# US 9,439,289 B2 · Wiring board and method for manufacturing the same

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- Number: US 9,439,289 B2
- Document ID: US9439289B2
- Status: Granted
- Kind: B2
- Application number: 13/687,016
- Filed: 2012-11-28
- Published: 2013-07-18
- Granted: 2016-09-06
- Earliest claimed: 2012-01-12
- Assignees: Ibiden Co., Ltd.
- Applicants: Ibiden Co., Ltd.
- Inventors: Toshiki Furutani; Yukinobu Mikado; Toyotaka Shimabe; Shinobu Kato
- Web page: https://patentgrep.com/patent/US9439289B2

## CPC

- H05K 1/186: {manufactured by mounting on or connecting to patterned circuits before or during embedding}
- H05K 1/0296: {Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18)}
- H05K 1/111: {Pads for surface mounting, e.g. lay-out}
- H05K 1/116: {Lands, clearance holes or other lay-out details concerning the surrounding of a via}
- H05K 1/185: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
- H05K 3/10: in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K 3/30: Assembling printed circuits with electric components, e.g. with resistors
- H05K 3/306: with lead-in-hole components (H05K3/32 takes precedence)
- H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
- H05K 3/4697: {having cavities, e.g. for mounting components (H05K3/4691 takes precedence)}
- H05K 2201/10636: Leadless chip, e.g. chip capacitor or resistor
- H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers}
- H10W 70/682: {comprising holes having chips therein}
- H10W 72/073: {of die-attach connectors}
- H10W 72/874: {On different surfaces}
- H10W 72/9413: {on encapsulations}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- Y10T 29/49146: with encapsulating, e.g., potting, etc.
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A wiring board includes a substrate which has multiple opening portions and one or more boundary portions separating the opening portions, multiple electronic devices positioned in the opening portions of the substrate, respectively, a conductive pattern formed on a surface of the boundary portion, and an insulation layer formed on the substrate and the conductive pattern on the boundary portion of the substrate such that the insulation layer covers the electronic devices in the opening portions of the substrate.

## Claims

### Claim 1

A wiring board, comprising:
a substrate having an opening structure extending through the substrate such that the opening structure comprises a plurality of opening portions and at least one boundary portion partitioning the opening portions arrayed and penetrating through the substrate;
a through-hole conductor formed in the opening structure such that the through-hole conductor is penetrating through the boundary portion of the opening structure in the substrate;
a plurality of electronic devices positioned in the opening structure such that the plurality of electronic devices is accommodated in the plurality of opening portions of the opening structure, respectively;
a conductive pattern formed on a surface of the boundary portion; and
an insulation layer formed on the substrate such that the insulation layer is covering the conductive pattern on the boundary portion and the plurality of electronic devices in the plurality of opening portions of the opening structure in the substrate,
wherein the conductive pattern on the boundary portion has an opening portion formed in the conductive pattern on the boundary portion, and the through-hole conductor is formed in a position corresponding to the opening portion formed in the conductive pattern on the boundary portion such that the through-hole conductor and the conductive pattern on the boundary portion are electrically insulated from each other.

### Claim 2 (depends on 1)

The wiring board according to claim 1, further comprising an opposing conductive pattern formed on an opposite surface of the boundary portion with respect to the conductive pattern on the surface of the boundary portion.

### Claim 3 (depends on 1)

The wiring board according to claim 1, wherein the boundary portion has a width which is in a range of approximately 0.2 to approximately 2.0 mm.

### Claim 4 (depends on 1)

The wiring board according to claim 1, further comprising a plurality of through-hole conductors formed in the boundary portion such that the through-hole conductors are penetrating through the substrate, wherein at least one of the through-hole conductors is not electrically connected to terminals of the electronic devices.

### Claim 5 (depends on 1)

The wiring board according to claim 1, further comprising a first via conductor formed in the insulation layer such that the first via conductor is electrically connected to the conductive pattern on the boundary portion.

