# US 9,439,326 B1 · Electronic components

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- Number: US 9,439,326 B1
- Document ID: US9439326B1
- Status: Granted
- Kind: B1
- Application number: 14/723,805
- Filed: 2015-05-28
- Granted: 2016-09-06
- Earliest claimed: 2015-05-28
- Assignees: Hana Micron Inc.
- Applicants: Jae-Sung Lim; Ju-Hyung Kim
- Inventors: Jae-Sung Lim; Ju-Hyung Kim
- Web page: https://patentgrep.com/patent/US9439326B1

## CPC

- H05K 7/205: {Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB] (details of PCBs relating to heat transfer H05K1/0201)}
- H05K 1/0206: {by printed thermal vias}
- H05K 1/0207: {using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes}
- H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections
- H05K 2201/0154: Polyimide
- H05K 2201/066: Heatsink mounted on the surface of the printed circuit board [PCB]
- H10W 40/228: {the projecting parts being wire-shaped or pin-shaped}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An electronic component may include an integrated circuit device package and a second substrate. The integrated circuit device package may include a first substrate being bent or spread, a heat transfer member disposed in the first substrate, an integrated circuit device being bent or spread, a first pad disposed on one face of the integrated circuit device, and an adhesion member disposed between the integrated circuit device and the first substrate. The second substrate may be bent or spread. The second substrate may include a second pad. The integrated circuit device package may be combined with the second substrate by a thermo compression bonding process in which the heat transfer member may transfer a heat to the second substrate through the first substrate and the first pad may make contact with the second pad.

## Claims

### Claim 1

An electronic component comprising:
an integrated circuit device package including a first substrate being bent or spread, a heat transfer member disposed in the first substrate, an integrated circuit device being bent or spread, a first pad disposed on one face of the integrated circuit device, and an adhesion member disposed between the integrated circuit device and the first substrate; and
a second substrate being bent or spread, the second substrate including a second pad,
wherein the integrated circuit device package is combined with the second substrate by a thermo compression bonding process in which the heat transfer member transfers a heat to the second substrate through the first substrate and the first pad makes contact with the second pad.

### Claim 2 (depends on 1)

The electronic component of claim 1, wherein the first substrate includes a polyimide film, the integrated circuit device has a thickness in a range of about 1.0 μm to about 150 μm, and the adhesion member includes an attach film for a die bonding, or a double-sided tape.

### Claim 3 (depends on 1)

The electronic component of claim 1, wherein the first substrate has a through hole and the heat transfer member is disposed in the through hole.

### Claim 4 (depends on 1)

The electronic component of claim 1, wherein the heat transfer member is buried in the first substrate.

### Claim 5 (depends on 4)

The electronic component of claim 4, wherein the heat transfer member has a bar structure or a rod structure.

### Claim 6 (depends on 1)

The electronic component of claim 1, wherein a plurality of heat transfer members are disposed in the first substrate.

### Claim 7 (depends on 1)

The electronic component of claim 1, wherein the second substrate includes a glass substrate or a flexible printed circuit board.