Method for producing bonds

A method for producing an adhesive bond of two substrates, at least one of which is transparent and at least one of which has a surface with a surface energy of not more than 40 mN/m,

• comprising the use of a double-sided pressure-sensitive adhesive product comprising a pressure-sensitive adhesive layer having first and second pressure-sensitive adhesive surfaces,
• wherein the double-sided pressure-sensitive adhesive product is an adhesive transfer tape comprising no more than one pressure-sensitive adhesive layer and does not comprise a carrier material,
• the first pressure-sensitive adhesive surface being lined with a first release system, and the second pressure-sensitive adhesive surface being lined with a second release system,
• wherein the pressure-sensitive adhesive layer has a coatweight from 1 g/m2 to 1000 g/m2 and each of the first and second release systems has a thickness from 20 μm to 150 μm, wherein
• the peel force of the first release system from the first pressure-sensitively adhesive surface, AZK1, is lower than the peel force of the second release system from the second pressure-sensitively adhesive surface, AZK2, and
• the ratio of the bond strength of the fresh bond of the first pressure-sensitive adhesive surface to a surface having a surface energy of not more than 40 mN/m KKfresh to the peel force of the second release system from the second pressure-sensitive adhesive surface, KKfresh:AZK2, is at least 13.5,
• wherein AZK1 is at least 2 cN/cm and the ratio of the peel forces, AZK1:AZK2 is from 1:1.5 to 1:4,
• wherein the method comprises:
• (a) parting the first release system from the first pressure-sensitive adhesive surface, and contacting the first pressure-sensitive adhesive surface with the surface of the first of the two substrates to be adhered having a surface energy of not more than 40 mN/m;
• and
• (b) parting the second release system from the second pressure-sensitive adhesive surface and contacting the second pressure-sensitive adhesive surface with the surface of the second of the two substrates to be adhered, wherein the bond strength of the second pressure-sensitive adhesive layer to the surface of the second of the two substrates is less than 35 mN/cm.