the recess. ### Claim 8 (depends on 7) The method according to claim 7 further comprising, sensing the displacement of the component when the solder is melted by light. ### Claim 9 (depends on 7) The method according to claim 7, wherein a whole of the first surface of the member is in contact with an upper surface of the component on an opposite side to the solder. ### Claim 10 (depends on 7) The method according to claim 7, wherein the recess has such a size as to encompass a range to he irradiated with the light of the light source. ### Claim 11 (depends on 7) The method according to claim 7, wherein at least one of a position of the recess, a dimension of the recess and a cross-sectional shape of the recess, is set so that an intensity of scattered light that scatters from the recess and is incident on the light sensor, is adjusted to be less than a value. ### Claim 12 (depends on 7) The method according to claim 7, wherein the value is an intensity of reflected light from the member that is incident on the light sensor. ### Claim 13 A method of removing a component comprising: mounting a member on a component supported by solder on a first surface of the member, the member including a recess having a bottom in the member on a second surface of the member opposite to the first surface, a part of the first surface which is located at a position corresponding to the bottom of the recess, being in contact with the component; irradiating the recess with a light; sensing melting of the solder with a light sensor that senses displacement of the component; and removing the component for which the melting of the solder is sensed, wherein an opening of the recess faces the light source such that the light enters from the opening and irradiates the bottom of the recess. ### Claim 14 (depends on 13) The method according to claim 13 further comprising, sensing the displacement of the component when the solder is melted by light. ### Claim 15 (depends on 13) The method according to claim 13, wherein the recess is provided at a center of a surface of the member. ### Claim 16 (depends on 13) The method according to claim 13, wherein the recess has such a size as to encompass a range to be irradiated with the light of the light source. ### Claim 17 (depends on 13) The method according to claim 13, wherein at least one of a position of the recess, a dimension of the recess and a cross-sectional shape of the recess, is set so that intensity of scattered light that scatters from the recess and is incident on the light sensor, is adjusted to be less than a value. ### Claim 18 (depends on 13) The method according to claim 13, wherein the value is an intensity of reflected light from the member that is incident on the light sensor. ### Claim 19 (depends on 1) The apparatus according to claim 1, wherein the recess is provided at a center of a surface of the member. ### Claim 20 (depends on 7) The method of mounting according to claim 7, wherein the recess is provided at a center of a surface of the member.