# US 9,439,300 B2 · Mounting method of electronic component and electronic component mount body > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,439,300 B2 - Document ID: US9439300B2 - Status: Granted - Kind: B2 - Application number: 14/157,779 - Filed: 2014-01-17 - Published: 2014-08-07 - Granted: 2016-09-06 - Earliest claimed: 2013-02-05 - Assignees: Ricoh Company, Ltd. - Applicants: Yuichi Tanida - Inventors: Yuichi Tanida - Web page: https://patentgrep.com/patent/US9439300B2 ## CPC - H05K 3/3436: {having an array of bottom contacts, e.g. pad grid array or ball grid array components} - H05K 3/303: with surface mounted components (H05K3/32 takes precedence) - H05K 2201/10674: Flip chip - H05K 2203/048: Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor - H05K 2203/166: Alignment or registration; Control of registration - H10W 72/01225: {in solid form, e.g. by using a powder or by stud bumping} - H10W 72/01251: {Changing the shapes of bumps} - H10W 72/072: {of bump connectors} - H10W 72/07254: {changes in dispositions} - H10W 72/241: {Dispositions, e.g. layouts} - H10W 72/244: {relative to underlying supporting features, e.g. bond pads, RDLs or vias} - H10W 72/248: {Top-view layouts, e.g. mirror arrays} - H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract An electronic component is provided with two or more component terminals. A mount board is provided with two or more board terminals. The board terminal is provided with an inclined portion on a surface of the board terminal, the inclined portion being the wider as closer to a base end side toward a peripheral edge. A position of the component terminal is offset in relation to a position of the corresponding board terminal. A position of the other component terminal is offset in the opposite side to the direction of the offset in relation to a position of the corresponding board terminal. The component terminal makes contact with the inclined portion of the board terminal to bond the component terminal and the board terminal. ## Claims ### Claim 1 A mounting method of an electronic component in which the electronic component is mounted on a mount board by flip-chip bonding, comprising the steps of: providing at least two of component terminals for the electronic component; providing at least two of board terminals for the mount board; and providing an inclined portion on a surface of the board terminal, the inclined portion being wider as closer to a base end side toward a peripheral edge thereof, wherein in a case where a position of at least one of the component terminals is offset along the inclined portion in relation to a position of the corresponding board terminal, and a position of at least one of the component terminals among the other component terminals is offset along the inclined portion in the opposite side to the direction of the offset in relation to a position of the corresponding board terminal, the component terminal makes contact with the inclined portion of the board terminal to bond the component terminal and the board terminal. ### Claim 2 (depends on 1) A mounting method of an electronic component according to claim 1, wherein the component terminal includes a stud bump. ### Claim 3 (depends on 1) A mounting method of an electronic component according to claim 1, wherein the board terminal includes a stud bump. ### Claim 4 (depends on 1) A mounting method of an electronic component according to claim 1, wherein the stud bump includes a flattened tip end portion. ### Claim 5 (depends on 1) A mounting method of an electronic component according to claim 1, wherein the offsets in two directions are defined as an offset group, at least two of the offset groups offset directions of which are different to each other are provided, and at least two of the offset groups include the two offset groups the offset directions of which are perpendicular to each other. ### Claim 6 (depends on 1) A mounting method of an electronic component according to claim 1, wherein the component terminal and the board terminal are arranged along a side of a rectangular board, the offset in the same direction is set to the component terminal and the board terminal arranged along one side among one set of two opposing sides in sides of the rectangular board, and the offset is set in the opposite side to the offset direction in the one side to the component terminal and the board terminal arranged along the other side. ### Claim 7 (depends on 1) A mounting method of an electronic component according to claim 1, wherein the component terminal and the board terminal are arranged along a side of a rectangular board, and the offset is set to the component terminal and the board terminal arranged along at least one of sides of the rectangular board. ### Claim 8 (depends on 1) A mounting method of an electronic component according to claim 1, further comprising the steps of: providing a component electrode for the electronic component for mounting the component terminal; and providing a board electrode for the mount board for mounting the board terminal, wherein the offset is realized by offsetting a position of the component electrode from a position of the corresponding board electrode, by at least one of (i) adjusting the position of the component terminal inside the component electrode, (ii) adjusting a position of the board terminal inside the board electrode, or (iii) a combination of the above, wherein the component terminal and the board terminal are arranged on the component electrode and the board electrode, respectively. ### Claim 9 An electronic component mount body in which the electronic component is mounted on the mount board by performing a mounting method comprising the steps of: providing at least two of component terminals for the electronic component; providing at least two of board terminals for the mount board; and providing an inclined portion on a surface of the board terminal, the inclined portion being wider as closer to a base end side toward a peripheral edge thereof, wherein in a case where a position of at least one of the component terminals is offset along the inclined portion in relation to a position of the corresponding board terminal, and a position of at least one of the component terminals among the other component terminals is offset along the inclined portion in the opposite side to the direction of the offset in relation to a position of the corresponding board terminal, the component terminal makes contact with the inclined portion of the board terminal to bond the component terminal and the board terminal, and wherein at least one of the component terminals is offset in relation to the corresponding board terminal to be bonded thereto, and at least one of the component terminals among the other component terminals is offset in the opposite side to the direction of the offset in relation to the corresponding board terminal to be bonded thereto. ### Claim 10 A manufacturing method of an electronic component mount body in which an electronic component is mounted on a mount board by flip-chip bonding, including mounting the electronic component on the mount board by performing a mounting method comprising: providing at least two of component terminals for the electronic component; providing at least two of board terminals for the mount board; and providing an inclined portion on a surface of the board terminal, the inclined portion being wider as closer to a base end side toward a peripheral edge thereof, wherein in a case where a position of at least one of the component terminals is offset along the inclined portion in relation to a position of the corresponding board terminal, and a position of at least one of the component terminals among the other component terminals is offset along the inclined portion in the opposite side to the direction of the offset in relation to a position of the corresponding board terminal, the component terminal makes contact with the inclined portion of the board terminal to bond the component terminal and the board terminal.