### Claim 6 (depends on 1)

The wiring board according to claim 1, further comprising:
a first via conductor formed in the insulation layer such that the first via conductor is stacked on the through-hole conductor.

### Claim 7 (depends on 6)

The wiring board according to claim 6, further comprising a second via conductor formed in the insulation layer such that the second via conductor is positioned to be connected to an electrode of one of the electronic devices, wherein the electrode of the one of the electronic devices is electrically connected to the through-hole conductor through the first via conductor and the second via conductor.

### Claim 8 (depends on 1)

The wiring board according to claim 1, wherein the boundary portion of the substrate has a substantially cruciform planar shape such that the boundary portion forms the plurality of opening portions consisting of four opening portions, and the conductive pattern on the boundary portion is a substantially cruciform conductive pattern formed on the boundary portion.

### Claim 9 (depends on 1)

The wiring board according to claim 1, wherein the boundary portion of the substrate has a substantially T-shaped planar shape such that the boundary portion forms the plurality of opening portions consisting of three opening portions, and the conductive pattern on the boundary portion is a substantially T-shaped conductive pattern formed on the boundary portion.

### Claim 10 (depends on 1)

The wiring board according to claim 1, wherein the plurality of electronic devices includes a first electronic device and a second electronic device, each of the first electronic device and the second electronic device has a first side electrode on a first side surface and a second side electrode on a second side surface on an opposite side with respect to the first side surface, and the first electronic device and the second electronic device are positioned such that the first and second side electrodes of the first electronic device are arrayed in substantially a straight line with the first and second side electrodes of the second electronic device and that the first side electrode of the first electronic device and the first side electrode of the second electronic device face each other and have substantially a same electric potential.

### Claim 11 (depends on 1)

The wiring board according to claim 1, wherein the plurality of opening portions in the substrate forms spaces with respect to the plurality of electronic devices positioned in the plurality of opening portions, respectively, and the spaces are filled with a resin derived from the insulation layer.

### Claim 12 (depends on 1)

The wiring board according to claim 1, wherein the plurality of opening portions includes at least one opening portion having tapered surfaces defining a space of the at least one opening portion.

### Claim 13 (depends on 1)

The wiring board according to claim 1, wherein the plurality of electronic devices includes a chip capacitor having a dielectric body and an electrode formed on the dielectric body such that the electrode extends from on an upper surface of the dielectric body to a lower surface of the dielectric body through a side surface of the dielectric body.

### Claim 14 (depends on 1)

The wiring board according to claim 1, wherein the plurality of electronic devices includes an inductor.

### Claim 15 (depends on 1)

The wiring board according to claim 1, wherein the substrate is an insulative substrate having a built-in metal sheet built in the insulative substrate.

### Claim 16 (depends on 1)

The wiring board according to claim 1, wherein the conductive pattern on the boundary portion is electrically connected to one of a power-source terminal and a ground terminal of each of the electronic devices, and the through-hole conductor is electrically connected to the other one of the power-source terminal and the ground terminal of each of the electronic devices.

### Claim 17 (depends on 16)

The wiring board according to claim 16, further comprising an opposing conductive pattern formed on an opposite surface of the boundary portion with respect to the conductive pattern on the surface of the boundary portion.

### Claim 18 (depends on 16)

The wiring board according to claim 16, wherein the boundary portion has a width which is in a range of approximately 0.2 to approximately 2.0 mm.

### Claim 19 (depends on 16)

The wiring board according to claim 16, further comprising a plurality of through-hole conductors formed in the boundary portion such that the through-hole conductors are penetrating through the substrate, wherein at least one of the through-hole conductors is not electrically connected to terminals of the electronic devices.

### Claim 20 (depends on 16)

The wiring board according to claim 16, further comprising a first via conductor formed in the insulation layer such that the first via conductor is electrically connected to the conductive pattern on the boundary portion.