# US 9,439,285 B2 · Device mounting board and semiconductor power module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,439,285 B2 - Document ID: US9439285B2 - Status: Granted - Kind: B2 - Application number: 14/092,054 - Filed: 2013-11-27 - Published: 2014-03-27 - Granted: 2016-09-06 - Earliest claimed: 2011-07-29 - Assignees: Panasonic Intellectual Property Management Co., Ltd. - Applicants: Sanyo Electric Co., Ltd. - Inventors: Keishi Kato; Osamu Tabata; Yoshio Okayama; Ryosuke Usui - Web page: https://patentgrep.com/patent/US9439285B2 ## CPC - H05K 1/053: {the metal substrate being covered by an inorganic insulating layer} - H05K 1/0216: {Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215)} - H10W 70/68: Shapes or dispositions thereof - H10W 70/6875: {being on a metallic substrate, e.g. insulated metal substrates [IMS]} - H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)} - H05K 1/0215: {Grounding of printed circuits by connection to external grounding means} - H05K 2201/09972: Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently - H05K 2201/10166: Transistor - H05K 2203/0315: Oxidising metal - H05K 2203/0323: Working metal substrate or core, e.g. by etching, deforming - H10W 72/5473: {multiple bond wires connected to a common bond pad} - H10W 90/00: Package configurations - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract In the upper surface of a metallic substrate, a region near the central part of the metallic substrate is surrounded by a rectangle having dotted sides electrically separate the interior and exterior of the rectangle. Each dot of the sides is formed of a pillared insulating resin that penetrates from the upper surface to the lower surface of the metallic substrate. Oxide films are so formed as to fill in the spaces between adjacent cylinders of insulating resins and the surrounding of the cylinders. That is, a separation layer is formed of the pillared insulating resins and the oxide films that fill up the spaces between the pillared insulating resins as well as their vicinities. ## Claims ### Claim 1 A device mounting board comprising a metallic substrate which has a first face and a second face opposed to the first face, the metallic substrate including: a plurality of through-holes each extending from the first face to the second face; and a metallic oxide region existing entirely between each adjacent two of the plurality of through-holes, for electrically isolating the metallic substrate into at least two metallic regions, wherein the metallic oxide region extends from one edge of the metallic substrate when viewed from a direction perpendicular to the first face. ### Claim 2 (depends on 1) The device mounting board according to claim 1, further comprising: a metallic oxide film covering the first face of the metallic substrate, wherein the metallic oxide film contains a same metallic oxide as that of the metallic oxide region. ### Claim 3 (depends on 1) The device mounting board according to claim 1, wherein the metallic substrate further includes a plurality of insulative resins which fill in the plurality of through-holes. ### Claim 4 (depends on 2) The device mounting board according to claim 2, wherein the metallic substrate further includes a plurality of insulative resins which fill in the plurality of through-holes. ### Claim 5 (depends on 1) The device mounting board according to claim 1, wherein the metallic oxide region has a polygonal ring shape or a curved ring shape when viewed from a direction perpendicular to the first face. ### Claim 6 (depends on 1) The device mounting board according to claim 1, wherein each of the plurality of through-holes has an elliptical opening of which a major axis coincides with a direction along which the plurality of through-holes are arranged. ### Claim 7 (depends on 1) The device mounting board according to claim 1, wherein each of the plurality of through-holes has an elliptical opening of which a major axis is inclined to a direction along which the plurality of through-holes are arranged. ### Claim 8 (depends on 1) The device mounting board according to claim 1, wherein the plurality of through-holes are meanderingly arranged. ### Claim 9 (depends on 1) The device mounting board according to claim 1, wherein the metallic oxide region contains a same metal element as that of the at least two metallic regions. ### Claim 10 A semiconductor power module comprising: a device mounting board which includes a metallic substrate having a first face and a second face opposed to the first face, an insulative film disposed on the first face of the metallic substrate, and a wiring region disposed on the insulative film, wherein the metallic substrate includes a plurality of through-holes each extending from the first face to the second face, and a metallic oxide region existing entirely between each adjacent two of the plurality of through-holes, for electrically isolating the metallic substrate into at least two metallic regions; a power device mounted on one of the at least two metallic regions of the metallic substrate, and a controller mounted on another of the at least two metallic regions of the metallic substrate. ### Claim 11 A device mounting board comprising a metallic substrate which has a first face and a second face opposed to the first face, the metallic substrate including: a plurality of through-holes each extending from the first face to the second face; and a metallic oxide region existing entirely between each adjacent two of the plurality of through-holes, for electrically isolating the metallic substrate into at least two metallic regions; an insulative film disposed on the first face of the metallic substrate; and a wiring region disposed on the insulative film. ### Claim 12 (depends on 11) The device mounting board according to claim 11, further comprising: a metallic oxide film covering the first face of the metallic substrate, wherein the metallic oxide film contains a same metallic oxide as that of the metallic oxide region. ### Claim 13 (depends on 11) The device mounting board according to claim 11, wherein the metallic substrate further includes a plurality of insulative resins which fill in the plurality of through-holes. ### Claim 14 (depends on 12) The device mounting board according to claim 12, wherein the metallic substrate further includes a plurality of insulative resins which fill in the plurality of through-holes. ### Claim 15 (depends on 11) The device mounting board according to claim 11, wherein the metallic oxide region has a polygonal ring shape or a curved ring shape when viewed from a direction perpendicular to the first face. ### Claim 16 (depends on 14) The device mounting board according to claim 14, wherein each of the plurality of through-holes has an elliptical opening of which a major axis coincides with a direction along which the plurality of through-holes are arranged. ### Claim 17 (depends on 11) The device mounting board according to claim 11, wherein each of the plurality of through-holes has an elliptical opening of which a major axis is inclined to a direction along which the plurality of through-holes are arranged. ### Claim 18 (depends on 11) The device mounting board according to claim 11, wherein the plurality of through-holes are meanderingly arranged. ### Claim 19 (depends on 11) The device mounting board according to claim 11, wherein the metallic oxide region contains a same metal element as that of the at least two metallic regions.