Methods for assembling electronic devices by internally curing light-sensitive adhesive

An electronic device, comprising:

• a first component;
• a second component;
• a substrate;
• light-cured adhesive interposed between the first and second components, wherein the light-cured adhesive is in contact with the first and second components;
• and
• a plurality of light sources on the substrate, wherein the light-cured adhesive has been cured using the plurality of light sources on the substrate, wherein the first and second components and the substrate remain a part of the electronic device after the light-cured adhesive has been cured.

An electronic device, comprising:

• a first housing structure;
• electronic components within the first housing structure including an ultraviolet light-emitting diode;
• a second housing structure that is connected to the first housing structure and that forms an interior cavity within the electronic device in which the ultraviolet light-emitting diode is located;
• ultraviolet-light-cured epoxy that is contained within the interior cavity and that attaches the first and second housing structures;
• and
• a light pipe that guides light emitted by the ultraviolet light-emitting diode to the ultraviolet-light-cured epoxy.