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US 9,443,725 B2Granted
Multi-step system and method for curing a dielectric film
AssigneeTokyo Electron Limited
InventorsJunjun Liu, Eric M. Lee, Dorel I. Toma
Life of this patent
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Abstract
A multi-step system and method for curing a dielectric film in which the system includes a drying system configured to reduce the amount of contaminants, such as moisture, in the dielectric film. The system further includes a curing system coupled to the drying system, and configured to treat the dielectric film with ultraviolet (UV) radiation and infrared (IR) radiation in order to cure the dielectric film.
Claims20
A method of treating a dielectric film, comprising:
- disposing a substrate, having a dielectric film thereon, on a substrate holder in a processing system for treating the dielectric film, the substrate holder having a heating element therein;
- heating the substrate by controlling the heating element;
- exposing the dielectric film to infrared (IR) radiation to facilitate a first treating mechanism within the dielectric film;
- exposing the dielectric film to ultraviolet (UV) radiation to facilitate a second treating mechanism that is different from the first mechanism within the dielectric film;
- and
- treating the dielectric film by varying the delivery of the IR and UV radiation to the dielectric film to facilitate the first and second mechanism at different stages of the treating such that target properties for the dielectric film are achieved.
3 more elements
Dependencies are inferred from the claim text.