Developer container, developing device, process cartridge, method for forming developer container, method for forming developing device, and method for forming process cartridge

A developer container comprising:

• a frame configured to store developer;
• a conductive member provided on the frame;
• and
• a conductive contact member formed of resin on an outer side of the frame so as to be in contact with a part of the conductive member that is exposed from the frame to establish conduction,
• wherein the conductive member includes a through hole at a portion to be in contact with the contact member, and
• wherein the contact member includes a penetrating portion formed through the through hole.

A method for forming a developer container including:

• a frame configured to store developer;
• a conductive member provided on the frame;
• and
• a conductive contact member formed of resin on an outer side of the frame so as to be in contact with a part of the conductive member that is exposed from the frame to establish conduction, the method comprising:
• a molding step of molding the frame and the contact member by injecting resin between molds sandwiching the conductive member,
• wherein the molding step includes:
• molding the frame with first resin;
• and
• molding, after molding the frame, the contact member by injecting second resin different from the first resin into a space formed by moving a movable portion of one of the molds that holds the portion of the conductive member that is exposed outward from the frame, away from the conductive member, and
• wherein, through the molding step, a protruding portion protruding toward the conductive member is molded at a portion of the contact member that is to be in contact with the conductive member, and an engaging portion configured to engage with the protruding portion is molded by the protruding portion on the conductive member.

A method for forming a developer container including:

• a frame configured to store developer;
• a conductive member provided on the frame;
• and
• a conductive contact member formed of resin on an outer side of the frame so as to be in contact with a part of the conductive member that is exposed from the frame to establish conduction, the method comprising:
• a molding step of molding the frame and the contact member by injecting resin between molds sandwiching the conductive member,
• wherein the molding step includes:
• molding the frame with first resin;
• and
• molding, after molding the frame, the contact member by injecting second resin different from the first resin into a space formed by moving a movable portion of one of the molds that holds the portion of the conductive member that is exposed outward from the frame, away from the conductive member, and
• wherein, through the molding step, a penetrating portion is molded at a portion of the contact member that is to be in contact with the conductive member, through a through hole provided at the portion of the conductive member that is exposed from the frame.

A method for forming a developing device including:

• a developer bearing member configured to supply developer to an image bearing member to develop a developer image;
• a frame configured to store developer;
• a conductive member provided on the frame;
• and
• a conductive contact member formed of resin on an outer side of the frame so as to be in contact with a part of the conductive member that is exposed from the frame to establish conduction, the method comprising:
• a molding step of molding the frame and the contact member by injecting resin between molds sandwiching the conductive member,
• wherein the molding step includes:
• molding the frame with first resin;
• and
• molding, after molding the frame, the contact member by injecting second resin different from the first resin into a space formed by moving a movable portion of one of the molds that holds the portion of the conductive member that is exposed outward from the frame, away from the conductive member, and
• wherein, through the molding step, a protruding portion protruding toward the conductive member is molded at a portion of the contact member that is to be in contact with the conductive member, and an engaging portion configured to engage with the protruding portion is molded by the protruding portion on the conductive member.

A method for forming a developing device including:

• a developer bearing member configured to supply developer to an image bearing member to develop a developer image;
• a frame configured to store developer;
• a conductive member provided on the frame;
• and
• a conductive contact member formed of resin on an outer side of the frame so as to be in contact with a part of the conductive member that is exposed from the frame to establish conduction, the method comprising:
• a molding step of molding the frame and the contact member by injecting resin between molds sandwiching the conductive member,
• wherein the molding step includes:
• molding the frame with first resin;
• and
• molding, after molding the frame, the contact member by injecting second resin different from the first resin into a space formed by moving a movable portion of one of the molds that holds the portion of the conductive member that is exposed outward from the frame, away from the conductive member, and
• wherein, through the molding step, a penetrating portion is molded at a portion of the contact member that is to be in contact with the conductive member, through a through hole provided at the portion of the conductive member that is exposed from the frame.

A method for forming a process cartridge including:

• an image bearing member;
• a developer bearing member configured to supply developer to the image bearing member to develop a developer image;
• a frame configured to store developer;
• a conductive member provided on the frame;
• and
• a conductive contact member formed of resin on an outer side of the frame so as to be in contact with a part of the conductive member that is exposed from the frame to establish conduction, the method comprising:
• a molding step of molding the frame and the contact member by injecting resin between molds sandwiching the conductive member,
• wherein the molding step includes:
• molding the frame with first resin;
• and
• molding, after molding the frame, the contact member by injecting second resin different from the first resin into a space formed by moving a movable portion of one of the molds that holds the portion of the conductive member that is exposed outward from the frame, away from the conductive member, and
• wherein, through the molding step, a protruding portion protruding toward the conductive member is molded at a portion of the contact member that is to be in contact with the conductive member, and an engaging portion configured to engage with the protruding portion is molded by the protruding portion on the conductive member.

A method for forming a process cartridge including:

• an image bearing member;
• a developer bearing member configured to supply developer to the image bearing member to develop a developer image;
• a frame configured to store developer;
• a conductive member provided on the frame;
• and
• a conductive contact member formed of resin on an outer side of the frame so as to be in contact with a part of the conductive member that is exposed from the frame to establish conduction, the method comprising:
• a molding step of molding the frame and the contact member by injecting resin between molds sandwiching the conductive member,
• wherein the molding step includes:
• molding the frame with first resin;
• and
• molding, after molding the frame, the contact member by injecting second resin different from the first resin into a space formed by moving a movable portion of one of the molds that holds the portion of the conductive member that is exposed outward from the frame, away from the conductive member, and
• wherein, through the molding step, a penetrating portion is molded at a portion of the contact member that is to be in contact with the conductive member, through a through hole provided at the portion of the conductive member that is exposed from the frame.