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US 9,494,660 B2Granted
Integrated circuit package having a split lead frame
AssigneeAllegro MicroSystems, LLC
InventorsPaul David, William P. Taylor, P. Karl Scheller, Ravi Vig, Andreas P. Friedrich
Life of this patent
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Abstract
A magnetic field sensor includes a lead frame having a plurality of leads, at least two of which have a connection portion and a die attach portion. A semiconductor die is attached to the die attach portion of the at least two leads. In some embodiments, at least one passive component is attached to the die attach portion of at least two leads.
Claims30
A magnetic field sensor comprising:
- a lead frame having a first surface, a second opposing surface, and comprising a plurality of leads, wherein at least two of the plurality of leads are electrically isolated from each other and wherein each of the at least two leads has an elongated connection portion extending from a die attach portion;
- a semiconductor die supporting a magnetic field sensing element and attached to the die attach portions of the at least two leads;
- a passive component coupled between the die attach portions of the at least two leads;
- and
- a non-conductive adhesive between the semiconductor die and the die attach portions of the at least two leads.
2 more elements
A magnetic field sensor comprising:
- a lead frame having a first surface, a second opposing surface, and comprising a plurality of leads, wherein at least two of the plurality of leads are electrically isolated from each other and wherein each of the at least two leads has an elongated connection portion extending from a die attach portion;
- a semiconductor die supporting a magnetic field sensing element and attached to the die attach portions of the at least two leads;
- a passive component coupled between the die attach portions of the at least two leads;
- and
- a non-conductive mold material enclosing the semiconductor die and the die attach portions of the at least two leads, wherein the non-conductive mold material has a diameter of less than approximately 7.0 mm.
2 more elements
A magnetic field sensor comprising:
- a lead frame comprising a plurality of leads, wherein at least two of the plurality of leads are electrically isolated from each other and wherein each of the at least two leads has an elongated connection portion extending from a die attach portion;
- a semiconductor die supporting a magnetic field sensing element and attached to the die attach portions of the at least two leads;
- a non-conductive adhesive between the semiconductor die and the die attach portions of the at least two leads;
- at least one passive component coupled between the die attach portions of the at least two leads;
- a non-conductive mold material enclosing the semiconductor die, the passive component, and the die attach portions of the at least two leads;
- and
- a ferromagnetic mold material secured to a portion of the non-conductive mold material.
4 more elements
Dependencies are inferred from the claim text.