Apparatus and method for electronic sample preparation
OwnerJames B. Colvininventor
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Abstract
A method and apparatus for preparing electronic samples for a subsequent treatment, e.g., application of a failure analysis treatment. In one embodiment, an electronic device is mounted on a thermally controlled plate and a select temperature is applied thereto. While maintaining the select temperature applied to the thermally controlled plate, a sample preparation process is performed on the electronic device, such as, e.g., performing polishing, thinning, milling, lapping or extracting one or more semiconductor dies that form the electronic device.
Claims20
A method for preparing electronic devices for analysis, comprising:
- mounting an electronic device on a thermally controlled plate;
- applying a select temperature to the thermally controlled plate, the select temperature being chosen to mitigate non-planar surface conditions associated with one or more dies forming part of the electronic device;
- and
- while maintaining the select temperature applied to the thermally controlled plate, performing a process on the electronic device to prepare the electronic device for analysis, wherein the process to prepare the electronic device for analysis comprises at least one of grinding, polishing, thinning, milling, lapping and extraction of one or more semiconductor dies forming the electronic device.
An apparatus for preparing electronic devices for analysis, comprising:
- a thermally controlled plate adapted for supporting an electronic device thereon;
- a controller for maintaining a select temperature applied to the thermally controlled plate;
- and
- a spindle head for rotating a chuck about a Z-axis that is substantially perpendicular to the thermally controlled plate, the chuck adapted for housing a machining tool configured to perform a process on the electronic device to prepare the electronic device for analysis.
Dependencies are inferred from the claim text.