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US 9,448,475 B2Granted
Photoresist composition, compound and process of producing photoresist pattern
AssigneeSumitomo Chemical Company, Limited
InventorsTatsuro Masuyama, Takahiro Yasue, Koji Ichikawa
Life of this patent
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Abstract
A photoresist composition comprising a resin having an acid-labile group, an acid generator, and a compound represented by formula (I0).
Claims4
A photoresist composition comprising
- a resin having an acid-labile group,
- an acid generator, and
- a compound represented by formula (I0):
- wherein R01 represents a R3—CO—O— where R3 represents a C1-C22 hydrocarbon group in which a methylene group has been replaced by an oxygen atom or a carbonyl group or in which a hydrogen atom has been replaced by a hydroxy group, a nitro group or a halogen atom;
- R02 each independently represents a C1-C12 hydrocarbon group, a C1-C6 alkoxy group, a C2-C7 acyl group, a C2-C7 acyloxy group, a C2-C7 alkoxycarbonyl group, a nitro group, a hydroxy group or a halogen atom;
- and
- m represents an integer of 0 to 4.
4 more elements
A compound represented by formula (I):
- wherein R1 represents R3—CO—O— where R3 represents a C1-C22 hydrocarbon group in which a methylene group has been replaced by an oxygen atom or a carbonyl group or in which a hydrogen atom has been replaced by a hydroxy group or a halogen atom;
- R2 each independently represents a C1-C12 hydrocarbon group, a C1-C6 alkoxy group, a C2-C7 acyl group, a C2-C7 acyloxy group, a C2-C7 alkoxycarbonyl group, a nitro group, a hydroxy group or a halogen atom;
- and
- n represents an integer of 0 to 4.
1 more element
Dependencies are inferred from the claim text.