# US 9,439,299 B2 · Low-profile outdoor lighting module with light emitting diodes > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,439,299 B2 - Document ID: US9439299B2 - Status: Granted - Kind: B2 - Application number: 14/229,903 - Filed: 2014-03-29 - Published: 2015-10-01 - Granted: 2016-09-06 - Earliest claimed: 2014-03-29 - Assignees: Bridgelux, Inc. - Applicants: Bridgelux, Inc. - Inventors: Robert Tudhope; R. Scott West - Web page: https://patentgrep.com/patent/US9439299B2 ## CPC - F21V 5/08: producing an asymmetric light distribution - F21K 9/00: Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers - F21K 9/90: Methods of manufacture - F21V 5/10: comprising photoluminescent material - F21V 23/005: {the substrate is supporting also the light source} - H05K 3/32: electrically connecting electric components or wires to printed circuits - F21V 7/05: plane - F21V 13/04: the elements being reflectors and refractors {(for vehicle rear lights F21S43/40)} - F21V 29/70: characterised by passive heat-dissipating elements, e.g. heat-sinks - F21V 31/005: {Sealing arrangements therefor} - F21Y 2105/10: comprising a two-dimensional [2D] array of point-like light-generating elements - F21Y 2115/10: Light-emitting diodes [LED] - H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)} - H05K 1/141: {One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence)} - H05K 1/142: {Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit} - H05K 2201/048: Second PCB mounted on first PCB by inserting in window or holes of the first PCB - H05K 2201/10106: Light emitting diode [LED] - Y02B 20/72: in street lighting - Y10T 29/4913: Assembling to base an electrical component, e.g., capacitor, etc. - F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR - F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED - Y02B: CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A low-profile lighting module with light-emitting diodes (LEDs) has a water-tight seal between a molded-plastic cover and a printed circuit board (PCB). A substrate with the LEDs fits up into an indentation in the lower surface of the PCB. Landing pads on the top of the substrate attach to contact pads in the indentation that are extensions of a conductor of the PCB which is electrically coupled through the landing pads to the LEDs. A lens with a curved optical portion surrounded by a flat lip fits into another indentation on the upper surface of the PCB. A highly reflective sheet is disposed between the planar lower surface of the lens and bottom of the indentation in the upper surface. A double-sided adhesive sheet is disposed under the inside surface of the molded-plastic cover and over both the upper surface of the PCB and the flat lip of the lens. ## Claims ### Claim 1 A device comprising: a light emitting diode (LED) die; a substrate with a top surface and a bottom surface, wherein the LED die is disposed on the top surface of the substrate; a landing pad disposed on the top surface of the substrate; a printed circuit board having a contact pad, a lower surface, a lower indentation in the lower surface, an upper surface, and an upper indentation in the upper surface, wherein the contact pad is disposed in the lower indentation, wherein the substrate fits into the lower indentation such that the contact pad is electrically coupled through the landing pad to the LED die, and wherein the lower surface of the printed circuit board and the bottom surface of the substrate are substantially coplanar; a highly reflective sheet; a lens with a planar lower surface and a lip, wherein the lens fits into the upper indentation, and wherein the highly reflective sheet is disposed between the lower surface of the lens and the upper indentation; a double-sided adhesive sheet; and a cover of molded plastic with an inside surface, wherein the adhesive sheet is disposed under the inside surface of the cover and over both the upper surface of the printed circuit board and the lip of the lens. ### Claim 2 (depends on 1) The device of claim 1, further comprising: a heat sink with an upper surface; and a thermal interface material, wherein the bottom surface of the substrate contacts the thermal interface material, and wherein the upper surface of the heat sink contacts the thermal interface material. ### Claim 3 (depends on 2) The device of claim 2, wherein the lower surface of the printed circuit board contacts the thermal interface material. ### Claim 4 (depends on 1) The device of claim 1, further comprising: drive electronics disposed between the upper surface of the printed circuit