Method for monitoring cutting processing on a workpiece
AssigneeTRUMF Laser- und Systemtechnik GmbH
InventorsTobias Hagenlocher, Markus Zimmermann
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Abstract
A method for monitoring cutting processing on a workpiece whereby a part of the workpiece is separated from a remainder of the workpiece along a desired cut contour, wherein, after the cutting processing, the following steps are carried out: irradiating the workpiece with a laser beam at a location within the desired cut contour, detecting radiation generated by an interaction between the laser beam and the workpiece, and evaluating the detected radiation to determine whether, during the cutting processing, the part of the workpiece was completely separated from the remainder of the workpiece. The invention also relates to a laser processing machine for carrying out the method.
Claims10
A method for monitoring a cutting process on a workpiece whereby a part of the workpiece is separated from a remainder of the workpiece along a desired cut contour, the method comprising:
- completing a cutting process on the workpiece to separate a part of the workpiece from the remainder of the workpiece along a desired cut contour,
- after the cutting process is completed, irradiating the workpiece with a laser beam at a location within the desired cut contour,
- detecting radiation, if any, generated by an interaction between the laser beam and any remaining portion of the part of the workpiece within the desired cut contour, and
- automatically evaluating the detected radiation to determine whether, during the cutting process, the part of the workpiece was completely separated from the remainder of the workpiece.
Dependencies are inferred from the claim text.