Method of manufacturing a laminated electronic component

A manufacturing method for a laminated electronic component having a laminate constituted by multiple insulator layers as well as internal electrodes formed between these layers, said manufacturing method comprising:

• step (i) to form a resist film on a conductive base plate;
• step (ii) to form an opening of specified pattern in the resist film by photolithography, wherein the opening of specified pattern is formed such that a width of the opening increases continuously or in stages in a direction away from the base plate;
• step (iii) to form a conductor pattern by filling a conductor in the opening, by plating, to a level lower than a height of the resist film that defines the opening;
• step (iv) to remove the resist film;
• step (v) to press the conductor pattern together with an insulation sheet being a precursor to the insulator layer, in order to transfer the conductor pattern from the conductive base plate onto the insulation sheet;
• step (vi) to repeat steps (i) to (v) to produce multiple pattern-transferred insulation sheets;
• and
• step (vii) to laminate the pattern-transferred insulation sheets.