# US 9,439,282 B2 · Method for manufacturing printed circuit board

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- Number: US 9,439,282 B2
- Document ID: US9439282B2
- Status: Granted
- Kind: B2
- Application number: 13/949,237
- Filed: 2013-07-24
- Published: 2014-03-27
- Granted: 2016-09-06
- Earliest claimed: 2012-09-26
- Assignees: Zhen Ding Technology Co., Ltd.
- Applicants: Zhen Ding Technology Co., Ltd.
- Inventors: Wen-Hung Hu
- Web page: https://patentgrep.com/patent/US9439282B2

## CPC

- H05K 1/0298: {Multilayer circuits}
- H05K 3/0058: {Laminating printed circuit boards onto other substrates, e.g. metallic substrates (H05K1/0281 takes precedence)}
- H05K 3/4697: {having cavities, e.g. for mounting components (H05K3/4691 takes precedence)}
- H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)
- H10W 70/6525: {for securing the interconnections to the substrate, e.g. to prevent peeling}
- H10W 70/68: Shapes or dispositions thereof
- H05K 1/186: {manufactured by mounting on or connecting to patterned circuits before or during embedding}
- H05K 3/4602: {characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated}
- H05K 2201/09127: PCB or component having an integral separable or breakable part
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A printed circuit board includes a first trace layer, a first dielectric layer, a second trace layer, a second dielectric layer, a third trace layer, a third dielectric layer and a fourth trace layer arranged in that order. A cavity is defined in the printed circuit board running through from the fourth trace layer to the second dielectric layer. Portion of the second dielectric layer is exposed in the cavity. Surfaces of the fourth trace layer combining with the second dielectric layer, and surfaces of the second trace layer combining with the first dielectric layer, are all roughened to increase the strength of adhesion.

## Claims

### Claim 1

A method for manufacturing a printed circuit board, comprising:
providing a core substrate comprising a first dielectric layer, the core substrate having an inner region and a trace region surrounding and connected with the inner region, the first dielectric layer having a first surface and a second surface opposite to the first surface;
forming a first trace layer and a peelable metal layer on the first surface and forming a second trace layer on the second surface in the trace region, the peelable metal layer being formed in the inner region, the peelable metal layer having a smooth surface furthest away from the first surface;
forming a photoresist layer on the smooth surface;
roughening surfaces of the first trace layer and surfaces of the peelable metal layer uncovered by the photoresist layer;
removing the photoresist layer from the smooth surface;
laminating a second dielectric layer on the first trace layer and the peelable metal layer;
forming a third trace layer on a surface of the second dielectric layer furthest away from the first dielectric layer;
roughening surfaces of the third trace layer;
laminating a fourth dielectric layer on the third trace layer and the second dielectric layer;
forming a top trace layer on a surface of the fourth dielectric layer furthest away from the second dielectric layer; and
along a boundary between the inner region and the trace region, defining a slit running through from the first dielectric layer to the second dielectric layer;
separating the peelable metal layer from the second dielectric layer and removing the peelable metal layer and the first dielectric layer surrounded by the slit to form a cavity, the second dielectric layer exposed in the cavity.

### Claim 2 (depends on 1)

The method of claim 1, further comprising defining a plurality of first openings in the second dielectric layer in the cavity, the third trace layer comprises a plurality of first pads, each first pad aligned with and exposed from a corresponding first opening.

### Claim 3 (depends on 2)

The method of claim 2, further comprising forming protection layers on surfaces of the first pads exposed from the first openings.

### Claim 4 (depends on 1)

The method of claim 1, wherein a plated through hole is formed in the first dielectric layer.

### Claim 5 (depends on 4)

The method of claim 4, wherein the core substrate further comprises a first copper layer arranged on the first surface and a second copper layer arranged on the second surface, a method for forming the first trace layer, the second trace layer and the plated through hole comprising:
defining a through hole in the core substrate;
forming a plated metal layer over an inner wall of the through hole, a surface of the first copper layer, and a surface of the second copper layer; and
forming the first trace layer by selectively removing portions of the first copper layer and the plated metal layer in the trace region, and forming the second trace layer by selectively removing portions of the second copper layer and the plated metal layer in the trace region, thereby the first copper layer and the plated metal layer remaining on the first surface in the inner region cooperatively constituting the peelable metal layer.

### Claim 6 (depends on 1)

The method of claim 1, wherein surfaces of the second trace layer are roughened.

### Claim 7 (depends on 1)

The method of claim 1, wherein the top trace layer comprises a plurality of second pads, the method further comprising:
forming a first solder mask on a surface of the top trace layer and exposed surfaces of the fourth dielectric layer, a plurality of second openings defined in the first solder mask, each second pad aligned with and exposed from a corresponding second opening.

### Claim 8 (depends on 7)

The method of claim 7, further comprising forming protection layers on surfaces of the second pads exposed from the second openings.

### Claim 9 (depends on 1)

The method of claim 1, wherein the roughening surfaces of the first trace layer and surfaces of the second trace layer comprises using an etching process.

### Claim 10 (depends on 1)

The method of claim 1, wherein a plurality of blind vias is formed in the fourth dielectric layer, the top trace layer is electrically connected with the third trace layer through the blind vias.

### Claim 11

A method for manufacturing a printed circuit board, comprising:
providing a core substrate comprising a first dielectric layer, the core substrate having an inner region and a trace region surrounding and connected with the inner region, the first dielectric layer having a first surface and a second surface opposite to the first surface;
forming a first trace layer and a peelable metal layer on the first surface and forming a second trace layer on the second surface in the trace region, the peelable metal layer being in the inner region, the peelable metal layer having a smooth surface furthest away from the first surface;
forming a photoresist layer on the smooth surface;
roughening surfaces of the first trace layer, surfaces of the second trace layer, and surfaces of the peelable metal layer uncovered by the photoresist layer;
removing the photoresist layer from the smooth surface;
laminating a second dielectric layer on the first trace layer and the peelable metal layer and laminating a third dielectric layer on the second trace layer;
forming a third trace layer on a surface of the second dielectric layer furthest away from the first dielectric layer and forming a fourth trace layer on a surface of the third dielectric layer furthest away from the first dielectric layer;
roughening surfaces of the third trace layer and surfaces of the fourth trace layer;
laminating a fourth dielectric layer on the third trace layer and the second dielectric layer, and laminating a fifth dielectric layer on the fourth trace layer and the third dielectric layer;
forming a top trace layer on a surface of the fourth dielectric layer furthest away from the second dielectric layer, and forming a bottom trace layer on a surface of the fifth dielectric layer furthest away from the third dielectric layer corresponding to the trace region; and
along a boundary between the inner region and the trace region, defining a slit running through from the fifth dielectric layer to the second dielectric layer;
separating the peelable metal layer from the second dielectric layer and removing the peelable metal layer, the first dielectric layer, the third dielectric layer and the fifth dielectric layer surrounded by the slit to form a cavity, the second dielectric layer exposed in the cavity.

### Claim 12 (depends on 11)

The method of claim 11, further comprising defining a plurality of first openings in the second dielectric layer in the cavity, the third trace layer comprises a plurality of first pads, each first pad aligned with and exposed from a corresponding first opening.

### Claim 13 (depends on 11)

The method of claim 11, wherein the surfaces of the first, second, third, and fourth trace layers are roughened using an etching process.