Substrate for suspension, and production process thereof
AssigneeDai Nippon Printing Co., Ltd.
InventorsYoichi Miura, Tsuyoshi Yamazaki
Life of this patent
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Abstract
The present invention provides a substrate for suspension that includes a first structural part including a metal supporting substrate, an insulating layer, a wiring layer, and a cover layer, and a second structural part formed so as to extend continuously from the first structural part and has no metal supporting substrate. A position of an edge of an upper surface of the insulating layer coincides with a position of an edge of the lower surface of the cover layer or the position of the edge of the upper surface of the insulating layer is positioned on a side closer to the wiring layer than to the position of the edge of the lower surface of the cover layer at a boundary region between the first structural part and the second structural part.
Claims17
A substrate for suspension comprising a metal supporting substrate, an insulating layer formed on the metal supporting substrate, a wiring layer formed on the insulating layer, and a cover layer formed to cover the wiring layer,
- wherein the substrate for suspension comprises
- a first structural part including the metal supporting substrate, the insulating layer, the wiring layer, and the cover layer, and a second structural part in which at least the insulating layer is continuously formed from the first structural part, in a planer view from a laminate direction of the metal supporting substrate, the insulating layer, the wiring layer and the cover layer, and the second structural part has no metal supporting substrate, and
- wherein the first structural part and the second structural part are adjacent in a longitudinal direction of the wiring layer in a planer view from the laminate direction, and
- at least one of a width from an edge of the wiring layer to an edge of the insulating layer and a width from the edge of the wiring layer to an edge of the cover layer is larger in an area including a boundary between the first structural part and the second structural part than other areas in a planar view from the laminate direction.
A substrate for suspension comprising a metal supporting substrate, an insulating layer formed on the metal supporting substrate, a wiring layer formed on the insulating layer, and a cover layer formed to cover the wiring layer,
- wherein the substrate for suspension comprises
- a first structural part including the metal supporting substrate, the insulating layer, the wiring layer, and the cover layer, and
- a second structural part in which at least the insulating layer is continuously formed from the first structural part in a planer view from a laminate direction of the metal supporting substrate, the insulating layer, the wiring layer and the cover layer, and the second structural part has no metal supporting substrate, and
- wherein the first structural part and the second structural part are adjacent in a longitudinal direction of the wiring layer in a planer view from the laminate direction, and
- an auxiliary wiring layer not connected to an outside is formed between an edge of the wiring layer and an edge of the insulating layer so as to cross the boundary between the first structural part and the second structural part in planar view from the laminate direction.
Dependencies are inferred from the claim text.