Aqueous primer composition for enhanced film formation and method of using the same
AssigneeCytec Industries Inc.
InventorsYiqiang Zhao, Dalip K. Kohli, Gaurang Kunal Shah
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Abstract
A water-based bonding primer composition and a method of applying the same onto a metallic surface prior to adhesive bonding. The bonding primer composition is a water-based dispersion containing water, one or more epoxy resins, one or more curing agents, a silane compound, a low amount of propylene carbonate (PC), and optional additives. The bonding primer composition can form substantially smooth films by spraying, and at the same time, meet environmental regulations and provide high bonding performance.
Claims16
A surface treatment method for treating a metallic surface prior to adhesive bonding comprising:
- applying a water-based primer composition onto a metallic surface to form a curable primer film having a smooth, continuous surface, said water-based primer composition comprising:
- one or more epoxy resins;
- at least one curing agent;
- a silane compound having at least one hydrolyzable group;
- propylene carbonate;
- and
- water,
- wherein the water-based primer composition has a solid content of 10%-25%, and the amount of propylene carbonate is less than 15% by weight based on the total weight of the primer composition.
A bonding method comprising:
- (a) applying a water-based primer composition onto a surface of a metallic substrate to form a curable primer film having a smooth, continuous surface, said water-based primer composition comprising:
- one or more epoxy resins;
- at least one curing agent;
- a silane compound having at least one hydrolyzable group;
- propylene carbonate;
- and
- water,
- wherein the water-based primer composition has a solid content of 10%-25%, and the amount of propylene carbonate is less than 15% by weight based on the total weight of the primer composition;
- (b) adhesively joining the metallic substrate to a second substrate whereby a curable, polymeric adhesive is positioned between the primer film and the second substrate;
- and
- (c) curing the adhesive to form a bonded structure.
Dependencies are inferred from the claim text.