# US 9,439,333 B2 · Heat-dissipating EMI/RFI shield > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,439,333 B2 - Document ID: US9439333B2 - Status: Granted - Kind: B2 - Application number: 14/152,555 - Filed: 2014-01-10 - Published: 2015-07-16 - Granted: 2016-09-06 - Earliest claimed: 2013-01-15 - Assignees: Genesis Technology USA, Inc. - Applicants: Genesis Technology USA, Inc. - Inventors: Earl Anthony Daughtry, Jr.; Ronald L. Hodge - Web page: https://patentgrep.com/patent/US9439333B2 ## CPC - H05K 9/0032: {having multiple parts, e.g. frames mating with lids} - H05K 7/2039: {characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)} - H05K 7/20418: {the radiating structures being additional and fastened onto the housing} - H05K 9/0028: {with retainers or specific soldering features} - H05K 13/0465: {by soldering (H05K13/0469 takes precedence)} - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 40/231: {characterised by their places of attachment or cooling paths} - H10W 40/60: Securing means for detachable heating or cooling arrangements, e.g. clamps - H10W 40/611: {Bolts or screws} - Y10T 29/49144: by metal fusion - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A heat-dissipating EMI/RFI shield (100) has a shield base (110), a shield cap (130), and a heat sink (150). The shield base has at least one sidewall (112) which defines an open area (113). At least one mounting leg (114) extends from the sidewall and is affixed to a printed circuit board (200). The shield cap has a collar (136) which defines an opening in the shield cap. The shield cap is configured to be mated to the shield base. The heat sink has a boss (156) extending therefrom. The heat sink is configured to be mated to the shield cap. The boss is configured to protrude at least partially into the opening in the shield cap and to make thermal contact with a selected heat generating component (210) on the printed circuit board. ## Claims ### Claim 1 A heat-dissipating EMI/RFI shield, wherein the heat-dissipating EMI/RFI shield is to be attached to a circuit board having engaging structures and a heat-generating component, the heat-dissipating EMI/RFI shield comprising: a shield base having a plurality of sidewalls which define an open area, each sidewall having at least one engaging structure, and a plurality of legs extending from the sidewalls; a shield cap having a collar and a plurality of flanges, the collar defining an opening in the shield cap and having a plurality of fingers or springs extending therefrom, each flange having at least one leaf extending therefrom, the leaves being configured to mate with engaging structures of the shield base to secure the shield cap to the shield base; a heat sink having a boss extending therefrom, a plurality of heat-dissipating fins extending therefrom, and a plurality of platforms, each platform extending from a side of the heat sink, the boss being configured to protrude at least partially into the opening in the shield cap and to make thermal contact with the heat-generating component, the heat sink being configured to be mated to the shield cap, each platform having at least one aperture therein; and a plurality of engaging components configured to be inserted into the apertures of the platform and into the apertures in the circuit board to attach the heat-dissipating EMI/RFI shield to the circuit board; wherein the plurality of fingers of the collar of the shield cap contact the boss of the heat sink when the heat sink is mated with the shield cap. ### Claim 2 (depends on 1) The heat-dissipating EMI/RFI shield of claim 1 wherein the heat sink has at least one dimension which is different than a corresponding dimension of at least one of the shield cap or the shield base. ### Claim 3 A heat-dissipating EMI/RFI shield, comprising: a shield base having a plurality of sidewalls which define an open area, each sidewall having at least one engaging structure, and a plurality of legs extending from the sidewalls a shield cap having a collar which defines an opening in the shield cap, the shield cap being configured to be mated to the shield base; and a heat sink having a boss extending therefrom, the boss being configured to protrude at least partially into the opening in the shield cap, the heat sink being configured to be mated to the shield cap; wherein the collar of the shield cap has a plurality of fingers which contact the boss of the heat sink when the heat sink is mated with the shield cap. ### Claim 4 (depends on 3) The heat-dissipating EMI/RFI shield of claim 3 wherein the at least one sidewall of the shield base has at least one engaging structure, the engaging structure being configured to secure the shield cap to the shield base. ### Claim 5 (depends on 3) The heat-dissipating EMI/RFI shield of claim 3 wherein the shield base has a plurality of sidewalls which define the open area, at least some of the sidewalls having at least one engaging structure therein which is configured to secure the shield cap to the shield base. ### Claim 6 (depends on 3) The heat-dissipating EMI/RFI shield of claim 3 wherein: the shield cap has at least one flange which has a plurality of leaves extending therefrom; and the at least one sidewall of the shield base has a plurality of engaging structures, the engaging structures being configured to mate with the leaves to secure the shield cap to the shield base. ### Claim 7 (depends on 3) The heat-dissipating EMI/RFI shield of claim 3 wherein: the shield cap has a plurality of flanges, each flange having at least one leaf extending therefrom; the shield base has a plurality of sidewalls, each sidewall having at least one engaging structure configured to mate with the at least one leaf to secure the shield cap to the shield base. ### Claim 8 (depends on 3) The heat-dissipating EMI/RFI shield of claim 3 wherein the heat sink has a plurality of heat dissipating fins extending therefrom. ### Claim 9 (depends on 3) The heat-dissipating EMI/RFI shield of claim 3 wherein the heat-dissipating EMI/RFI shield is to be attached to a circuit board having apertures, and wherein: the heat sink comprises a platform on at least two sides, each platform having at least one aperture; and the heat-dissipating EMI/RFI shield further comprises a plurality of engaging components configured to be inserted into the apertures of the heat sink and into the apertures in the circuit board to attach the heat-dissipating EMI/RFI shield to the circuit board. ### Claim 10 (depends on 3) The heat-dissipating EMI/RFI shield of claim 3 wherein the heat sink has approximately a same area and shape as the shield cap or the shield base. ### Claim 11 (depends on 3) The heat-dissipating EMI/RFI shield of claim 3 wherein the heat sink overhangs at least one of the shield cap or the shield base. ### Claim 12 (depends on 3) The heat-dissipating EMI/RFI shield of claim 3 wherein the heat sink has at least one dimension which is smaller than a corresponding dimension of at least one of the shield cap or the shield base. ### Claim 13 (depends on 3) The heat-dissipating EMI/RFI shield of claim 3 wherein the heat-dissipating EMI/RFI shield is to be attached to a circuit board having a heat-generating component thereon and the boss makes thermal contact with the heat-generating component. ### Claim 14 (depends on 3) The heat-dissipating EMI/RFI shield of claim 3 wherein the heat-dissipating EMI/RFI shield is to be attached to a circuit board having a grounding component and at least one leg of the shield base is soldered to the grounding component. ### Claim 15 (depends on 3) The heat-dissipating EMI/RFI shield of claim 3 wherein the heat-dissipating EMI/RFI shield is to be attached to a circuit board having a plurality of heat-generating components thereon, and wherein the heat sink comprises a plurality of bosses, each boss making thermal contact with a corresponding one of the heat-generating components.