Sensor device and manufacturing method thereof
AssigneeDai Nippon Printing Co., Ltd.
InventorTakamasa Takano
Life of this patent
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Abstract
A sensor device and a manufacturing method thereof are provided in which no resin seal is used when a sensor is packaged, a change in connection relation according to a change in specifications of the control IC and others is facilitated when a control IC is packaged together with the sensor and high reliability is kept. The sensor device of the present invention includes a substrate containing an organic material and being formed a wiring, a sensor arranged on the substrate and electrically connected to the wiring, and a package cap arranged on the substrate and containing an organic material and covering the sensor, and the inside of the package cap is hollow.
Claims17
A sensor device comprising:
- a substrate including a first substrate, a second substrate arranged on the first substrate and a third substrate arranged on the second substrate, the third substrate containing an organic material, and the substrate being formed a wiring;
- an IC arranged on the substrate and connected to the wiring;
- an acceleration sensor electrically connected to the IC;
- the acceleration sensor having a weight part moving according to an external force and a flexible part bending according to a displacement of the weight part and
- a package cap arranged on the third substrate, the package cap containing an organic material, the package cap hermetically sealing the IC and the acceleration sensor,
- wherein an area defined by the package cap and the substrate is hollow, the acceleration sensor is separated from the package cap by the area, and a value of a coefficient of thermal expansion of the third substrate and a value of a coefficient of thermal expansion of the package cap are substantially equal to each other.
A sensor device manufacturing method comprising:
- preparing a substrate including a first substrate, a second substrate arranged on the first substrate and a third substrate arranged on the second substrate, the third substrate containing an organic material and the substrate being formed a wiring;
- arranging an IC and an acceleration sensor on the substrate, the sensor having a weight part moving according to an external force and a flexible part bending according to a displacement of the weight part;
- electrically connecting the wiring, the IC, and the sensor;
- and
- arranging a package cap containing an organic material on the third substrate to cover the IC and the acceleration sensor for hermetically sealing,
- wherein an area defined by the package cap and the substrate is hollow, the acceleration sensor is separated from the package cap by the area, and a value of a coefficient of thermal expansion of the third substrate and a value of a coefficient of thermal expansion of the package cap are substantially equal to each other.
A sensor device comprising:
- a substrate including a first substrate, a second substrate arranged on the first substrate and a third substrate arranged on the second substrate, the third substrate containing an organic material, and the substrate being formed a wiring;
- an IC arranged on the substrate and connected to the wiring;
- an acceleration sensor electrically connected to the IC, the acceleration sensor having a weight part moving according to an external force and a flexible part bending according to a displacement of the weight part;
- and
- a package cap arranged on the third substrate, the package cap containing an organic material and hermetically sealing the IC and the acceleration sensor,
- wherein the sensor device comprises a hollow portion defined by both of the package cap and the substrate, the acceleration sensor is separated from the package cap by the hollow portion, and a value of a coefficient of thermal expansion of the third substrate and a value of a coefficient of thermal expansion of the package cap are substantially equal to each other.
Dependencies are inferred from the claim text.