board and the inside surface of the cover. ### Claim 5 (depends on 4) The device of claim 4, wherein the drive electronics receive a higher voltage and supply a lower voltage to the LED die. ### Claim 6 (depends on 4) The device of claim 4, wherein the drive electronics supply a regulated constant current to the LED die. ### Claim 7 (depends on 1) The device of claim 1, wherein the highly reflective sheet has a hole that is disposed over the LED die. ### Claim 8 (depends on 1) The device of claim 1, wherein the highly reflective sheet is flame resistant paper. ### Claim 9 (depends on 1) The device of claim 1, wherein the lens has a hollow dome disposed over the LED die. ### Claim 10 A method comprising: mounting a light emitting diode (LED) die on a substrate, wherein the substrate has a top surface and a bottom surface, wherein a landing pad is disposed on the top surface of the substrate; attaching the landing pad to a contact pad disposed on an underside of a lip of a printed circuit board, wherein the printed circuit board has a lower surface, a lower indentation in the lower surface, an upper surface, and an upper indentation in the upper surface, wherein the lip is disposed around a periphery of the lower indentation, and wherein the lower surface of the printed circuit board and the bottom surface of the substrate are substantially coplanar after the landing pad is attached; placing a highly reflective sheet in the upper indentation; placing a lens in the upper indentation over the highly reflective sheet, wherein the lens has a curved optical portion and a flat lip; and attaching an inside surface of a molded-plastic cover both to the upper surface of the printed circuit board and to the flat lip of the lens using a double-sided adhesive sheet. ### Claim 11 (depends on 10) The method of claim 10, wherein the lens has a planar lower surface, and wherein the reflective sheet contacts the planar lower surface and is pressed between the planar lower surface of the lens and the upper indentation. ### Claim 12 (depends on 10) The method of claim 10, further comprising; placing a thermal interface material over an upper surface of a heat sink; and placing the substrate and the printed circuit board over the thermal interface material such that the thermal interface material contacts both the bottom surface of the substrate and the lower surface of the printed circuit board. ### Claim 13 (depends on 10) The method of claim 10, wherein the highly reflective sheet has a hole that is disposed over the LED die. ### Claim 14 (depends on 10) The method of claim 10, wherein the highly reflective sheet is flame resistant paper. ### Claim 15 (depends on 10) The method of claim 10, further comprising: coupling the bottom surface of the substrate to a heat sink through a thermal interface material, wherein the lower surface of the printed circuit board contacts the heat sink. ### Claim 16 (depends on 10) The method of claim 10, further comprising: mounting drive electronics to the upper surface of the printed circuit board, wherein the drive electronics are disposed between the upper surface of the printed circuit board and the inside surface of the molded-plastic cover. ### Claim 17 (depends on 10) The method of claim 10, wherein the drive electronics are electrically coupled to the LED die through the landing pad. ### Claim 18 A device comprising: a light emitting diode (LED) die; a substrate with a top surface and a bottom surface, wherein the LED die and a landing pad are disposed on the top surface of the substrate; a printed circuit board having a lower surface, a lower indentation in the lower surface, an upper surface, and an upper indentation in the upper surface, wherein a contact pad is disposed in the lower indentation, wherein the substrate fits into the lower indentation such that the landing pad contacts the contact pad and such that the lower surface of the printed circuit board and the bottom surface of the substrate are substantially coplanar; a lens with a lower surface and a lip, wherein the lower surface of the lens is disposed in the upper indentation; and means for forming a water-tight seal between the lens and the printed circuit board and for affixing an inside surface of a molded-plastic cover both to the upper surface of the printed circuit board and to the lip of the lens. ### Claim 19 (depends on 18) The device of claim 18, wherein the means instantly forms the water-tight seal between the lens and the printed circuit board. ### Claim 20 (depends on 18) The device of claim 18, wherein the means is a sheet.