# US 9,439,301 B2 · Multilayered chip electronic component and board for mounting the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,439,301 B2 - Document ID: US9439301B2 - Status: Granted - Kind: B2 - Application number: 13/902,521 - Filed: 2013-05-24 - Published: 2014-05-01 - Granted: 2016-09-06 - Earliest claimed: 2012-10-26 - Assignees: Samsung Electro-Mechanics Co., Ltd. - Applicants: Samsung Electro-Mechanics Co., Ltd. - Inventors: Byung Jun Jeon; Byoung Hwa Lee; Hyun Hee Gu; Chang Hoon Kim; Young Ghyu Ahn - Web page: https://patentgrep.com/patent/US9439301B2 ## CPC - H05K 3/3442: {having edge contacts, e.g. leadless chip capacitors, chip carriers} - H01G 2/065: {for surface mounting, e.g. chip capacitors} - H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor - H05K 2201/10636: Leadless chip, e.g. chip capacitor or resistor - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract There is provided a multilayered chip electronic component including: a ceramic body including internal electrodes and dielectric layers; external electrodes covering both end surfaces of the ceramic body in a length direction; first plating layers forming the external electrodes and formed on outer surfaces of the ceramic body; non-conductive layers formed on outer side surfaces of the first plating layers; and second plating layers formed on regions of the first plating layers except for the non-conductive layers. ## Claims ### Claim 1 A multilayered chip electronic component comprising: a ceramic body including internal electrodes and dielectric layers; external electrodes covering both end surfaces of the ceramic body in a length direction; first plating layers forming the external electrodes and formed on outer surfaces of the ceramic body; non-conductive layers formed on outer side surfaces of the first plating layers; and second plating layers formed on regions of outer surfaces of the first plating layers except for the non-conductive layers, wherein the non-conductive layers are formed on the outer side surfaces of the first plating layers except on outer surfaces of the second plating layers. ### Claim 2 (depends on 1) The multilayered chip electronic component of claim 1, wherein at least one end portion of the non-conductive layers in a thickness direction is extended to a portion of at least one of an upper surface and a lower surface of the ceramic body as well as the outer side surface of the first plating layer. ### Claim 3 (depends on 1) The multilayered chip electronic component of claim 1, wherein at least one end portion of the non-conductive layers in a thickness direction is formed in a position higher or lower than that of at least one of an upper surface and a lower surface of the ceramic body in the thickness direction. ### Claim 4 (depends on 1) The multilayered chip electronic component of claim 1, wherein at least one end portion of the non-conductive layers in a thickness direction is formed in a position higher or lower than that of at least one of a lowermost internal electrode and an uppermost internal electrode among the internal electrodes formed in the ceramic body, in the thickness direction. ### Claim 5 (depends on 1) The multilayered chip electronic component of claim 1, wherein the non-conductive layers include at least one selected from a group consisting of epoxy, a heat resistant polymer, glass, and a ceramic. ### Claim 6 (depends on 1) The multilayered chip electronic component of claim 1, wherein the second plating layers are only formed in band portions of the external electrodes formed on the outer side surfaces, an upper surface, and a lower surface of the ceramic body except for the end surfaces of the ceramic body. ### Claim 7 (depends on 1) The multilayered chip electronic component of claim 1, wherein the first and second plating layers include at least one of copper (Cu), nickel (Ni), and tin (Sn). ### Claim 8 A board for mounting a multilayered chip electronic component, the board comprising: a multilayered chip electronic component comprising: a ceramic body including internal electrodes and dielectric layers; external electrodes covering both end surfaces of the ceramic body in a length direction; first plating layers forming the external electrodes and formed on outer surfaces of the ceramic body; non-conductive layers formed on outer side surfaces of the first plating layers; and second plating layers formed on regions of outer surfaces of the first plating layers except for the non-conductive layers; electrode pads connected to the second plating layers by soldering fillets; and a printed circuit board having the electrode pads formed thereon, wherein the soldering fillets are formed to respective one ends of the non-conductive layers adjacent to the printed circuit board. ### Claim 9 (depends on 8) The board of claim 8, wherein at least one end portion of the non-conductive layers in a thickness direction is extended to a portion of at least one of an upper surface and a lower surface of the ceramic body as well as the outer side surface of the first plating layer. ### Claim 10 (depends on 8) The board of claim 8, wherein the non-conductive layers includes at least one selected from a group consisting of epoxy, a heat resistant polymer, glass, and a ceramic. ### Claim 11 (depends on 8) The board of claim 8, wherein the second plating layers are only formed in band portions of the external electrodes. ### Claim 12 (depends on 8) The board of claim 8, wherein the first and second plating layers include at least one of copper (Cu), nickel (Ni), and tin (Sn). ### Claim 13 A multilayered chip electronic component comprising: first plating layers formed on side surfaces and an upper surface of a ceramic body having a hexahedral shape; non-conductive layers formed on the side surfaces of the ceramic body; and second plating layers coated on regions of outer surfaces of the first plating layers except for the non-conductive layers, wherein the second plating layers are only formed in band portions of external electrodes formed on the outer side surfaces, an upper surface, and a lower surface of the ceramic body except for the end surfaces of the ceramic body. ### Claim 14 (depends on 13) The multilayered chip electronic component of claim 13, wherein at least one end portion of the non-conductive layers in a thickness direction is extended to a portion of at least one of the upper surface and a lower surface of the ceramic body as well as an outer side surface of the first plating layer. ### Claim 15 (depends on 13) The multilayered chip electronic component of claim 13, wherein at least one end portion of the non-conductive layers in a thickness direction is formed in a position higher or lower than that of at least one of the upper surface and a lower surface of the ceramic body, in the thickness direction. ### Claim 16 (depends on 13) The multilayered chip electronic component of claim 13, wherein at least one end portion of the non-conductive layers in a thickness direction is formed in a position higher or lower than that of at least one of a lowermost internal electrode and an uppermost internal electrode among the internal electrodes formed in the ceramic body, in the thickness direction. ### Claim 17 (depends on 13) The multilayered chip electronic component of claim 13, wherein the non-conductive layers include at least one selected from a group consisting of epoxy, a heat resistant polymer, glass, and a ceramic. ### Claim 18 (depends on 13) The multilayered chip electronic component of claim 13, wherein the first and second plating layers include at least one of nickel (Ni) and tin (Sn). ### Claim 19 (depends on 13) A board for mounting a multilayered chip electronic component, the board comprising: the multilayered chip electronic component of claim 13; electrode pads connected to the second plating layers by soldering fillets; and a printed circuit board having the electrode pads formed thereon, wherein the soldering fillets are formed to respective one ends of the non-conductive layers adjacent to the printed circuit board. ### Claim 20 (depends on 1) The multilayered chip electronic component of claim 1, wherein the non-conductive layers are formed directly on the outer side surfaces of the first plating layers.